Technical Specifications for GRM155R71C104KA88D

General Information

• Part Number: GRM155R71C104KA88D
• Description: Chip Monolithic Ceramic Capacitor
• Manufacturer: Murata Manufacturing Co., Ltd.

Part Number Breakdown

• GRM: Series identifier
• 15: Length (1.25 mm)
• 55: Width (0.5 mm)
• R7: Temperature characteristic (X7R)
• 1C: Rated voltage (16V DC)
• 104: Nominal capacitance code (0.1 µF)
• K: Capacitance tolerance (±10%)
• A88: Packaging code
• D: Reel packaging type (Φ180mm reel)

Dimensions

• Length (L): 1.25 mm ± 0.05 mm
• Width (W): 0.5 mm ± 0.05 mm
• Height (T): 0.5 mm ± 0.05 mm
• E: 0.15 mm to 0.35 mm
• 9: 0.3 mm minimum

Rated Values

• Temperature Characteristic: X7R (EIA standard)Temperature Coefficient: -15% to +15%Temperature Range: -55°C to +125°C (reference temperature 25°C)
• Rated Voltage: 16V DC
• Nominal Capacitance: 0.1 µF
• Capacitance Tolerance: ±10%
• Operating Temperature Range: -55°C to +125°C

Packaging

• Mark: D
• Packaging Type: Φ180mm reel
• Packaging Unit: 10,000 pieces per reel

Specifications and Test Methods

Rated Voltage

• Test Method: Measurement between terminations
• Test Voltage: 300% of rated voltage (temperature compensating type), 250% of rated voltage (high dielectric constant type)
• Applied Time: 1s to 5s
• Charge/Discharge Current: 50 mA max.

Insulation Resistance (I.R.)

• C ≤ 0.047 µF: More than 10,000 MΩ
• C > 0.047 µF: More than 500 Ω·F
• Measurement Voltage: DC rated voltage
• Charging Time: 2 minutes
• Charge/Discharge Current: 50 mA max.
• Measurement Temperature: Room temperature

Capacitance

• Measurement Temperature: Room temperature

Q Factor or Dissipation Factor (D.F.)

• 30 pF and over: Q ≥ 1000
• 30 pF and below: Q ≥ 400 + 20C
• Measurement Conditions:Frequency: 1.0 ± 0.1 MHzVoltage: 0.5 to 5.0 Vrms

Temperature Characteristics of Capacitance

• No Bias: Nominal values of the temperature coefficient are shown in rated values
• Capacitance Change: Within ±10%
• Capacitance Drift: Calculated by dividing the differences between the maximum and minimum measured values in steps 1, 3, and 5 by the capacitance value in step 3

Adhesive Strength of Termination

• Test Method: Solder the capacitor on the test substrate
• Applied Force:GRM02: 1 NGRM03: 2 NGRM15/GRM18: 5 NGRM21/GRM31/GRM32: 10 N
• Holding Time: 10 ± 1s
• Applied Direction: In parallel with the test substrate and vertical with the capacitor side

Vibration

• Appearance: No defects or abnormalities
• Capacitance: Within specified initial value
• Q or D.F.: Within specified initial value
• Kind of Vibration: Simple harmonic motion
• Frequency: 10 Hz to 55 Hz to 10 Hz (1 minute)
• Total Amplitude: 1.5 mm
• Duration: 2 hours in each of 3 mutually perpendicular directions (total of 6 hours)

Substrate Bending Test

• Appearance: No defects or abnormalities
• Capacitance Change: Within ±5% or ±0.5 pF (whichever is larger)
• Pressurization Method: As shown in Fig.2
• Flexure: 1 mm
• Holding Time: 5 ± 1s
• Soldering Method: Reflow soldering

Solderability

• Appearance: 95% of the terminations should be soldered evenly and continuously
• Test Method: Solder bath method
• Flux: Solution of rojin ethanol 25% (wt)
• Preheat: 80°C to 120°C for 10s to 30s
• Solder: Sn-3.0Ag-0.5Cu
• Solder Temp.: 245 ± 5°C
• Immersion Time: 2 ± 0.5s

Resistance to Soldering Heat

• Appearance: No defects or abnormalities
• Capacitance Change: Within ±2.5% or ±0.25 pF (whichever is larger)
• Test Method: Solder bath method
• Solder: Sn-3.0Ag-0.5Cu
• Solder Temp.: 270 ± 5°C
• Immersion Time: 10 ± 0.5s
• Exposure Time: 24 ± 2h
• Preheat: 120°C to 150°C for 1 minute

Temperature Sudden Change

• Appearance: No defects or abnormalities
• Capacitance Change: Within ±2.5% or ±0.25 pF (whichever is larger)
• Q or D.F.: Within specified initial value
• Test Method: Perform five cycles according to the four heat treatments shown in the table
• Step:1: Min. Operating Temp. +0/-3°C, 30 ± 3 minutes2: Room Temp., 2 to 3 minutes3: Max. Operating Temp. +3/-0°C, 30 ± 3 minutes4: Room Temp., 2 to 3 minutes
• Exposure Time: 24 ± 2h

High Temperature High Humidity (Steady)

• Appearance: No defects or abnormalities
• Capacitance Change: Within ±7.5% or ±0.75 pF (whichever is larger)
• Q or D.F.:30 pF and over: Q ≥ 20030 pF and below: Q ≥ 100 + 10C/3
• I.R.: More than 500 MΩ or 25 Ω·F (whichever is smaller)
• Test Method: Solder the capacitor on the test substrate
• Test Temperature: 40 ± 2°C
• Test Humidity: 90% RH to 95% RH
• Test Time: 500 ± 12h
• Applied Voltage: DC rated voltage
• Charge/Discharge Current: 50 mA max
• Exposure Time: 24 ± 2h

Durability

• Capacitance Change: Within ±3% or ±0.3 pF (whichever is larger)
• Q or D.F.:30 pF and over: Q ≥ 35010 pF and over, 30 pF and below: Q ≥ 275 + 5C/210 pF and below: Q ≥ 200 + 10C
• I.R.: More than 1,000 MΩ or 50 Ω·F (whichever is smaller)