ams OSRAM SFH 2700 FA

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Specifications
Type
Paramete
Type
Paramete
Mounting Type
Surface Mount
Response Time
120ns
Color - Enhanced
-
Viewing Angle
140°
Voltage - DC Reverse (Vr) (Max)
16 V
Grade
-
Wavelength
890nm
Responsivity @ nm
-
Spectral Range
300nm ~ 1100nm
Operating Temperature
-40°C ~ 100°C
Qualification
-
Package / Case
0805 (2012 Metric)
Diode Type
PIN
Active Area
0.35mm²
Current - Dark (Typ)
45pA
Overview

SFH 2700 FA – Complete Datasheet Summary

Silicon PIN Photodiode Chip-LED Package, 700 nm – 1100 nm, Black SMT


1. Device Overview

  • Type: High-speed silicon PIN photodiode in Chip-LED (PLCC-2 style) black epoxy package
  • Part number: SFH 2700 FA (ordering code Q65112A4434)
  • Applications: Industrial automation, light barriers, vision controls, optical encoders, proximity & ambient-light sensing


2. Absolute Maximum Ratings (Ta = 25 °C unless noted)


ParameterSymbolValueUnit
Reverse voltageVR16V
Operating temperatureTop–40 … +100°C
Storage temperatureTstg–40 … +100°C
ESD withstand (HBM, JS-001 Class 2)VESD2kV


3. Electro-Optical Characteristics (25 °C)


ParameterSymbolMinTypMaxUnitCondition
PhotocurrentIP1.331.5µAEe = 0.5 mW/cm², λ = 850 nm, VR = 5 V
Spectral peak sensitivityλS max890nm
Spectral range (10 % resp.)λ10 %7001100nm
Dark currentIR0.0455nAVR = 5 V, E = 0
Open-circuit voltageVO290300mVEe = 0.5 mW/cm², 850 nm
Short-circuit currentISC1.4µAsame irradiation
Rise / fall timetr, tf0.12µsVR = 5 V, RL = 50 Ω, 850 nm
Junction capacitanceCj4.6pFVR = 0 V, f = 1 MHz
Forward voltageVF0.80VIF = 5 mA
Sensitive areaA0.35mm²0.59 mm × 0.59 mm chip
Half-angle of sensitivityφ±70deg50 % relative response


4. Package & Mechanical Data

  • Outline: Chip-LED (PLCC-2 footprint), black epoxy, cathode marking
  • Dimensions: 3.2 mm × 2.8 mm × 1.9 mm max (see drawing)
  • Weight: ≈ 3.8 mg
  • Solder pads: 2-pad SMD, 2.54 mm pitch, 1.0 mm × 1.5 mm pad size (Osram “OHFP2578” land)
  • Reflow profile: MSL-3, JEDEC J-STD-020E Pb-free, peak 245 °C, 260 °C max


5. Spectral & Directional Characteristics

  • Peak responsivity: 0.55 A/W @ 890 nm
  • Relative response: 70 % @ 800 nm, 50 % @ 950 nm, 10 % @ 700 nm & 1100 nm
  • Lambertian angular response: ±70° half-angle (see curve)


6. Speed & Noise Performance

  • Intrinsic bandwidth: > 40 MHz (RL = 50 Ω, VR = 5 V)
  • Capacitance vs. bias: 4.6 pF @ 0 V → 2 pF @ 10 V (curve provided)
  • Ultra-low dark current: < 50 pA typ @ 25 °C (enables high-impedance TIA designs)


7. Recommended Land Pattern & Reflow

  • PCB pads: 1.5 mm × 1.0 mm each, 2.54 mm centre-to-centre, solder-mask defined
  • Stencil: 0.125 mm thick, 80 % pad area, avoid solder-ball formation
  • Thermal vias: optional under-body heat-sink pad not required (plastic package)


8. Packing & Shipping


DescriptionValue
Standard reel180 mm Ø, 8 mm tape width, 3 000 pcs/reel
Leader / trailer400 mm / 160 mm min (IEC 60286-3)
Barcode labelOSRAM BPL format (RoHS, lot, date-code, bin)
Dry-packMSL-3: dry-bag + HIC + desiccant, 12-month shelf life


9. Typical Application Circuits

  • Trans-impedance amplifier: 10 MΩ gain, 2 pF feedback, 0.1 – 1 MHz bandwidth
  • Light-barrier: IR LED 850 nm – 20 mA, SFH 2700 FA biased 5 V, comparator threshold 100 nA
  • Encoder: pair with 890 nm slotted disk, 1 mm gap, 50 kHz counting rate


10. Eye & Product Safety

  • IEC 62471: Exempt group (no photobiological hazard)
  • Chip contains silver-filled epoxy – avoid sulphurous / chloride atmospheres during storage & operation


11. Ordering Information

SFH 2700 FA

  • Ordering code: Q65112A4434
  • MOQ: 3 000 pcs/reel (other quantities on request)
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