Analog Devices Inc. HMC369LP3E

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  • Part Number:

    HMC369LP3E

  • Manufacturer:

    Analog Devices Inc.

  • Category:

    RF Accessories

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf HMC369LP3E_Datesheet

  • Description:

    RF IC Frequency Multiplier X-Band 9.9GHz ~ 12.7GHz Active Frequency Multiplier 16-QFN (3x3)

  • In stock 57
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Specifications
Type
Paramete
Type
Paramete
Package / Case
16-VFQFN Exposed Pad
RF Type
X-Band
Secondary Attributes
Active Frequency Multiplier
Supplier Device Package
16-QFN (3x3)
Base Product Number
HMC369
Frequency
9.9GHz ~ 12.7GHz
Function
Frequency Multiplier
Mounting Type
Surface Mount
Overview

HMC369LP3E Accessory Model Information
(Comprehensive Kit List for SMT GaAs HBT MMIC x2 Active Frequency Multiplier, 9.9-12.7 GHz Output)

1. Base Frequency Multiplier

Part Number: HMC369LP3E
Description: SMT GaAs HBT MMIC x2 active frequency multiplier, 9.9-12.7 GHz output, +4 dBm typical output power
Package: 16-lead 3x3 mm QFN (leadless), RoHS-compliant, 100% matte Sn finish
MSL Rating: MSL 1 (unlimited floor-life ≤30 °C/60% RH)
ESD Sensitivity: ESD-sensitive device, handle with precautions (JEDEC JESD-625 Class 1C)
Reflow Profile: Peak 260 °C max, suitable for lead-free soldering (IPC/JEDEC J-STD-020)

2. Evaluation PCB Kit

Evaluation Board: HMC369LP3E Eval Board (Part No. 107710-1)
Board Material: Rogers 4350, 1 oz Cu, 50 Ω microstrip
Components Included:
- J1, J2: SMA connectors for RF input/output
- J3, J4: DC power pins (5 V supply)
- C1: 0.01 µF capacitor (0603 package)
- U1: HMC369LP3E IC pre-mounted
Ordering Information: Complete eval kit available from Analog Devices (Part No. 107710-1)

3. Soldering & Assembly Aids

Solder Paste Recommendation: SAC305 Type-4, no-clean flux, IPC J-STD-004 ROL0
Stencil: Laser-cut stainless steel, 120 µm thickness, 1:1 aperture ratio, frameless 200 mm × 200 mm
Soldering Profile: Peak 260 °C, dwell 30 s, 3 cycles max (IPC/JEDEC J-STD-020)

4. Documentation & Support

Datasheet: HMC369LP3E (English, 6 pages, ©2024 Analog Devices)
Application Note: Suggested land pattern and PCB layout guidelines (available online)
Ordering Information:
- HMC369LP3E: RoHS-compliant, lead-free package
- HMC369LP3: Pb-containing package (for non-RoHS applications)
Support: Application support available via phone (1-800-ANALOG-D) or online at www.analog.com

5. Mechanical & Environmental Summary

Operating Temperature: -40 °C to +85 °C
Storage Temperature: -65 °C to +150 °C
Thermal Resistance: 147.8 °C/W (junction to ground paddle)
Package Dimensions: 3 mm × 3 mm × 0.75 mm (QFN)
Lead Material: Copper alloy, lead spacing tolerance ±0.05 mm
Grounding Requirement: All ground leads and exposed paddle must be soldered to PCB RF/DC ground

6. Pin Configuration

Pin 3 (RFIN): RF input (DC-blocked if external DC voltage applied)
Pin 10 (RFOUT): Multiplied RF output (AC-coupled)
Pin 14 (Vcc): Supply voltage (+5 V ±0.5 V)
Pins 4, 9 (GND): Ground connections (must be soldered to PCB ground plane)
Other Pins (N/C): Not connected internally, but can be grounded externally for stability

7. Ordering Information

HMC369LP3E: RoHS-compliant, lead-free package, suitable for high-frequency applications
Evaluation Kit: Part No. 107710-1 (includes PCB, connectors, and pre-mounted HMC369LP3E)
Lead Time: Typically 4-6 weeks for custom orders, 1-2 weeks for standard eval kits

8. Compliance & Certifications

RoHS Compliance: HMC369LP3E fully RoHS-compliant (lead-free finish)
MSL Rating: MSL 1 (suitable for standard reflow processes)
ESD Handling: Follow industry-standard ESD precautions (JEDEC JESD-625)

All accessories and components listed above are fully compliant with Analog Devices’ quality standards and are shipped with a standard anti-counterfeit seal. For detailed specifications and support, please refer to the datasheet or contact Analog Devices directly.

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