SICK, Inc. ARS25-26R32768


- Part Number:
ARS25-26R32768
- Manufacturer:
- Category:
- RoHs:
Non-RoHS Compliant - Datasheet:
ARS25-26R32768_Datesheet - Description:
ABSOLUTE ENCODER
- In stock 0
MB7066-100 Model Information
The MB7066-100 is a high stability resistor chip designed and manufactured by Vishay Sfernice, known for its reliability, stability, homogeneity, reproducibility, and quality. It adheres to strict specifications and is suitable for industrial, professional, and military applications. Here are the key specifications and features of the MB7066-100:
Key Features
- CHP: Standard passivated version for a variety of applications.
- Robust Terminations: Designed to withstand severe thermal shocks.
- Large Ohmic Value Range: From 0.1 Ω to 100 MΩ.
- Tight Tolerance: Up to 0.5%.
- HCHP: Variant for high-frequency applications.
- ESCC Approved: See CHPHR datasheet for details.
- High Temperature Resistance: Up to 245°C (see CHPHT datasheet).
- SMD Wraparound Chip Resistor: Conforms to AEC-Q200 moisture resistance test.
Electrical Specifications
- Model Size: 0603
- Rated Power (Pn): 0.125 W
- Limiting Element Voltage: 50 V
- Max. Overload Voltage: 100 V
- Resistance Range: 0.1 to 25M Ω
- Tolerance: 0.5, 1, 2, 5%
- Temperature Coefficient: 100, 200 ppm/°C
- Unit Weight: 2 mg
Physical Dimensions
- Case Size: 0603
- Dimensions (mm): 1.60 (A) x 0.90 (B) x 0.38 (C) x 0.31 (D) x 0.40 (E)
Packaging
- ESD Packaging: Available in Waffle pack and plastic tape and reel (low conductivity).
- Paper Tapes: Available on request (ESD only).
Mechanical Specifications
- Substrate: Alumina
- Technology: Thick film (ruthenium oxide)
- Protection: 0.5 Ω < R < 100 MΩ: epoxy coating; R ≤ 0.5 Ω: overglaze protection (no epoxy coating)
- Terminations: B (W/A), N (W/A), and F (one face) types for solder reflow assembly; G (W/A) and W (one face) types for wire bonding, gluing, and high-temperature solder reflow.
Climatic Specifications
- Operating Temperature Range: -55°C to +155°C
Performance
- Termination Adhesion: 5N for 10 s
- Resistance to Solder Heat: Immersion 10 s in Sn/Pb 60/40 at +260°C
- Rapid Temperature Change: 5 cycles between -55°C and +155°C
- Climatic Sequence: Dry heat, damp heat, cold, and damp heat cycles
- Humidity (Steady State): 56 days
- Moisture Resistance: AEC-Q200 compliant
- Load Life: 1000 h at rated power
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