Kioxia America, Inc. THGBMHG6C1LBAW6

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  • Part Number:

    THGBMHG6C1LBAW6

  • Manufacturer:

    Kioxia America, Inc.

  • Category:

    Memory

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

  • Description:

    Memory IC 64Gbit eMMC 153-WFBGA (11.5x13)

  • In stock 0
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Overview

Toshiba THGBMHG6C1LBAW6 Comprehensive Specification Summary


1. Basic Device Information


  • Full Part Number: THGBMHG6C1LBAW6
  • Product Type: Industrial‑grade embedded e‑MMC memory module
  • Manufacturer: Toshiba Semiconductor & Storage Products
  • Capacity: 8GB
  • Interface Standard: e‑MMC 5.1 (JEDEC/MMCA), supports HS400 high‑speed mode
  • Device Class: Industrial version (I‑Ver) – wide temperature range
  • Status: Mass production
  • Document: Toshiba Flash Memory Catalog (Mar 2016)

2. Core Features


  • Integrated Management: Onboard controller with ECC, wear leveling, bad block management, garbage collection
  • High Speed: Up to 400 MB/s maximum data transfer rate
  • Power Supply:
  • Temperature Range: −40 °C to +85 °C (industrial grade)
  • Reliability: Extended endurance for industrial/automotive environments
  • Package: Compact P‑WFBGA153, suitable for space‑constrained designs
  • Compatibility: Standard e‑MMC command set and pinout for easy design‑in

3. Performance Specifications

ParameterValue
Max Data Rate400 MB/s
Capacity8GB
Interfacee‑MMC 5.1 HS400
Operating Temperature−40 °C to +85 °C
Power SupplyVcc: 2.7–3.6 V; VccQ: 1.7–1.95 V / 2.7–3.6 V
PackageP‑WFBGA153

4. Package & Mechanical Data


  • Package Type: P‑WFBGA153 (153‑ball fine‑pitch BGA)
  • Dimensions: 11.5 mm × 13.0 mm × 0.8 mm
  • Pitch: 0.5 mm
  • Mounting: Surface‑mount (SMT)
  • Moisture Sensitivity Level: Compliant with industry standards
  • Packaging: Tape‑and‑reel

5. Recommended Operating Conditions


  • Core Supply (Vcc): 2.7 V to 3.6 V
  • I/O Supply (VccQ): 1.70 V to 1.95 V or 2.7 V to 3.6 V
  • Operating Case Temperature: −40 °C to +85 °C
  • Interface Mode: e‑MMC 5.1 HS400 (8‑lane parallel)
  • Signal Levels: Standard JEDEC e‑MMC compatible

6. Functional Description


  • Architecture: Managed NAND with integrated controller
  • Memory Cell: MLC NAND flash
  • Key Functions:
  • Host Interface: Standard e‑MMC command/response/data protocol
  • Application Optimized: Industrial control, embedded systems, infotainment, rugged electronics

7. Reliability & Quality


  • Industrial Temperature Rating: −40 °C to +85 °C
  • Endurance: High write endurance for industrial workloads
  • Data Retention: Compliant with industrial e‑MMC standards
  • Quality: Manufactured in Toshiba’s fab with strict process controls
  • RoHS Compliant: Lead‑free, halogen‑free available

8. Target Applications


  • Industrial embedded systems
  • Automotive infotainment & navigation
  • Rugged mobile/handheld devices
  • Digital signage & industrial HMI
  • Networking & communication equipment
  • Industrial data loggers & IoT gateways

9. Ordering & Part Number Decoding


  • Part Number: THGBMHG6C1LBAW6
  • Capacity Code: 6 → 8GB
  • Temperature: W → Industrial (−40 °C to +85 °C)
  • Package: BGA153 (11.5 × 13 × 0.8 mm)
  • Version: Industrial I‑Ver e‑MMC 5.1


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