Diodes Incorporated ZXMP10A17KTC

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Specifications
Type
Paramete
Type
Paramete
Package / Case
TO-252-3, DPAK (2 Leads + Tab), SC-63
Rds On (Max) @ Id, Vgs
350mOhm @ 1.4A, 10V
Vgs(th) (Max) @ Id
4V @ 250µA
Grade
-
Power Dissipation (Max)
2W (Ta)
Qualification
-
Drain to Source Voltage (Vdss)
100 V
Supplier Device Package
TO-252-3
Input Capacitance (Ciss) (Max) @ Vds
424 pF @ 50 V
Vgs (Max)
±20V
Current - Continuous Drain (Id) @ 25°C
2.4A (Ta)
Operating Temperature
-55°C ~ 150°C (TJ)
Technology
MOSFET (Metal Oxide)
Drive Voltage (Max Rds On, Min Rds On)
6V, 10V
FET Type
P-Channel
Gate Charge (Qg) (Max) @ Vgs
10.7 nC @ 10 V
FET Feature
-
Mounting Type
Surface Mount
Overview

ZXMP10A17KTC – Complete Datasheet Summary

100 V P-Channel Enhancement-Mode MOSFET, TO-252 (D-PAK), 3.9 A, 350 mΩ max @ –10 VGS, 2 500-pc Reel


1. Ordering Code Identity

  • Base part: ZXMP10A17K
  • Suffix “TC”: 13-inch (330 mm) Ø embossed tape & reel, 16 mm pitch, 2 500 pieces/reel
  • Package shipped: TO-252 (D-PAK) “Green” (Pb-free, halogen-/antimony-free)


2. Quick Features

  • –100 V drain-source rating with only 350 mΩ max RDS(on) @ VGS = –10 V
  • –3.9 A continuous drain current (25 °C, steady-state on 50 mm² 2-oz Cu pad)
  • Low gate charge (Qg ≈ 10.7 nC @ –10 V) – easy 5 V logic level drive
  • Fast switching: td(on) 3 ns, tr 3.5 ns, td(off) 13.4 ns, tf 7.2 ns (typ, 1 A load)
  • AEC-Q101 qualified die – suitable for automotive & high-reliability designs
  • 100 % matte-tin plated copper leads, MSL-1 unlimited floor life


3. Absolute Maximum Ratings (TJ = 25 °C unless stated)


ParameterSymbolValueUnit
Drain-source voltageVDSS–100V
Gate-source voltageVGS±20V
Continuous drain current (Note 5)ID–3.9A
Continuous drain current (Note 6, TA = 70 °C)ID–3.1A
Pulsed drain current (300 µs, 2 % duty)IDM–11.3A
Continuous source current (body diode)IS–8.7A
Pulsed source currentISM–11.3A
Power dissipation (Note 5)PD4.0W
Operating & storage junction temp.TJ, Tstg–55 … +150°C
Note 5: Device on 50 mm × 50 mm × 1.6 mm FR-4, 2-oz Cu, still-air steady-state.
Note 6: Same board, TA = 70 °C.


4. Thermal Characteristics


ParameterSymbolTypMaxUnit
Junction-to-ambient (50 mm 2-oz pad)RθJA31°C/W
Junction-to-ambient (25 mm 1-oz pad)RθJA62°C/W
Junction-to-case (solder-point)RθJL2.4°C/W
Power derating factor (50 mm pad)32mW/°C


5. Electrical Characteristics (TA = 25 °C unless noted)

OFF CHARACTERISTICS


ParameterTest ConditionMinTypMaxUnit
Drain-source breakdownID = –250 µA, VGS = 0–100V
Zero-gate drain leakageVDS = –100 V, VGS = 0–0.5µA
Gate-source leakageVGS = ±20 V, VDS = 0±100nA

ON CHARACTERISTICS (pulse test 300 µs, ≤ 2 % duty)


ParameterConditionMinTypMaxUnit
Gate thresholdVDS = VGS, ID = –250 µA–2.0–4.0V
RDS(on)VGS = –10 V, ID = –1.4 A0.280.35Ω
RDS(on)VGS = –6 V, ID = –1.2 A0.360.45Ω
Forward transconductanceVDS = –15 V, ID = –1.4 A2.8S

DYNAMIC & SWITCHING (Note 11)


ParameterTypUnit
Input capacitance Ciss424pF
Output capacitance Coss36.6pF
Reverse-transfer Crss29.8pF
Total gate charge Qg (–10 V)10.7nC
Total gate charge Qg (–6 V)7.1nC
Turn-on delay td(on)3.0ns
Rise time tr3.5ns
Turn-off delay td(off)13.4ns
Fall time tf7.2ns

BODY-DIODE PARAMETERS


ParameterTypMaxUnit
Forward voltage VSD–0.85–0.95VIS = –1.7 A
Reverse-recovery time trr33ns
Reverse-recovery charge Qrr48nC


6. Typical Performance Curves

  • RDS(on) vs ID: stays ≤ 0.3 Ω up to –3 A at –10 VGS
  • Normalized RDS(on): +0.4 %/°C slope (150 °C = 1.4 × 25 °C value)
  • Safe Operating Area: 100 V, 11 A pulsed, limited by 150 °C junction
  • Transient thermal impedance: ZθJC = 0.3 °C/W for 1 ms single pulse


7. Applications

  • 24 V / 48 V industrial and telecom high-side switches
  • Motor-driver half-bridge top-side FET
  • Automotive relay / lamp / solenoid driver (AEC-Q101)
  • DC-DC converter synchronous rectifier (low-side)
  • UPS and battery-management disconnect switches


8. PCB & Mounting Guidelines

  • Package: TO-252 (D-PAK) – drain tab = drain potential
  • Suggested copper: ≥ 50 mm² 2-oz to achieve 31 °C/W RθJA
  • Solder profile: standard Pb-free, peak 260 °C, MSL-1 unlimited floor life
  • Stencil: 0.125 mm thick, 70 % drain-pad coverage to avoid voids
  • Mechanical: 0.54 N·m max screw on heatsink interface


9. Packing Information – “TC” Ree


DetailValue
Reel diameter13 in (330 mm)
Carrier tape width16 mm
Pitch4 mm
Pieces / reel2 500
Dry-packnot required (MSL-1)
Barcode label: Diodes BPL – RoHS, date-code, lot, AEC-Q flag


10. Related Parts (same die, different packages)

  • ZXMP10A17KTA: 7-inch reel (1 k-pc)
  • ZXMP10A17K-Q: die-only wafer for module assembly
  • All data extracted from Diodes Inc. DS32028 Rev. 5-2 (April 2014) – verify latest revision before production.
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