Diodes Incorporated ZXMP10A17KTC


- Part Number:
ZXMP10A17KTC
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
ZXMP10A17KTC_Datesheet - Description:
MOSFET P-CH 100V 2.4A TO252-2
- In stock 912
ZXMP10A17KTC – Complete Datasheet Summary
100 V P-Channel Enhancement-Mode MOSFET, TO-252 (D-PAK), 3.9 A, 350 mΩ max @ –10 VGS, 2 500-pc Reel
1. Ordering Code Identity
- Base part: ZXMP10A17K
- Suffix “TC”: 13-inch (330 mm) Ø embossed tape & reel, 16 mm pitch, 2 500 pieces/reel
- Package shipped: TO-252 (D-PAK) “Green” (Pb-free, halogen-/antimony-free)
2. Quick Features
- –100 V drain-source rating with only 350 mΩ max RDS(on) @ VGS = –10 V
- –3.9 A continuous drain current (25 °C, steady-state on 50 mm² 2-oz Cu pad)
- Low gate charge (Qg ≈ 10.7 nC @ –10 V) – easy 5 V logic level drive
- Fast switching: td(on) 3 ns, tr 3.5 ns, td(off) 13.4 ns, tf 7.2 ns (typ, 1 A load)
- AEC-Q101 qualified die – suitable for automotive & high-reliability designs
- 100 % matte-tin plated copper leads, MSL-1 unlimited floor life
3. Absolute Maximum Ratings (TJ = 25 °C unless stated)
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Drain-source voltage | VDSS | –100 | V |
| Gate-source voltage | VGS | ±20 | V |
| Continuous drain current (Note 5) | ID | –3.9 | A |
| Continuous drain current (Note 6, TA = 70 °C) | ID | –3.1 | A |
| Pulsed drain current (300 µs, 2 % duty) | IDM | –11.3 | A |
| Continuous source current (body diode) | IS | –8.7 | A |
| Pulsed source current | ISM | –11.3 | A |
| Power dissipation (Note 5) | PD | 4.0 | W |
| Operating & storage junction temp. | TJ, Tstg | –55 … +150 | °C Note 5: Device on 50 mm × 50 mm × 1.6 mm FR-4, 2-oz Cu, still-air steady-state. Note 6: Same board, TA = 70 °C. |
4. Thermal Characteristics
| Parameter | Symbol | Typ | Max | Unit |
|---|---|---|---|---|
| Junction-to-ambient (50 mm 2-oz pad) | RθJA | — | 31 | °C/W |
| Junction-to-ambient (25 mm 1-oz pad) | RθJA | — | 62 | °C/W |
| Junction-to-case (solder-point) | RθJL | — | 2.4 | °C/W |
| Power derating factor (50 mm pad) | — | 32 | — | mW/°C |
5. Electrical Characteristics (TA = 25 °C unless noted)
OFF CHARACTERISTICS
| Parameter | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Drain-source breakdown | ID = –250 µA, VGS = 0 | –100 | — | — | V |
| Zero-gate drain leakage | VDS = –100 V, VGS = 0 | — | — | –0.5 | µA |
| Gate-source leakage | VGS = ±20 V, VDS = 0 | — | — | ±100 | nA |
ON CHARACTERISTICS (pulse test 300 µs, ≤ 2 % duty)
| Parameter | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Gate threshold | VDS = VGS, ID = –250 µA | –2.0 | — | –4.0 | V |
| RDS(on) | VGS = –10 V, ID = –1.4 A | — | 0.28 | 0.35 | Ω |
| RDS(on) | VGS = –6 V, ID = –1.2 A | — | 0.36 | 0.45 | Ω |
| Forward transconductance | VDS = –15 V, ID = –1.4 A | — | 2.8 | — | S |
DYNAMIC & SWITCHING (Note 11)
| Parameter | Typ | Unit |
|---|---|---|
| Input capacitance Ciss | 424 | pF |
| Output capacitance Coss | 36.6 | pF |
| Reverse-transfer Crss | 29.8 | pF |
| Total gate charge Qg (–10 V) | 10.7 | nC |
| Total gate charge Qg (–6 V) | 7.1 | nC |
| Turn-on delay td(on) | 3.0 | ns |
| Rise time tr | 3.5 | ns |
| Turn-off delay td(off) | 13.4 | ns |
| Fall time tf | 7.2 | ns |
BODY-DIODE PARAMETERS
| Parameter | Typ | Max | Unit | |
|---|---|---|---|---|
| Forward voltage VSD | –0.85 | –0.95 | V | IS = –1.7 A |
| Reverse-recovery time trr | 33 | — | ns | |
| Reverse-recovery charge Qrr | 48 | — | nC |
6. Typical Performance Curves
- RDS(on) vs ID: stays ≤ 0.3 Ω up to –3 A at –10 VGS
- Normalized RDS(on): +0.4 %/°C slope (150 °C = 1.4 × 25 °C value)
- Safe Operating Area: 100 V, 11 A pulsed, limited by 150 °C junction
- Transient thermal impedance: ZθJC = 0.3 °C/W for 1 ms single pulse
7. Applications
- 24 V / 48 V industrial and telecom high-side switches
- Motor-driver half-bridge top-side FET
- Automotive relay / lamp / solenoid driver (AEC-Q101)
- DC-DC converter synchronous rectifier (low-side)
- UPS and battery-management disconnect switches
8. PCB & Mounting Guidelines
- Package: TO-252 (D-PAK) – drain tab = drain potential
- Suggested copper: ≥ 50 mm² 2-oz to achieve 31 °C/W RθJA
- Solder profile: standard Pb-free, peak 260 °C, MSL-1 unlimited floor life
- Stencil: 0.125 mm thick, 70 % drain-pad coverage to avoid voids
- Mechanical: 0.54 N·m max screw on heatsink interface
9. Packing Information – “TC” Ree
| Detail | Value |
|---|---|
| Reel diameter | 13 in (330 mm) |
| Carrier tape width | 16 mm |
| Pitch | 4 mm |
| Pieces / reel | 2 500 |
| Dry-pack | not required (MSL-1) |
| Barcode label: Diodes BPL – RoHS, date-code, lot, AEC-Q flag |
10. Related Parts (same die, different packages)
- ZXMP10A17KTA: 7-inch reel (1 k-pc)
- ZXMP10A17K-Q: die-only wafer for module assembly
- All data extracted from Diodes Inc. DS32028 Rev. 5-2 (April 2014) – verify latest revision before production.
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Diodes Incorporated

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