74AUP2G98DP Model Information

Overview

The 74AUP2G98DP is a low-power dual PCB configurable multiple function gate from Nexperia. It is designed for applications requiring efficient signal processing with minimal power consumption. This model is housed in a TSSOP10 package, which is a plastic thin shrink small outline package with 10 leads and a body width of 3 mm.

Ordering Information

• Type Number: 74AUP2G98DP
• Temperature Range: -40°C to +125°C
• Package: TSSOP10
• Description: Plastic thin shrink small outline package; 10 leads; body width 3 mm

Marking

• Marking Code: a9
• Pin 1 Indicator: Located on the lower left corner of the device, below the marking

Functional Diagram

The functional diagram of the 74AUP2G98DP includes logic symbols and IEC logic symbols, illustrating the dual gate functions.

Pinning Information

Pin Configuration

• 1A: Pin 1
• 1B: Pin 2
• 1C: Pin 3
• 1Y: Pin 9
• 2A: Pin 6
• 2B: Pin 7
• 2C: Pin 8
• 2Y: Pin 4
• GND: Pin 5
• VCC: Pin 10

Pin Description

• 1A, 2A: Data input
• 1B, 2B: Data input
• 1C, 2C: Data input
• 1Y, 2Y: Data output
• GND: Ground (0 V)
• VCC: Supply voltage

Functional Description

The 74AUP2G98DP provides the following functions:

• 2-input MUX with inverted output
• 2-input NAND
• 2-input NOR with one input inverted
• 2-input AND with one input inverted
• 2-input NAND with one input inverted
• 2-input OR with one input inverted
• 2-input NOR
• Buffer
• Inverter

Limiting Values

• Supply Voltage (VCC): -0.5 V to +4.6 V
• Input Clamping Current (IIK): -50 mA (for VI < 0 V)
• Input Voltage (VI): -0.5 V to +4.6 V
• Output Clamping Current (IOK): -50 mA (for VO < 0 V)
• Output Voltage (VO): -0.5 V to +4.6 V (Active mode and Power-down mode)
• Output Current (IO): ±20 mA (for VO = 0 V to VCC)
• Supply Current (ICC): 50 mA
• Ground Current (IGND): -50 mA
• Storage Temperature (Tstg): -65°C to +150°C
• Total Power Dissipation (Ptot): 250 mW (at Tamb = -40°C to +125°C)

Recommended Operating Conditions

• Supply Voltage (VCC): 0.8 V to 3.6 V
• Input Voltage (VI): 0 V to 3.6 V
• Output Voltage (VO): 0 V to VCC (Active mode); 0 V to 3.6 V (Power-down mode)
• Ambient Temperature (Tamb): -40°C to +125°C

Static Characteristics

• High-Level Output Voltage (VOH): Varies with VCC and output current (VCC - 0.1 V to 2.72 V)
• Low-Level Output Voltage (VOL): Varies with VCC and output current (0.1 V to 0.44 V)
• Input Leakage Current (II): ±0.1 μA
• Power-Off Leakage Current (IOFF): ±0.2 μA
• Additional Power-Off Leakage Current (ΔIOFF): 0.5 μA
• Supply Current (ICC): 40 μA
• Additional Supply Current (ΔICC): 40 μA
• Input Capacitance (CI): 1.1 pF
• Output Capacitance (CO): 1.7 pF

Dynamic Characteristics

• Propagation Delay (tpd): Varies with VCC and load capacitance (CL)For CL = 5 pF: 1.9 ns to 23.3 nsFor CL = 10 pF: 2.3 ns to 27.1 nsFor CL = 15 pF: 2.5 ns to 30.6 nsFor CL = 30 pF: 2.9 ns to 38.7 ns

Package Outline

• Package Type: TSSOP10 (SOT552-1)
• Dimensions:A1: 1.1 mmA: 0.25 mmA2: 0.15 mmA3: 0.05 mmbp: 0.95 mmL: 0.80 mmHe: 0.30 mmLp: 0.15 mmw: 0.23 mmv: 0.15 mmc: 3.1 mme: 0.5 mmD(1): 2.9 mmE(2): 5.0 mmZ(1): 0.7 mmθ: 6°

Abbreviations

• CDM: Charged Device Model
• DUT: Device Under Test
• ESD: ElectroStatic Discharge
• HBM: Human Body Model
• PCB: Printed-Circuit Board