Samsung Electro-Mechanics CL10B104KB8NNNC

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  • Part Number:

    CL10B104KB8NNNC

  • Manufacturer:

    Samsung Electro-Mechanics

  • Category:

    Aluminum - Polymer Capacitors

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf CL10B104KB8NNNC_Datesheet

  • Description:

    0.1 µF ±10% 50V Ceramic Capacitor X7R 0603 (1608 Metric)

  • In stock 3,879,279

    Min: 1Mult: 1

  • Unit Price: $Subtotal: $

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Specifications
Type
Paramete
Type
Paramete
Operating Temperature
-55°C ~ 125°C
Temperature Coefficient
X7R
Applications
General Purpose
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Voltage - Rated
50V
Mounting Type
Surface Mount, MLCC
Features
-
Failure Rate
-
Ratings
-
Lead Spacing
-
Package / Case
0603 (1608 Metric)
Mfr
Samsung Electro-Mechanics
Thickness (Max)
0.035" (0.90mm)
Lead Style
-
Capacitance
0.1 µF
Height - Seated (Max)
-
Tolerance
±10%
Overview

Product Specification Summary for CL10B104KB8NNNC

Basic Information

  • Supplier: Samsung Electro-Mechanics
  • Samsung Part Number: CL10B104KB8NNNC
  • Product Type: Multi-layer Ceramic Capacitor
  • Description: CAP, 100㎋, 50V, ±10%, X7R, 0603

Part Number Breakdown

  • ① Series: Samsung Multi-layer Ceramic Capacitor
  • ② Size: 0603 (inch code) L : 1.60±0.10㎜ W : 0.80±0.10㎜
  • ③ Dielectric: X7R
  • ④ Capacitance: 100㎋
  • ⑤ Capacitance tolerance: ±10%
  • ⑥ Rated Voltage: 50V
  • ⑦ Thickness: 0.80±0.10㎜
  • ⑧ Inner electrode: Termination
  • ⑨ Product Normal: Plating (Pb Free)
  • ⑩ Special: Reserved for future use
  • ⑪ Packaging: Cardboard Type, 7" Reel

Structure & Dimension

  • Capacitance: 100㎋
  • Termination: Ni
  • Plating: Cu Ni/Sn 100%
  • Dimension (㎜):Length (L): 1.60±0.10Width (W): 0.80±0.10Thickness (T): 0.80±0.10

Reliability Test and Judgement Condition

  • Capacitance: Within specified tolerance 1±10% / 1.0±0.2Vrms
  • Tan δ (DF): 0.05 max.
  • Insulation Resistance: Whichever is smaller, 1,000Mohm or 50Mohm×㎌
  • Appearance: No abnormal exterior appearance under Microscope (×10)
  • Withstanding Voltage: No dielectric breakdown or mechanical breakdown at 250% of the rated voltage
  • Temperature Characteristics: Adhesive Strength: No peeling shall occur on the terminal electrode
  • Bending Strength: Solderability: SnAg3.0Cu0.5 solder is to be soldered newly at 245±5℃, 3±0.3sec. (preheating: 80~120℃ for 10~30sec.)
  • Resistance to Solder pot: 270±5℃, 10±1sec. Soldering Heat
  • Vibration Test: Amplitude: 1.5mm, From 10 to 55 (return: 1min.), 2hours × 3 direction (x, y, z)
  • Moisture Resistance: With rated voltage
  • High Temperature Resistance: Max. operating temperature 1,000+48/-0hrs, whichever is smaller
  • Temperature Cycling: 1 cycle condition: Min. operating temperature → 25℃ → Max. operating temperature → 25℃, 5 cycle test

Recommended Soldering Method

  • Reflow (Reflow Peak Temperature): 260±5℃, 30sec.
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