Samsung KLM4G1FETE-B041 eMMC Memory Module – Complete Technical Datasheet

1. Basic Product Information

2. Core Specifications

2.1 Memory Capacity

• Density: 4 Gigabytes (GB) / 32 Gigabits (Gb)
• NAND Flash Type: SLC (Single-Level Cell)

2.2 Interface & Performance

• Interface Standard: eMMC 5.1 (JEDEC compliant)
• High-Speed Mode: HS400 (High-Speed 400)
• Max Clock Frequency: 200 MHz
• Sequential Read Speed: Up to 300 MB/s
• Sequential Write Speed: Up to 19 MB/s
• Command Queue: Supported (eMMC 5.1 feature)

2.3 Power Supply

• Core Voltage (VCC/VCCF): 2.7 V – 3.6 V (3.3 V nominal)
• I/O Voltage (VCCQ): Dual-mode support – 2.7 V – 3.6 V / 1.7 V – 1.95 V
• Low-Power Modes: Automatic power-saving; Standby current as low as ~40 μA

2.4 Physical & Environmental

• Package: FBGA-153 (Fine-Pitch Ball Grid Array, 153 pins)
• Dimensions: 11.0 mm × 10.0 mm × 0.78 mm (L × W × H)
• Mounting Type: Surface Mount Technology (SMT)
• Operating Temperature: -25 °C to +85 °C
• Storage Temperature: -40 °C to +85 °C (typical)

3. Key Functional Features

• Integrated Controller: On-chip flash management controller (FTL)
• Flash Management: Automatic bad block management, wear leveling, and ECC (Error Correction Code)
• Reliability: High endurance for embedded applications
• Compatibility: Backward-compatible with legacy eMMC protocols
• Power Efficiency: Optimized for battery-powered mobile and portable devicesSamsung Semiconductor

4. Typical Applications

• Consumer Electronics: Smartphones, tablets, portable media players, smartwatches
• Industrial Systems: Industrial PCs, IoT gateways, embedded controllers
• Automotive Infotainment: Non-automotive-grade in-vehicle media systems
• Networking & Communications: Routers, set-top boxes, smart home devices

5. Regulatory & Classification

• ECCN: 3A991.b.1.a
• HTS Code: 8542.32.00.71 (US)
• EU RoHS Directive: 2011/65/EU

6. Ordering & Packaging

• Standard Packaging: Tape-and-reel (SMT compatible)
• Lead-Free Finish: Yes, compliant with global environmental standards