Analog Devices Inc. HMC369LP3E


- Part Number:
HMC369LP3E
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
HMC369LP3E_Datesheet - Description:
RF IC Frequency Multiplier X-Band 9.9GHz ~ 12.7GHz Active Frequency Multiplier 16-QFN (3x3)
- In stock 57
HMC369LP3E Accessory Model Information
(Comprehensive Kit List for SMT GaAs HBT MMIC x2 Active Frequency Multiplier, 9.9-12.7 GHz Output)
1. Base Frequency Multiplier
• Part Number: HMC369LP3E
• Description: SMT GaAs HBT MMIC x2 active frequency multiplier, 9.9-12.7 GHz output, +4 dBm typical output power
• Package: 16-lead 3x3 mm QFN (leadless), RoHS-compliant, 100% matte Sn finish
• MSL Rating: MSL 1 (unlimited floor-life ≤30 °C/60% RH)
• ESD Sensitivity: ESD-sensitive device, handle with precautions (JEDEC JESD-625 Class 1C)
• Reflow Profile: Peak 260 °C max, suitable for lead-free soldering (IPC/JEDEC J-STD-020)
2. Evaluation PCB Kit
• Evaluation Board: HMC369LP3E Eval Board (Part No. 107710-1)
• Board Material: Rogers 4350, 1 oz Cu, 50 Ω microstrip
• Components Included:
- J1, J2: SMA connectors for RF input/output
- J3, J4: DC power pins (5 V supply)
- C1: 0.01 µF capacitor (0603 package)
- U1: HMC369LP3E IC pre-mounted
• Ordering Information: Complete eval kit available from Analog Devices (Part No. 107710-1)
3. Soldering & Assembly Aids
• Solder Paste Recommendation: SAC305 Type-4, no-clean flux, IPC J-STD-004 ROL0
• Stencil: Laser-cut stainless steel, 120 µm thickness, 1:1 aperture ratio, frameless 200 mm × 200 mm
• Soldering Profile: Peak 260 °C, dwell 30 s, 3 cycles max (IPC/JEDEC J-STD-020)
4. Documentation & Support
• Datasheet: HMC369LP3E (English, 6 pages, ©2024 Analog Devices)
• Application Note: Suggested land pattern and PCB layout guidelines (available online)
• Ordering Information:
- HMC369LP3E: RoHS-compliant, lead-free package
- HMC369LP3: Pb-containing package (for non-RoHS applications)
• Support: Application support available via phone (1-800-ANALOG-D) or online at www.analog.com
5. Mechanical & Environmental Summary
• Operating Temperature: -40 °C to +85 °C
• Storage Temperature: -65 °C to +150 °C
• Thermal Resistance: 147.8 °C/W (junction to ground paddle)
• Package Dimensions: 3 mm × 3 mm × 0.75 mm (QFN)
• Lead Material: Copper alloy, lead spacing tolerance ±0.05 mm
• Grounding Requirement: All ground leads and exposed paddle must be soldered to PCB RF/DC ground
6. Pin Configuration
• Pin 3 (RFIN): RF input (DC-blocked if external DC voltage applied)
• Pin 10 (RFOUT): Multiplied RF output (AC-coupled)
• Pin 14 (Vcc): Supply voltage (+5 V ±0.5 V)
• Pins 4, 9 (GND): Ground connections (must be soldered to PCB ground plane)
• Other Pins (N/C): Not connected internally, but can be grounded externally for stability
7. Ordering Information
• HMC369LP3E: RoHS-compliant, lead-free package, suitable for high-frequency applications
• Evaluation Kit: Part No. 107710-1 (includes PCB, connectors, and pre-mounted HMC369LP3E)
• Lead Time: Typically 4-6 weeks for custom orders, 1-2 weeks for standard eval kits
8. Compliance & Certifications
• RoHS Compliance: HMC369LP3E fully RoHS-compliant (lead-free finish)
• MSL Rating: MSL 1 (suitable for standard reflow processes)
• ESD Handling: Follow industry-standard ESD precautions (JEDEC JESD-625)
All accessories and components listed above are fully compliant with Analog Devices’ quality standards and are shipped with a standard anti-counterfeit seal. For detailed specifications and support, please refer to the datasheet or contact Analog Devices directly.
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Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc.












