Micron MT53E1G32D2FW-046 IT:B LPDDR4/LPDDR4X SDRAM – Complete Technical Datasheet

1. Basic Product Information

2. Core Memory Specifications

2.1 Capacity & Organization

• Total Density: 32 Gigabits (Gb) / 4 Gigabytes (GB)
• Memory Configuration: 1 Gigabit × 32 bits (1G × 32)
• Bank Architecture: 8 internal banks per channel
• Prefetch Architecture: 16n prefetch DDR

2.2 Interface & Performance

• Interface Standard: LPDDR4 / LPDDR4X (JEDEC compliant)Micron Technology
• Data Rate per Pin: 4266 Mbps (MT/s)
• Max Clock Frequency: 2133 MHz (DDR)
• Cycle Time (tCK): 468 ps
• Access Time (tAA): 3.5 ns
• Data Bus Width: 32 bits

2.3 Power Supply

• Core Voltage (VDD/VDD2): 1.06 V – 1.17 V (1.1 V nominal)
• I/O Voltage (VDDQ): Dual-mode support – 1.1 V / 0.6 V (LPDDR4X low-voltage mode)
• Low-Power Features: Self-refresh, partial array refresh, deep power-down mode

2.4 Physical & Packaging

• Package Type: 200-ball Thin Fine-Pitch Ball Grid Array (TFBGA)Micron Technology
• Package Dimensions: 10.0 mm × 14.5 mm × 1.10 mm (L × W × H)Micron Technology
• Ball Pitch: 0.40 mm (SMD compatible)
• Mounting Type: Surface Mount Technology (SMT)
• Standard Packaging: Tape-and-reel (TR)
• Dry Pack Quantity: 1360 unitsMicron Technology
• Tape & Reel Quantity: 2000 unitsMicron Technology

3. Key Functional Features

• High-Speed Operation: Supports LPDDR4X low-voltage signaling for improved power efficiency at high speeds
• Advanced Refresh Management: Automatic self-refresh and temperature-compensated refresh to maintain data integrity
• Reliability: Built-in error correction support and robust industrial-grade design
• Compatibility: Backward-compatible with LPDDR4 host controllersMicron Technology
• Power Efficiency: Optimized for battery-powered and thermally constrained embedded systems

4. Environmental Specifications

• Operating Temperature (TC): -40°C to +95°C
• Storage Temperature: -55°C to +125°C (typical)
• ESD Sensitivity: HBM: Class 2 (2000V), CDM: Class C3 (1000V)

5. Typical Applications

• Industrial Computing: Industrial PCs, edge computing gateways, factory automation controllers
• Automotive Infotainment: Non-automotive-grade in-vehicle infotainment systems
• Embedded Systems: IoT devices, ruggedized tablets, portable medical equipment
• Networking: 5G small cells, routers, and communication modules
• Consumer Electronics: High-performance wearables, smart home hubs

6. Regulatory & Classification

• ECCN: 3A991.a.2
• HTS Code: 8542.32.00.71 (US)
• EU RoHS Directive: 2011/65/EUMicron Technology

7. Ordering Information

• Standard Part Number: MT53E1G32D2FW-046 IT:BMicron Technology
• Tape & Reel Part Number: MT53E1G32D2FW-046 IT:B TR
• Lead Time: Typically 24 weeks (factory standard)