Samsung Electro-Mechanics CL10B104KB8NNNC


- Part Number:
CL10B104KB8NNNC
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant
- Datasheet:
CL10B104KB8NNNC_Datesheet
- Description:
0.1 µF ±10% 50V Ceramic Capacitor X7R 0603 (1608 Metric)
- In stock 3,879,279
Min: 1Mult: 1
Unit Price: $Subtotal: $
Product Specification Summary for CL10B104KB8NNNC
Basic Information
- Supplier: Samsung Electro-Mechanics
- Samsung Part Number: CL10B104KB8NNNC
- Product Type: Multi-layer Ceramic Capacitor
- Description: CAP, 100㎋, 50V, ±10%, X7R, 0603
Part Number Breakdown
- ① Series: Samsung Multi-layer Ceramic Capacitor
- ② Size: 0603 (inch code) L : 1.60±0.10㎜ W : 0.80±0.10㎜
- ③ Dielectric: X7R
- ④ Capacitance: 100㎋
- ⑤ Capacitance tolerance: ±10%
- ⑥ Rated Voltage: 50V
- ⑦ Thickness: 0.80±0.10㎜
- ⑧ Inner electrode: Termination
- ⑨ Product Normal: Plating (Pb Free)
- ⑩ Special: Reserved for future use
- ⑪ Packaging: Cardboard Type, 7" Reel
Structure & Dimension
- Capacitance: 100㎋
- Termination: Ni
- Plating: Cu Ni/Sn 100%
- Dimension (㎜):Length (L): 1.60±0.10Width (W): 0.80±0.10Thickness (T): 0.80±0.10
Reliability Test and Judgement Condition
- Capacitance: Within specified tolerance 1±10% / 1.0±0.2Vrms
- Tan δ (DF): 0.05 max.
- Insulation Resistance: Whichever is smaller, 1,000Mohm or 50Mohm×㎌
- Appearance: No abnormal exterior appearance under Microscope (×10)
- Withstanding Voltage: No dielectric breakdown or mechanical breakdown at 250% of the rated voltage
- Temperature Characteristics: Adhesive Strength: No peeling shall occur on the terminal electrode
- Bending Strength: Solderability: SnAg3.0Cu0.5 solder is to be soldered newly at 245±5℃, 3±0.3sec. (preheating: 80~120℃ for 10~30sec.)
- Resistance to Solder pot: 270±5℃, 10±1sec. Soldering Heat
- Vibration Test: Amplitude: 1.5mm, From 10 to 55 (return: 1min.), 2hours × 3 direction (x, y, z)
- Moisture Resistance: With rated voltage
- High Temperature Resistance: Max. operating temperature 1,000+48/-0hrs, whichever is smaller
- Temperature Cycling: 1 cycle condition: Min. operating temperature → 25℃ → Max. operating temperature → 25℃, 5 cycle test
Recommended Soldering Method
- Reflow (Reflow Peak Temperature): 260±5℃, 30sec.
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Samsung Electro-Mechanics

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Samsung Electro-Mechanics

Samsung Electro-Mechanics

Samsung Electro-Mechanics

Samsung Electro-Mechanics

Samsung Electro-Mechanics

Samsung Electro-Mechanics

Samsung Electro-Mechanics