SCR1100-D04-05 Product Information Summary

1. General Description

The SCR1100-D04-05 is a high-performance single-axis angular rate gyroscope developed by Murata, based on proven capacitive 3D-MEMS technology. It integrates a MEMS sensing element and a signal conditioning ASIC with a digital SPI interface, dedicated to measuring angular rate around the X-axis. With a measurement range of ±300 °/s, superior bias stability, and strong resistance to mechanical vibrations and shocks, it operates over an extended temperature range of -40 °C to +125 °C. Housed in a compact 8.5 x 18.7 x 4.5 mm (w x l x h) RoHS-compliant package, it supports SMD mounting and lead-free soldering. Factory-calibrated parameters (stored in non-volatile memory) ensure out-of-the-box usability, making it ideal for demanding applications such as inertial measurement units (IMUs), platform stabilization, robotic control, and navigation systems.

2. Core Features and Benefits

• Precise Angular Rate Measurement: ±300 °/s range with 18 LSB/(°/s) sensitivity and ±2% total sensitivity error, ensuring accurate motion detection.
• Superior Stability: Low bias instability (<2.1 °/h typical) and angular random walk (0.86 °/√h typical) for high-precision applications.
• Robust Environmental Performance: Resistant to vibrations and shocks (50g/6ms), with minimal cross-axis sensitivity (max 1.7%) and G-sensitivity (±0.1 (°/s)/g).
• Digital Interface: 4-wire SPI interface (0.1–8 MHz clock rate) supporting 16-bit data transfer and optional parity check (odd/even) for reliable communication.
• Dual Supply Operation: Analog supply (AVDD_G: 4.75–5.25 V) and digital supply (DVDD_G: 3.0–3.6 V) with low power consumption (analog: 26 mA typ; digital: 20 mA typ).
• Enhanced Diagnostics: Integrated self-diagnostics and status flags (S_OK) for real-time operation monitoring; parity error detection for SPI communication.
• Compact and Durable: Small form factor with robust packaging, thermal management via heat sink pins, and RoHS/ELV compliance.
• Fast Responsiveness: 50 Hz -3dB bandwidth, 2 kHz output data rate, and 0.8 s power-on setup time for real-time applications.

3. Applications

• Inertial Measurement Units (IMUs) for harsh environments
• Platform stabilization and control systems
• Motion analysis and robotic control
• Roll-over detection systems
• Guidance and navigation systems
• Industrial automation and precision motion control

4. Key Electrical Specifications

4.1 Performance Specifications (AVDD_G=5 V, DVDD_G=3.3 V, ambient temperature unless stated otherwise)

4.2 Absolute Maximum Ratings

4.3 Power Consumption

4.4 SPI Interface Specifications

4.4.1 DC Characteristics (DVDD_G=3.3 V)

4.4.2 AC Characteristics (FSPI=8 MHz)

5. Pin Configuration and Description

5.1 Key Pin Definitions (32-Pin Package)

6. Functional Operation

6.1 Core Working Principle

The MEMS sensing element uses vibrating masses excited into in-plane motion. Rotation around the X-axis induces out-of-plane movement, detected as capacitance changes by the ASIC. The ASIC conditions the signal, applies factory-calibrated parameters (sensitivity, offset over temperature), and outputs digital angular rate data via SPI.

6.2 Power-Up Sequence

1. Apply DVDD_G (3.0–3.6 V) and wait 10 ms.
2. Apply AVDD_G (4.75–5.25 V) and wait 800 ms (power-on setup time).
3. Read the Status register (08h) twice to clear error flags.
4. Angular rate data is immediately available; no additional initialization required.

6.3 Reset Mechanism

• Soft Reset: Write 0x04 to the IC Identification register (07h).
• Hard Reset: Trigger via EXTRESN_G pin (active low); ensure supplies are within range before releasing.

6.4 SPI Communication

• Transfer Protocol: 16-bit frames (address + data/status); MISO data shifts out on SCK falling edge, MOSI data sampled on SCK rising edge.
• Address Frame: D15–D9=0, D8–D2=register address (ADR6–ADR0), D1=RW (0=read, 1=write), D0=odd parity bit.
• Data Frame: 15-bit data (Dat14–Dat0) + 1-bit parity; write data stored in selected register, read data returned in subsequent frame.
• Parity Mode: Optional (enable via IC Identification register); 17-bit frames (16-bit data + parity bit) for error detection.

6.5 Key Registers

6.6 Temperature Calculation

Temperature data (14-bit two’s complement) is factory-calibrated for offset; convert to °C using:\(Temp[°C] = (Temp[LSB] + 3250) / 65\)

• Typical output at +23 °C: -1755 counts
• Sensitivity: ~65 counts/°C
• Offset calibration error at 25 °C: ≤±15 °C

7. Package and Mechanical Specifications

7.1 Package Dimensions (mm)

7.2 PCB Footprint Dimensions (mm)

7.3 Thermal Characteristics

8. Application Guidelines

8.1 Recommended External Components

8.2 PCB Layout Recommendations

• Use separate analog/digital ground layers for long power supply lines; star connection for short lines.
• Place decoupling capacitors (C1, C3, C5, C6, C39) and inductor (L1) close to corresponding pins.
• Connect heat sink pins (HEAT) and SUB to AVSS_G for optimal thermal dissipation.
• Keep SPI lines short and matched to minimize noise; add optional RC/LC filter (R1, C7, L2) for unstable 3.3 V supplies.

8.3 Assembly Notes

• Compatible with lead-free soldering processes; validate PCB coating materials to avoid performance impact.
• Follow "Technical Note 82" for detailed assembly instructions.
• Avoid ultrasonic cleaning (prohibited per absolute maximum ratings).