742792651 Model Information

General Information

• Order Code: 742792651
• Description: WE-CBF SMT EMI Suppression Ferrite Bead
• Size/Type: 0603
• Business Unit: eiSos
• Status: Valid
• Checked Revision Date: 2020-10-01
• Projection Method: DIN ISO 2768-1m
• General Tolerance: MBH 005.010

Dimensions and Land Pattern

• Dimensions: [mm]
• Recommended Land Pattern: [mm]
• Scale: 20:1

Electrical Properties

• Impedance @ 100 MHz (Z): 600 Ω ±25%
• Maximum Impedance @ 200 MHz: 800 Ω typ.
• Rated Current 1 (△T = 20 K): 800 mA max.
• Rated Current 2 (△T = 40 K): 1000 mA max.
• DC Resistance (RoC @ 20 °C): 0.3 ±0.2 Ω

Certification and Compliance

• RoHS Approval: Compliant [2011/65/EU & 2015/863]
• REACh Approval: Conform or declared [(EC)1907/2006]
• Halogen Free: Conform [JEDEC JS709B] and [EC 61249-2-21]
• Component Qualification: AEC-Q200 Grade 1

Operating Conditions

• Operating Temperature: -55 up to +125 °C
• Storage Conditions (in original packaging): < 40 °C; < 75 % RH
• Moisture Sensitivity Level (MSL): Refer to IPC/ JEDEC J-STD-020E

Packaging Specifications

Tape and Reel

• Tape Dimensions: [mm]
• Reel Dimensions: [mm]
• Carrier Tape Width: 8 mm
• Reel Diameter: Refer to IPC/ JEDEC J-STD-020E
• Reel Width: 16 mm
• Minimum Feeding Direction: 100 mm
• Minimum End Feeding Direction: 400 mm
• Pull-off Force: 0.1 N - 1.0 N

Inner and Outer Carton

• Inner Carton Dimensions: [mm]
• Outer Carton Dimensions: [mm]

Soldering Profile

• Preheat Temperature Min (Ts min): 150 °C
• Preheat Temperature Max (Ts max): 200 °C
• Preheat Time (ts): 60 - 120 seconds
• Ramp-up Rate (TL to TP): 3 °C/second max.
• Liquidous Temperature (TL): 217 °C
• Time above Liquidous Temperature (tL): 60 - 150 seconds
• Peak Package Body Temperature (Tp): ≤ Tc, refer to table below
• Time within 5°C of actual peak temperature (tp): 20 - 30 seconds
• Ramp-down Rate (TP to TL): 6 °C/second max.
• Time 25°C to peak temperature: 8 minutes max.

Package Classification Reflow Temperature (Tc)

• Volume mm³ < 350: 260 °C
• Volume mm³ 350-2000: 260 °C
• Volume mm³ > 2000: 260 °C
• Package Thickness < 1.6 mm: 260 °C
• Package Thickness 1.6 mm - 2.5 mm: 250 °C
• Package Thickness > 2.5 mm: 245 °C

Important Notes

• This component is designed for general electronic equipment. It is not authorized for use in equipment requiring higher safety and reliability standards, such as military, aerospace, medical, etc., unless specifically agreed upon.
• The customer is responsible for evaluating the applicability of the product for their specific application.
• The component must be used within the specified operating conditions to avoid damage or degradation.
• Sufficient reliability evaluation checks must be performed for safety-critical applications.