Bel Fuse Inc. 0ZCH0010FF2E

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  • Part Number:

    0ZCH0010FF2E

  • Manufacturer:

    Bel Fuse Inc.

  • Category:

    Surge Protection Devices (SPDs)

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf 0ZCH0010FF2E_Datesheet

  • Description:

    Polymeric PTC Resettable Fuse 60V 100 mA Ih Surface Mount 1210 (3225 Metric), Concave

  • In stock 321,733
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Specifications
Type
Paramete
Type
Paramete
Thickness (Max)
0.045" (1.15mm)
Approval Agency
AEC-Q200, cURus, TUV
Ratings
-
Resistance - Post Trip (R1) (Max)
15 Ohms
Time to Trip
1.5 s
Current - Trip (It)
250 mA
Package / Case
1210 (3225 Metric), Concave
Resistance - Initial (Ri) (Min)
1.6 Ohms
Lead Spacing
-
Height - Seated (Max)
-
Voltage - Max
60V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Current - Hold (Ih) (Max)
100 mA
Current - Max
10 A
Size / Dimension
0.127" L x 0.102" W (3.22mm x 2.58mm)
Type
Polymeric
Overview

Technical Specification Sheet for 0ZCH0010FF2E Surface Mount PTC

1. Basic Product Information


CategoryDetails
ManufacturerBel Fuse Inc. (a bel group company)
Product Series0ZCH Series
Product TypeSurface Mount Polymer Positive Temperature Coefficient (PPTC) Resettable Fuse
Package Size1210 Chip (Industry Standard SMD Size)
Compliance Standards- RoHS Compliant (Meets EU Directive 2011/65/EU and amending directive 2015/863) - AEC-Q Compliant (Largely based on internal AEC-Q test plan) - Halogen-Free - Lead-Free
Agency Approvals- TUV Certified (Std. EN/IEC 60738-1-1 and EN/IEC 60730-1, Certificate No. R50102117) - UL Recognized Component (Std. UL1434, File No. E305051)
Operating Temperature Range-40°C to 85°C
Moisture Sensitivity Level (MSL)2a (Per IPC J-Std-020)

2. Electrical Characteristics (At 23°C, Still Air)


ParameterSymbolValueDefinition & Notes
Hold Current$$I_$$0.10 AMaximum current at which the device will not trip; ensures stable operation under normal load.
Trip Current$$I_$$0.25 AMinimum current at which the device will always trip; triggers protection against overcurrent.
Maximum Voltage$$V_{max$$60 V DCMaximum voltage the device can withstand at rated current without damage.
Maximum Fault Current$$I_{max$$10 AMaximum fault current the device can withstand at $$V_{max$$ without catastrophic failure.
Typical Power Dissipation (Tripped State)$$P_$$0.60 WPower required to maintain the device’s internal temperature at 125°C (tripped state) in 23°C still air. Calculated via $$R = E^2 / $$ (Ohm’s Law derivation).
Maximum Time to Trip-1.50 SecondsTime taken to trip when exposed to 5×$$I_$$ (fault current condition).
Initial Resistance (Unsoldered, Min)$$R_{min$$1.600 OhmsMinimum resistance of the device at 23°C in its initial un-soldered state.
Post-Trip/Post-Soldering Resistance (Max)$$R_{1max$$15.000 OhmsMaximum resistance at 23°C, measured 1 hour after initial trip or after soldering to PCB.

3. Physical & Packaging Specifications

3.1 Mechanical Dimensions


DimensionSymbolMin ValueMax ValueUnitReference (View)
Overall Length-3.003.43mmTop View
Overall WidthB2.352.80mmTop View
ThicknessC0.601.15mmSide View
Terminal Diameter (Range)D0.250.75mmSide View
Terminal Protrusion (Range)E0.100.45mmSide View
Marking Code-"D""D"-Top View (Indicates $$I_$$ rating)

3.2 Recommended Pad Layout (Matte Tin-Plated Copper)


Pad ParameterNominal Value (mm)Nominal Value (Inch)
Pad Width (W)2.800.110
Pad Spacing (S)1.000.039
Pad Length (P)2.000.079
Termination Pad MaterialMatte Tin-Plated Copper-

