Bel Fuse Inc. 0ZCH0010FF2E


- Part Number:
0ZCH0010FF2E
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
0ZCH0010FF2E_Datesheet - Description:
Polymeric PTC Resettable Fuse 60V 100 mA Ih Surface Mount 1210 (3225 Metric), Concave
- In stock 321,733
Technical Specification Sheet for 0ZCH0010FF2E Surface Mount PTC
1. Basic Product Information
| Category | Details |
| Manufacturer | Bel Fuse Inc. (a bel group company) |
| Product Series | 0ZCH Series |
| Product Type | Surface Mount Polymer Positive Temperature Coefficient (PPTC) Resettable Fuse |
| Package Size | 1210 Chip (Industry Standard SMD Size) |
| Compliance Standards | - RoHS Compliant (Meets EU Directive 2011/65/EU and amending directive 2015/863) - AEC-Q Compliant (Largely based on internal AEC-Q test plan) - Halogen-Free - Lead-Free |
| Agency Approvals | - TUV Certified (Std. EN/IEC 60738-1-1 and EN/IEC 60730-1, Certificate No. R50102117) - UL Recognized Component (Std. UL1434, File No. E305051) |
| Operating Temperature Range | -40°C to 85°C |
| Moisture Sensitivity Level (MSL) | 2a (Per IPC J-Std-020) |
2. Electrical Characteristics (At 23°C, Still Air)
| Parameter | Symbol | Value | Definition & Notes |
| Hold Current | $$I_$$ | 0.10 A | Maximum current at which the device will not trip; ensures stable operation under normal load. |
| Trip Current | $$I_$$ | 0.25 A | Minimum current at which the device will always trip; triggers protection against overcurrent. |
| Maximum Voltage | $$V_{max$$ | 60 V DC | Maximum voltage the device can withstand at rated current without damage. |
| Maximum Fault Current | $$I_{max$$ | 10 A | Maximum fault current the device can withstand at $$V_{max$$ without catastrophic failure. |
| Typical Power Dissipation (Tripped State) | $$P_$$ | 0.60 W | Power required to maintain the device’s internal temperature at 125°C (tripped state) in 23°C still air. Calculated via $$R = E^2 / $$ (Ohm’s Law derivation). |
| Maximum Time to Trip | - | 1.50 Seconds | Time taken to trip when exposed to 5×$$I_$$ (fault current condition). |
| Initial Resistance (Unsoldered, Min) | $$R_{min$$ | 1.600 Ohms | Minimum resistance of the device at 23°C in its initial un-soldered state. |
| Post-Trip/Post-Soldering Resistance (Max) | $$R_{1max$$ | 15.000 Ohms | Maximum resistance at 23°C, measured 1 hour after initial trip or after soldering to PCB. |
3. Physical & Packaging Specifications
3.1 Mechanical Dimensions
| Dimension | Symbol | Min Value | Max Value | Unit | Reference (View) |
| Overall Length | - | 3.00 | 3.43 | mm | Top View |
| Overall Width | B | 2.35 | 2.80 | mm | Top View |
| Thickness | C | 0.60 | 1.15 | mm | Side View |
| Terminal Diameter (Range) | D | 0.25 | 0.75 | mm | Side View |
| Terminal Protrusion (Range) | E | 0.10 | 0.45 | mm | Side View |
| Marking Code | - | "D" | "D" | - | Top View (Indicates $$I_$$ rating) |
3.2 Recommended Pad Layout (Matte Tin-Plated Copper)
| Pad Parameter | Nominal Value (mm) | Nominal Value (Inch) |
| Pad Width (W) | 2.80 | 0.110 |
| Pad Spacing (S) | 1.00 | 0.039 |
| Pad Length (P) | 2.00 | 0.079 |
| Termination Pad Material | Matte Tin-Plated Copper | - |
3.3 Packaging Details
| Packaging Type | Tape & Reel (Per EIA-481 / IEC-286-3) |
| Reel Diameter | 7 Inches |
| Tape Width | 8 mm |
| Tape Pitch | 4 mm |
| Quantity per Reel | 3,000 Units |
| Part Number for Packaging | Included in base part number (0ZCH0010FF2E) |
4. Operating Principle & Tripped State Behavior
4.1 Basic Working Mechanism
The 0ZCH0010FF2E consists of a polymeric matrix embedded with conductive carbon granules, sandwiched between two metal plates. Under normal conditions (current ≤ $$I_$$, temperature ≤ 100°C), the carbon granules form continuous conductive paths, maintaining low resistance ($$< R_{1max$$).
