K4B4G1646E-BCNB: 4Gb DDR3 SDRAM Memory Chip

1. Basic Information

2. Core Specifications

2.1 Memory Density & Organization

• Density: 4 Gigabits (Gb) = 512 Megabytes (MB)
• Organization: 256 Megabits × 16 bits (256M x16)
• Data Bus Width: 16-bit

2.2 Speed & Timing

• Data Rate: 2133 Mbps (Megabits per second)
• Clock Frequency: 1066 MHz (Double Data Rate)
• Clock Period (tCK): 0.938 ns (typical for DDR3-2133)
• Interface: SSTL_15 (1.5V Stub Series Terminated Logic)

2.3 Electrical Characteristics

• Supply Voltage (VDD/VDDQ): 1.5 V (Operating range: 1.425 V – 1.575 V)
• I/O Reference Voltage (VREFDQ): 0.49–0.51 × VDDQ
• Operating Current (IDD):

2.4 Physical & Packaging

• Package Type: 96-ball Fine-Pitch Ball Grid Array (FBGA)
• Package Dimensions: 13.3 mm × 7.5 mm × 1.1 mm (max)
• Ball Pitch: 0.8 mm
• Mounting Type: Surface Mount Technology (SMT)
• Standard Packing: Tray (1120 units per tray)

2.5 Environmental

• Operating Temperature Range (TOPER): 0°C to +95°C
• Storage Temperature Range: -55°C to +125°C (Typical for semiconductor devices)

3. Key Features

• High-Speed Operation: Supports up to DDR3-2133 speed grade.
• Low Power Consumption: Optimized for 1.5V operation, suitable for energy-efficient designs.
• High Density: 4Gb capacity in a compact FBGA package.
• Standard DDR3 Interface: Compatible with industry-standard DDR3 memory controllers.
• Auto-Refresh & Self-Refresh Modes: For data retention in low-power states.
• Burst Length (BL): Supports BL8 (8-word burst) and BC4 (4-word burst) modes.
• CAS Latency (CL): Programmable (CL=7, 8, 9, 10, 11 for different speed grades).

4. Typical Applications

• Consumer Electronics: Desktop PCs, laptops, servers, workstations.
• Networking Equipment: Routers, switches, network attached storage (NAS).
• Embedded Systems: Industrial controllers, medical devices, automotive infotainment systems.
• Digital TVs & Set-Top Boxes: High-performance multimedia processing.

5. Ordering & Availability

• Status: Discontinued (EOL). Limited stock may be available through authorized distributors.
• MOQ (Minimum Order Quantity): 1 unit (varies by supplier)
• Lead Time: Contact suppliers for current availability.

6. Notes

• This product is no longer recommended for new designs. Consider newer DDR4/LPDDR5 memory solutions.
• For complete electrical characteristics, timing diagrams, and application circuits, refer to the official Samsung datasheet.