Samsung CL05A105KO5NNNC

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  • Part Number:

    CL05A105KO5NNNC

  • Manufacturer:

    Samsung

  • Category:

    Ceramic Capacitors

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf CL05A105KO5NNNC_Datesheet

  • Description:

    CAP CER 1UF 16V X5R 0402

  • In stock 2,023,420

    Min: 1Mult: 1

  • Unit Price: $Subtotal: $

" Not available to buy online? Want the lower wholesale price? Please send RFQ, we will respond immediately
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Specifications
Type
Paramete
Type
Paramete
Height - Seated (Max)
-
Package / Case
0402 (1005 Metric)
Ratings
-
Thickness (Max)
0.022" (0.55mm)
Lead Spacing
-
Operating Temperature
-55°C ~ 85°C
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Capacitance
1 µF
Failure Rate
-
Applications
General Purpose
Lead Style
-
Voltage - Rated
16V
Features
-
Mounting Type
Surface Mount, MLCC
Tolerance
±10%
Temperature Coefficient
X5R
Overview

1. Product Identification:

  • Supplier: Samsung Electro-Mechanics
  • Samsung Part Number: CL05A105KO5NNNC
  • Product Description: CAP, 1µF, 16V, ±10%, X5R, 0402

2. Detailed Specifications:

  • Series: Samsung Multi-layer Ceramic Capacitor
  • Size: 0402 (inch code)
  • Dielectric Material: X5R
  • Capacitance: 1µF
  • Tolerance: ±10% Plating (Pb Free)
  • Rated Voltage: 16V
  • Thickness: 0.50 ± 0.05 mm
  • Packaging: Cardboard Type, 7" reel

3. Reliability Test and Judgement Conditions:

  • Capacitance: Within specified tolerance
  • Tan δ (DF): 0.1 max.
  • Insulation Resistance: 10,000Mohm or 100Mohm×C (Whichever is smaller)
  • Rated Voltage Withstanding: 60~120 sec.
  • Appearance: No abnormal exterior appearance (Inspected with Microscope ×10)
  • Temperature Characteristics: X5R (From -55°C to 85°C, Capacitance change should be within ±15%)
  • Adhesive Strength: No peeling shall occur on the terminal electrode (500g·f, for 10±1 sec.)
  • Bending Strength: Capacitance change within ±12.5% Bending to the limit (1mm) with 1.0mm/sec.
  • Solderability: More than 75% of terminal surface should be soldered with SnAg3.0Cu0.5 solder at 245±5°C, 3±0.3sec. (preheating: 80~120°C for 10~30sec.)
  • Resistance to Soldering Heat: Capacitance change within ±7.5% after solder pot test at 270±5°C, 10±1sec.

4. Recommended Soldering Method:

  • Reflow Soldering: Peak Temperature 260+0/-5°C, 10sec. Max.

5. Storage and Handling:

  • Storage Conditions: Temperature 0~40°C, Humidity 0~70% RH
  • Shelf Life: 6 months from the outgoing date of delivery, check solderability before use if stored over 6 months.
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