RESI EBWK2512F5L00K9


- Part Number:
EBWK2512F5L00K9
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
EBWK2512F5L00K9_Datesheet - Description:
RES 0.005 OHMS 2.5W 1% 2512
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EBWK2512F5L00K9 High-Precision Low-Inductance Alloy Current Sensing Resistor - Specification Sheet
1. Basic Information
| Item | Details |
|---|---|
| Series Name | E BWK2512 High-Precision Low-Inductance Alloy Current Sensing Resistor |
| Part Number | EB WK2512F5L00K9 |
| Manufacturer | C&B Electronics Shenzhen CO., LTD. |
| Brand | RESI |
| Data Sheet No. | E05015 |
| Version | V2 |
| Release Date | 2023/11/16 |
| Core Features | "Trimming Free" technology; High precision; Reliability; Low inductance; Independent R&D and production of core materials, equipment and processes |
2. Electrical Parameters
| Parameter | Specification |
|---|---|
| Resistance | 5mΩ |
| Tolerance | ±1.0% (Coded as "F") |
| Temperature Coefficient of Resistance (TCR) | ±100ppm/℃ (-55℃~+170℃, +20℃ as reference, coded as "K") |
| Rated Power | 2.5W (+70℃) |
| Maximum Operating Current | 22A |
| Operating Temperature Range | -55℃~+170℃ |
| Inductance | <3nH |
| Thermal Resistance* | 31.1℃/W (Refer to the internal thermal resistance between the center of the resistive alloy and the copper electrode; for reference only, as heat dissipation is affected by operating environment, copper bus bars, PCB design, etc.) |
3. Dimensions (Unit: mm)
| Dimension Symbol | Specification |
|---|---|
| L | 6.3±0.3 |
| W | 3.0±0.3 |
| A | 1.3±0.3 |
| T | 0.25±0.15 |
| D | 0.35±0.2 |
| a | 3.9±0.1 |
| b | 3.4±0.2 |
| c | 1.8±0.2 |
| Net Weight | 0.05±0.05g |
4. Packaging Information
4.1 Tape Specifications
| Dimension Symbol | Specification |
|---|---|
| A | 5.50±0.05 |
| B | 3.40±0.2 |
| φD0 | 1.5±0.1 |
| φD1 | 1.5±0.1 |
| K0 | 4.00±0.1 |
| K1 | 0.25±0.05 |
| K2 | 1.00±0.1 |
| E | 1.75±0.1 |
| G | 12.00±0.3 |
| W | 2.00±0.1 |
| D | 6.75±0.2 |
| T | 0.73±0.1 |
4.2 Reel Specifications
| Dimension Symbol | Specification |
|---|---|
| Minimum 1.5 | 1.5 Min. |
| B | 13.0 +0.5/-0.2 |
| Minimum E | 20.2 Min. |
| C | 330±2 |
| φE | 100±2 |
4.3 Packaging Details
- Quantity per Reel: 4000pcs (Tape & Reel packaging)
- Cardboard Packaging: Every 2 reels are packed in a cardboard (Size: 335mm340mm37mm)
- Carton Packaging: Every 3 cardboards are placed into a box (24000pcs/box; Box size: 350370165mm)
- For partial boxes (less than 24000pcs), bubble wraps or EPE should be used to fill the extra space to prevent product shaking.
5. Performance Test Results
| Test Item | Test Method | Standards | Typical Value | Maximum Value |
|---|---|---|---|---|
| High Temperature Storage | 1000h@+170°C, unpowered | AEC-Q200 TEST 3, MIL-STD-202 Method 108 | R±0.5% | R±1.0% |
| Thermal Shock | -55°C (15min) ~ ambient temperature (<20s) ~ +155°C (15min), 1000 cycles | AEC-Q200 TEST 16, MIL-STD-202 Method 107 | R±0.1% | R±0.5% |
| Bias Humidity | +85°C, 85%RH, powered no less than 10% rated power for 1000h | AEC-Q200 TEST 7, MIL-STD-202 Method 103 | R±0.2% | R±0.5% |
| Load Life | 2000h@+70°C (terminal temperature), rated power, 90min on, 30min off | AEC-Q200 TEST 8, MIL-STD-202 Method 108 | R±0.5% | R±1.0% |
| Resistance to Solvent | Immerse in solvent for 3min and wipe 10 times; 3 cycles with 3 solvents; Dry at ambient temperature after cleaning | AEC-Q200 TEST 12, MIL-STD-202 Method 215 | Clear marking, no visible damage | - |
| Mechanical Shock | Half Sine Wave, peak acceleration 100g's, pulse duration 6ms, 3 times in each of six directions on three different axes | AEC-Q200 TEST 13, MIL-STD-202 Method 213 | R±0.05% | R±0.2% |
| Vibration | 10-2KHz, 5g's, 20min/cycle, 12 cycles in each direction (X/Y/Z) | AEC-Q200 TEST 14, MIL-STD-202 Method 204 | R±0.05% | R±0.2% |
| Resistance to Solder Heat | +260°C tin bath for 10s | AEC-Q200 TEST 15, MIL-STD-202 Method 210 | R±0.2% | R±0.5% |
| Solderability | +245°C tin bath for 3s | AEC-Q200 TEST 18, IEC60115-14.17 | No visible damage, minimum 95% coverage | - |
| TCR | Test at -55°C and +170°C (+20°C as reference) | AEC-Q200 TEST 19, IEC60115-14.8 | Refer to tested curve | ±100ppm/℃ |
| Substrate Bending | 2mm bending, duration 60s | AEC-Q200 TEST 21, AEC-Q200-005 | R±0.01% | R±0.1% |
| Short Time Overload | 5x rated voltage, 5s | IEC60115-14.13 | R±0.1% | R±0.5% |
| Low Temperature Storage | -55°C for 96h, unpowered | IEC60068-2-1 | R±0.1% | R±0.5% |
| Moisture Resistance | T=24h/cycle, zero power; Method 7a and 7b not required | MIL-STD-202 Method 106 | R±0.1% | R±0.5% |
6. Application Information
6.1 Suitable Applications
- Automotive Electronics
- Precision Power Supply
- Instrumentation
- Testing & Measurement Equipment
- Medical Equipment
- AC, DC low and high frequency sampling circuits (due to inductance <3nH)
- Formation & sorting of battery testing equipment
6.2 Usage Suggestions
- Protect the resistor surface during use to avoid scratches, bumps, oil stains and other defects.
- Do not use sharp tweezers to handle the resistor, as surface scratches may cause resistance drift or product failure.
- Avoid mechanical stress impact on the resistor during installation and use.
- The long-term operating power should be less than the rated power to prevent resistance drift caused by long-term overload.
- Refer to the derating curve when operating under high temperature conditions or poor heat dissipation environment.
- A systematic evaluation is required if the operating conditions exceed the pulse specifications in the maximum pulse energy curve.
- If the resistor is not used immediately after being removed from the packaging, store it in a vacuum environment to avoid poor solderability caused by oxidation.
6.3 Reflow Soldering Profile
- Resistor Surface Temperature Requirements:
- Applicable Solder Composition: Sn-Ag-Cu
7. Storage Instructions
- Storage Temperature: 5℃~35℃
- Storage Humidity: <60% RH (keep as low as possible)
- Avoid direct sunlight.
- Store in a clean, dry environment free of harmful gases (such as HCl, Sulfuric acid, H₂S, etc.).
- Do not remove the resistor from the original packaging unless necessary.
- Shelf Life: At least 1 year under the above storage conditions.
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