Micron MTFC8GACAENS-K1 AIT Full Specification Summary

1. Basic Information

• Full Part Number: MTFC8GACAENS-K1 AIT
• Device Type: Automotive-Grade e·MMC Managed NAND Flash Memory
• Capacity: 8GB
• Interface Standard: e·MMC 5.0 (JEDEC JESD84‑B50)
• Package: 153‑ball TFBGA (Package Code: NS)
• Dimensions: 11.5 mm × 13.0 mm × 1.2 mm
• Temperature Grade: AIT (Automotive Industrial Temp)
• Operating Temp: −40 °C to +85 °C
• Storage Temp: −40 °C to +85 °C
• Revision: Rev. N (June 2018)
• Compliance: RoHS, Lead‑Free, Automotive Qualified

2. Core Features

• Integrated MMC controller + MLC NAND Flash
• Supports HS400, HS200, DDR52, SDR modes
• Data bus width: 1‑bit / 4‑bit / 8‑bit (host configurable)
• Clock frequency: up to 200 MHz
• Data Strobe (DS) pin for HS400 timing
• Hardware reset (RST_n) support
• On-chip ECC, wear leveling, bad block management
• RPMB (Replay Protected Memory Block)
• Multiple partitions: boot, RPMB, general‑purpose, user, enhanced
• Secure erase, secure trim, sanitize, discard
• High‑Priority Interrupt (HPI), background operations (BKOPS)
• Field Firmware Update (FFU)
• Device health report & lifetime estimation
• Power‑off notification, sleep mode, auto‑standby
• Full backward compatibility with legacy MMC/e·MMC

3. Voltage Specifications

• VCC (NAND Core): 2.7 V – 3.6 V
• VCCQ (I/O Interface): 1.65 V – 1.95 V or 2.7 V – 3.6 V
• VDDIM: Internal regulator node (1 µF cap to GND required)
• Ground: VSS & VSSQ (internally connected)

4. Performance Specifications (8‑bit bus, 25 °C, cache on)

5. Power Consumption (VCC=3.6V, VCCQ=1.95V, 25°C)

6. Package & Pin Definitions

• Package: 153‑ball TFBGA (NS)
• Size: 11.5 × 13.0 × 1.2 mm
• Key Signals:
• Ball pitch: 0.5 mm; Solder ball: φ0.319 mm

7. Key Registers Summary

• OCR: Supports 1.65–1.95 V & 2.7–3.6 V; Ready bit [31]
• CID: Manufacturer ID 0x13; Device name: R1J55A
• CSD: Defines block length, access timing, device size
• ECSD Revision: 0x07 (e·MMC 5.0)
• Cache Size: 0x00000800 (2 MB)
• Sector Count: 0x00E90000 (8GB)

8. Reliability & Safety Features

• Automatic bad block replacement
• Dynamic wear leveling
• Power‑failure robust design
• Permanent / temporary / power‑on write protection
• Secure data removal functions
• Automotive‑grade reliability and quality

9. Target Applications

• Automotive infotainment & navigation
• ADAS, in‑vehicle compute systems
• Telematics, data logger, dashboard
• Industrial embedded systems
• Rugged automotive/industrial storage

10. Ordering & Packaging

• Part Number: MTFC8GACAENS‑K1 AIT
• Package: 153‑ball TFBGA (NS)
• Shipping: Tray
• Marking: 5‑digit alphanumeric code (Micron decoder)