Samtec Inc. TSM-105-01-L-DV-P-TR

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  • Part Number:

    TSM-105-01-L-DV-P-TR

  • Manufacturer:

    Samtec Inc.

  • Category:

    Headers, Male Pins

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf TSM-105-01-L-DV-P-TR_Datesheet

  • Description:

    Connector Header Surface Mount 10 position 0.100" (2.54mm)

  • In stock 3,902
" Not available to buy online? Want the lower wholesale price? Please send RFQ, we will respond immediately
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Specifications
Type
Paramete
Type
Paramete
Insulation Height
0.100" (2.54mm)
Current Rating (Amps)
-
Mfr
Samtec Inc.
Material Flammability Rating
UL94 V-0
Contact Length - Mating
0.230" (5.84mm)
Contact Length - Post
-
Contact Material
Phosphor Bronze
Fastening Type
Push-Pull
Contact Finish - Post
Tin
Insulation Color
Black
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Termination
Solder
Style
Board to Board or Cable
Contact Shape
Square
Number of Rows
2
Pitch - Mating
0.100" (2.54mm)
Applications
-
Overall Contact Length
-
Contact Finish Thickness - Post
-
Contact Type
Male Pin
Insulation Material
Liquid Crystal Polymer (LCP)
Mounting Type
Surface Mount
Connector Type
Header, Cuttable
Features
Pick and Place
Shrouding
Unshrouded
Number of Positions Loaded
All
Mated Stacking Heights
-
Ingress Protection
-
Row Spacing - Mating
0.100" (2.54mm)
Number of Positions
10
Base Product Number
TSM-105
Voltage Rating
-
Contact Finish - Mating
Gold
Operating Temperature
-55°C ~ 125°C
Overview

DESCRIPTION

· Confidential and proprietary document by Samtec, Inc.
· Contains design, manufacturing, and patent rights information.
· Unauthorized disclosure or reproduction prohibited.



FEATURES

· Multiple lead styles and plating specifications available.
· Options include locking clips, alignment pins, and pick and place pads.
· Tape and reel packaging for positions 02 through 28.
· Various mounting styles: DV, TV, TM.



APPLICATIONS

· Suitable for high-density connector applications.
· Ideal for use in electronic assemblies requiring precise placement.
· Compatible with manual and automated placement processes.



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