When an overcurrent or overtemperature event occurs:
- Current exceeds $$I_$$ (or external heat raises temperature to ~125°C), causing the polymer to expand volumetrically.
- Expansion breaks the carbon conductive chains, leading to a sharp resistance increase (tripped state).
- The tripped state limits current to a residual level, keeping the polymer at 125°C.
- When power is removed, the polymer cools and shrinks, re-establishing carbon chains—device resets to low-resistance state (≤ $$R_{1max$$) once cooled to room temperature.
4.2 Tripped Resistance Calculation
Tripped resistance is not constant; it depends on applied voltage and ambient conditions. Using the typical power dissipation ($$P_d = 0.6$$ W), calculate via:$$R_{tripped} = \frac{E^2}{P_d$$
- Example 1: 60V supply → $$R_{tripped} = \frac{60^2}{0.60} = 6,00$$ Ohms
- Example 2: 12V supply → $$R_{tripped} = \frac{12^2}{0.60} = 24$$ Ohms
5. Temperature Derating Characteristics
5.1 Temperature Derating Table (Percent of Rated $$I_$$ and $$I_$$)
| Temperature (°C) | -40 | -20 | 0 | 23 | 30 | 40 | 50 | 60 | 70 | 85 |
| Derating Factor (0ZCH0010FF2E) | 150% | 130% | 116% | 100% (Rated) | 94% | 86% | 78% | 69% | 61% | 48% |
5.2 Key Note
At temperatures above 23°C, the effective hold current ($$I_$$) and trip current ($$I_$$) decrease. For example, at 85°C, the effective $$I_$$ is 0.10 A × 48% = 0.048 A—ensure application load current is below this value to avoid false tripping.
6. Environmental & Mechanical Specifications
6.1 Environmental Test Standards
| Test Type | Standard Reference |
| Temperature Cycling | JESD22 Method JA-104 |
| Biased Humidity | MIL-STD-202 Method 103 |
| Operational Life | MIL-STD-202 Method 108 |
| Solvent Resistance | MIL-STD-202 Method 215 |
| Mechanical Shock | MIL-STD-202 Method 213 |
| Vibration Resistance | MIL-STD-202 Method 204 |
| Soldering Heat Resistance | MIL-STD-202 Method 210 |
| Thermal Shock | MIL-STD-202 Method 107 |
| Solderability | ANSI/J-STD-002 |
| Board Flexure (SMD) | AEC-Q200-005 |
| Terminal Strength | AEC-Q200-006 |
6.2 Cautionary Notes for Environmental Use
- Avoid contact with chemical solvents—prolonged exposure degrades PTC performance.
- Do not use in circuits with large inductance; PTC tripping may generate voltage spikes exceeding $$V_{max$$.
- Suitable for both DC and AC circuits, but peak-to-peak AC voltage must not exceed $$V_{max$$ (60V).
- If potting is required, use non-rigid compounds—rigid potting blocks polymer expansion and prevents tripping.
7. Solder Reflow & Rework Recommendations (Pb-Free Assembly)
7.1 Reflow Profile Parameters
| Profile Feature | Specification |
| Average Ramp-Up Rate (Tsmax to Tp) | ≤ 3°C/second |
| Preheat Stage | - Min Temperature ($$T_{smin$$): 150°C - Max Temperature ($$T_{smax$$): 200°C - Duration (tsmin to tsmax): 60–180 seconds |
| Time Above Liquidus ($$T_L = 217°$$) | 60–150 seconds |
| Peak Temperature ($$T_$$) | 260°C (Classification Temperature) |
| Time Within 5°C of Peak ($$t_$$) | 20–40 seconds |
| Average Ramp-Down Rate | ≤ 6°C/second |
| Total Time (25°C to Peak) | ≤ 8 minutes |
7.2 Rework & Assembly Notes
- Recommended Ref
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