Micron Automotive e.MMC – MTFC8GAMALBH‑AAT Full Specification Summary

1. Basic Identification

• Manufacturer: Micron Technology Inc.
• Part Number: MTFC8GAMALBH‑AAT
• Product Family: Automotive‑grade e.MMC NAND Flash
• Density: 8GB
• Qualification: AEC‑Q104, PPAP supported
• Data Retention: AEC‑Q100‑005 compliant
• Document Version: Rev. J (12/2021)
• Status: Mass production

2. Core Features & Compliance

• Standard: JEDEC e.MMC 5.1 (JESD84‑B51)
• Architecture: MMC controller + NAND Flash
• Interface: 12‑signal, ×1 / ×4 / ×8 I/O configurable
• Modes: HS200, HS400
• Clock:
• Command Support:
• Key Functions:
• Backward compatible with legacy MMC

3. Electrical Specifications

• VCC: 2.7–3.6 V (NAND Flash & I/O)
• VCCQ (dual‑range): 1.70–1.95 V; 2.7–3.6 V (controller & e.MMC I/O)
• Operating Temperature (AAT grade): ‑40°C to +105°C (Ta); Tcase max 115°C
• Absolute Maximum Ratings:

4. Package & Mechanical

• Package Type: 153‑ball TFBGA (code BH)
• Dimensions: 11.5 mm × 13.0 mm × 1.1 mm
• Solder Balls: 153× Ø0.319 mm (post‑reflow on Ø0.30 SMD pads)
• Solder Alloy: SAC302 (96.8% Sn, 3.0% Ag, 0.2% Cu), NiAu pads
• Mounting: Surface mount
• Shipping: Tape and reel
• RoHS Compliant, lead‑free

5. Performance (HS400, ×8 I/O, 25°C, cache ON)

• Sequential Read: 280 MB/s
• Sequential Write: 40 MB/s

6. Typical Current Consumption (HS400, VCC=3.6V, VCCQ=1.95V, 25°C)

• Write (Icc / Iccq): 60 mA / 90 mA
• Read (Icc / Iccq): 100 mA / 140 mA
• Sleep: 0 µA / 100 µA
• Auto Standby: 60 µA / 110 µA

7. Signal & Pin Summary

• Core Signals: CLK, RST_n, CMD, DAT[7:0], DS
• Power: VCC, VCCQ, VSS, VSSQ, VDDIM
• VDDIM: Requires 0.1–1 µF decoupling cap to GND
• Internal pull‑up on DAT[7:1]; disconnected in ×4 / ×8 mode

8. Registers Overview

• OCR (32‑bit): Operating conditions & power status
• CID (128‑bit): Unique device identification
• CSD (128‑bit): Access parameters, timing, block lengths
• ECSD (512‑byte): Extended features, power classes, health, cache, security

9. Key Unsupported JEDEC Features

• Packed commands
• Context ID / data tag (host‑side protocol only)
• Dynamic device capacity
• Thermal throttling spec
• Large 4 KB sector mode
• Extended security protocol
• True secure erase / secure trim (implemented as logical erase mapping)

10. Reliability & Application

• Target Applications: Automotive infotainment, ADAS, navigation, industrial
• Non‑volatile storage (no power for data retention)
• Shock‑ and vibration‑resistant
• Designed for harsh automotive environments