3.3 Packaging Details


Packaging TypeTape & Reel (Per EIA-481 / IEC-286-3)
Reel Diameter7 Inches
Tape Width8 mm
Tape Pitch4 mm
Quantity per Reel3,000 Units
Part Number for PackagingIncluded in base part number (0ZCH0010FF2E)

4. Operating Principle & Tripped State Behavior

4.1 Basic Working Mechanism

The 0ZCH0010FF2E consists of a polymeric matrix embedded with conductive carbon granules, sandwiched between two metal plates. Under normal conditions (current ≤ $$I_$$, temperature ≤ 100°C), the carbon granules form continuous conductive paths, maintaining low resistance ($$< R_{1max$$).

When an overcurrent or overtemperature event occurs:

  1. Current exceeds $$I_$$ (or external heat raises temperature to ~125°C), causing the polymer to expand volumetrically.
  2. Expansion breaks the carbon conductive chains, leading to a sharp resistance increase (tripped state).
  3. The tripped state limits current to a residual level, keeping the polymer at 125°C.
  4. When power is removed, the polymer cools and shrinks, re-establishing carbon chains—device resets to low-resistance state (≤ $$R_{1max$$) once cooled to room temperature.

4.2 Tripped Resistance Calculation

Tripped resistance is not constant; it depends on applied voltage and ambient conditions. Using the typical power dissipation ($$P_d = 0.6$$ W), calculate via:$$R_{tripped} = \frac{E^2}{P_d$$

  • Example 1: 60V supply → $$R_{tripped} = \frac{60^2}{0.60} = 6,00$$ Ohms
  • Example 2: 12V supply → $$R_{tripped} = \frac{12^2}{0.60} = 24$$ Ohms

5. Temperature Derating Characteristics

5.1 Temperature Derating Table (Percent of Rated $$I_$$ and $$I_$$)


Temperature (°C)-40-20023304050607085
Derating Factor (0ZCH0010FF2E)150%130%116%100% (Rated)94%86%78%69%61%48%

5.2 Key Note

At temperatures above 23°C, the effective hold current ($$I_$$) and trip current ($$I_$$) decrease. For example, at 85°C, the effective $$I_$$ is 0.10 A × 48% = 0.048 A—ensure application load current is below this value to avoid false tripping.

6. Environmental & Mechanical Specifications

6.1 Environmental Test Standards


Test TypeStandard Reference
Temperature CyclingJESD22 Method JA-104
Biased HumidityMIL-STD-202 Method 103
Operational LifeMIL-STD-202 Method 108
Solvent ResistanceMIL-STD-202 Method 215
Mechanical ShockMIL-STD-202 Method 213
Vibration ResistanceMIL-STD-202 Method 204
Soldering Heat ResistanceMIL-STD-202 Method 210
Thermal ShockMIL-STD-202 Method 107
SolderabilityANSI/J-STD-002
Board Flexure (SMD)AEC-Q200-005
Terminal StrengthAEC-Q200-006

6.2 Cautionary Notes for Environmental Use

  1. Avoid contact with chemical solvents—prolonged exposure degrades PTC performance.
  2. Do not use in circuits with large inductance; PTC tripping may generate voltage spikes exceeding $$V_{max$$.
  3. Suitable for both DC and AC circuits, but peak-to-peak AC voltage must not exceed $$V_{max$$ (60V).
  4. If potting is required, use non-rigid compounds—rigid potting blocks polymer expansion and prevents tripping.

7. Solder Reflow & Rework Recommendations (Pb-Free Assembly)

7.1 Reflow Profile Parameters


Profile FeatureSpecification
Average Ramp-Up Rate (Tsmax to Tp)≤ 3°C/second
Preheat Stage- Min Temperature ($$T_{smin$$): 150°C - Max Temperature ($$T_{smax$$): 200°C - Duration (tsmin to tsmax): 60–180 seconds
Time Above Liquidus ($$T_L = 217°$$)60–150 seconds
Peak Temperature ($$T_$$)260°C (Classification Temperature)
Time Within 5°C of Peak ($$t_$$)20–40 seconds
Average Ramp-Down Rate≤ 6°C/second
Total Time (25°C to Peak)≤ 8 minutes

7.2 Rework & Assembly Notes

  1. Recommended Ref


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