MNR14E0APJ Chip Resistor Network – Attachment and Accessory Model Information

1. Product Overview

• Part Number: MNR14E0APJ
• Type: Chip Resistor Network
• Package Style: 4-element array (Quad)
• Size: 1608×4 [0603×4 inch]
• Configuration: Convex electrodes for improved solder fillet visibility
• Automotive Grade: Yes (AEC-Q200 compliant)

2. Electrical Specifications

• Rated Power (per element): 0.063 W at 70°C
• Limiting Element Voltage: 50 V
• Resistance Tolerance: ±5% (J tolerance)
• Temperature Coefficient: ±500 ppm/°C
• Resistance Range: 2.2 Ω to <10 Ω (E6 series)
• Operating Temperature Range: –55°C to +155°C
• Jumper Type Available: Yes (Max. 50 mΩ, Rated current: 1 A/element)

3. Mechanical and Packaging Information

3.1 Type Code

• E0AP: Indicates paper tape packaging with 4 mm pitch

3.2 Tape and Reel Specifications

• Tape Type: Paper Tape
• Tape Width: 8.0 ± 0.3 mm
• Component Pitch (P1): 4.0 ± 0.1 mm
• Feed Hole Pitch (P0): 4.0 ± 0.1 mm
• Sprocket Hole Diameter (D0): Φ1.5 +0.1 mm
• Component Dimensions (A0 × B0): 1.8 ± 0.1 mm × 3.4 ± 0.1 mm
• Reel Diameter: Φ180 mm
• Quantity per Reel: 5,000 pieces

4. Land Pattern Recommendations

• Pad Layout: ROHM provides recommended land patterns for MNR14E0APJ to ensure optimal solderability and electrical performance.
• Dimensions (in mm):A: 1.0B: 0.4–0.6C: 0.7–0.8D: 2.4–2.6E: 0.4P1: 0.8P2: 0.8–0.9

5. Soldering and Mounting Notes

• Soldering Method: Reflow soldering recommended
• Soldering Temperature: 245 ± 5°C (duration: 2.0 ± 0.5 s)
• Resistance to Soldering Heat: ±(1.0% + 0.05 Ω) max
• Solderability: Minimum 95% coverage, no soldering damage
• Cleaning: Isopropyl alcohol immersion cleaning supported
• Bend Strength: End face plating withstands 3 mm deflection

6. Environmental and Reliability Compliance

• Certifications: ISO9001 / IATF16949
• Compliance Standards: IEC60115-1, IEC60115-8, JIS C 5201-1, JIS C 5201-8
• Test Endurance:Temperature Cycling: –55°C to +125°C, 1,000 cyclesDamp Heat: 85°C / 85% RH, 1,000 hLoad Life: 70°C, 1.5 h ON / 0.5 h OFF, 1,000 hHigh-Temperature Exposure: 155°C, 1,000 h

7. Precautions

• Electrostatic Sensitive Device: Handle with ESD precautions
• Storage Conditions: Avoid corrosive gases, high humidity, and direct sunlight
• Shelf Life: Confirm solderability if stored beyond recommended time
• RoHS Compliance: Yes