Micron MTFC4GACAJCN-1M WT Comprehensive Datasheet Summary

1. Basic Device Information

• Full Part Number: MTFC4GACAJCN-1M WT
• Device Type: Managed NAND embedded flash memory (e·MMC)
• Capacity: 4GB (32Gbit)
• Memory Architecture: MLC NAND Flash
• Interface Standard: e·MMC 5.0 (JEDEC JESD84-B50)
• Package: 153‑ball VFBGA
• Dimensions: 11.5 mm × 13.0 mm × 1.0 mm
• Marking: JY976
• Temperature Grade: WT (Commercial temperature)
• Document: Rev. F (06/18)
• RoHS Compliant: Yes (green package)

2. Core Features

• Integrated MMC controller + NAND Flash
• Supports HS400, HS200, DDR52, SDR modes
• Data bus width: 1‑bit, 4‑bit, 8‑bit
• Clock frequency: Up to 200 MHz
• Onboard ECC, bad block management, wear leveling
• Supports RPMB (Replay Protected Memory Block)
• Supports boot operations, sleep mode, hardware reset (RST_n)
• Supports multiple partitions, write protection, secure erase/trim
• Cache, packed commands, background operations, FFU
• Dual‑voltage support for wide compatibility

3. Voltage Specifications

• VCC (NAND Core): 2.7 V – 3.6 V
• VCCQ (I/O Interface): 1.65 V – 1.95 V or 2.7 V – 3.6 V
• Ground: VSS / VSSQ (internally connected)

4. Temperature Range

• Operating Temperature: −25 °C to +85 °C
• Storage Temperature: −40 °C to +85 °C

5. Performance Specifications

Sequential Performance (x8 bus, HS400)

Random Performance (4KB, x8 bus)

6. Power Consumption (VCC=3.6V, VCCQ=1.95V, 25°C)

7. Package & Pin Configuration

• Package: 153‑ball VFBGA
• Size: 11.5 × 13.0 × 1.0 mm
• Key Signals:

8. Key Registers Summary

• OCR: Supports 1.65–1.95 V & 2.7–3.6 V ranges
• CID: Manufacturer ID 0x13
• CSD: Defines block length, timing, device size
• ECSD: Rev 0x07; enables HS400, RPMB, partitions, write protection

9. Reliability Features

• Hardware ECC & bad block replacement
• Wear leveling & data integrity
• Power‑failure robust design
• Secure erase / secure trim
• Permanent & temporary write protection

10. Target Applications

• Set‑top boxes (STB)
• Digital TVs, cameras, camcorders
• Embedded industrial systems
• Consumer electronics
• Automotive non‑safety systems