Texas Instruments AMC3330QDWERQ1

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  • Part Number:

    AMC3330QDWERQ1

  • Manufacturer:

    Texas Instruments

  • Category:

    Display Drivers

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

  • Description:

    Isolation IC 16-SOIC

  • In stock 0
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Overview

AMC3330QDWERQ1 Comprehensive Datasheet Summary


1. Basic Device Information


  • Full Part Number: AMC3330QDWERQ1
  • Device Family: AMC3330‑Q1 Automotive Precision Isolated Amplifier
  • Status: Active, production data
  • Document: SBASA35B (June 2020 – Revised September 2024)
  • Automotive Qualification: AEC‑Q100 Grade 1
  • Package: DWE (16‑pin SOIC), nominal size 10.3 mm × 10.3 mm
  • Ordering & Packaging: SOIC 16‑pin, 2000 units per large tape‑and‑reel, RoHS compliant, lead finish NIPDAU, MSL Level‑3 260°C 168hr, operating temp −40°C to 125°C, marking AMC3330Q

2. Core Features


  • Integrated Isolated DC/DC Converter: Single 3.3 V or 5 V low‑side supply operation
  • Input: ±1 V linear full‑scale range (VFSR), ±1.25 V clipping range, high input impedance
  • Fixed Gain: 2.0 V/V
  • High Precision DC Errors (max):
  • Robust Isolation:
  • High CMTI: ≥85 kV/µs (min)
  • System Diagnostics: Integrated DC/DC fault detection, open‑drain DIAG pin
  • EMC Compliance: Meets CISPR‑11 and CISPR‑25

3. Key Applications


  • Isolated voltage sensing in automotive systems:

4. Pin Configuration (16‑Pin SOIC Top View)

Pin No.NameTypeDescription
1DCDC_OUTPowerIsolated DC/DC high‑side output; connect to HLDO_IN
2DCDC_HGNDPower GNDDC/DC high‑side ground; connect to HGND
3HLDO_INPowerHigh‑side LDO input; connect to DCDC_OUT
4NCNo internal connection
5HLDO_OUTPowerHigh‑side LDO output
6INPAnalog InputNon‑inverting analog input
7INNAnalog InputInverting analog input; connect to HGND
8HGNDSignal GNDHigh‑side analog ground
9GNDSignal GNDLow‑side analog ground; connect to DCDC_GND
10OUTNAnalog OutputInverting analog output
11OUTPAnalog OutputNon‑inverting analog output
12VDDPowerLow‑side supply (3.0–5.5 V)
13LDO_OUTPowerLow‑side LDO output; connect to DCDC_IN
14DIAGDigital OutputActive‑low open‑drain status indicator
15DCDC_GNDPower GNDDC/DC low‑side ground; connect to GND
16DCDC_INPowerIsolated DC/DC low‑side input; connect to LDO_OUT

5. Absolute Maximum Ratings


  • Supply voltage (VDD to GND): −0.3 V to 6.5 V
  • Analog input (INP, INN): HGND −6 V to HLDO_OUT +0.5 V
  • Analog output (OUTP, OUTN): GND −0.5 V to VDD +0.5 V
  • Digital output (DIAG): GND −0.5 V to 6.5 V
  • Input current (continuous): ±10 mA
  • Junction temperature (TJ): 150 °C
  • Storage temperature (Tstg): −65 °C to 150 °C

6. Recommended Operating Conditions


  • Supply Voltage (VDD): 3.0 V to 5.5 V (nominal 3.3 V / 5 V)
  • Linear Differential Input (VFSR): −1 V to +1 V
  • Clipping Input (VClipping): ±1.25 V
  • Common‑Mode Input (VCM): −1.4 V to 1.6 V (normal operation)
  • Ambient Temperature (TA): −40 °C to +125 °C
  • Output Load:

7. Isolation & Safety Specifications


  • Clearance/creepage: ≥8 mm external
  • Insulation distance (DTI): ≥21 µm (signal), ≥120 µm (power)
  • CTI: ≥600 V, Material Group I
  • VIORM: 1700 VPK; VIOWM: 1200 VRMS / 1700 VDC
  • VIOTM: 6000 VPK (transient isolation)
  • VIMP: 7700 VPK (impulse voltage)
  • VIOSM: 10000 VPK (surge isolation)
  • Isolation Capacitance (CIO): ~4.5 pF
  • Isolation Resistance (RIO): >1012 Ω @25 °C
  • Certifications:

8. Electrical Characteristics (TA = −40°C to 125°C, VDD = 3.0–5.5 V)


  • Input:
  • Output:
  • Accuracy:
  • Power:

9. Thermal Information


  • Junction‑to‑ambient thermal resistance (RθJA): 73.5 °C/W
  • Junction‑to‑top (RθJC(top)): 31 °C/W
  • Junction‑to‑board (RθJB): 44 °C/W
  • Max power dissipation: 236.5 mW @VDD = 5.5 V
  • Safety limiting current (IS): 309 mA @VDD = 5.5 V, TA = 25 °C

10. Functional Description


  • Signal Path: Second‑order ΔΣ modulator → capacitive isolation barrier → fourth‑order low‑pass filter → differential output
  • Isolation Technology: Double SiO2 capacitive signal isolation; on‑chip transformer with thin‑film polymer power isolation
  • OOK Modulation: 480 MHz carrier for robust barrier transmission
  • Diagnostics & Failsafe:
  • DC/DC Converter: Spread‑spectrum clocking for low EMI; internal low‑side/high‑side LDO regulation

11. Application & Implementation


  • Typical Use: High‑voltage isolated sensing via resistive dividers in OBC, inverters, BMS
  • Input Filtering: RC low‑pass recommended; single capacitor often sufficient for divider front‑ends
  • Output Interface: Differential output; convert to single‑ended for single‑ended ADCs using op‑amp circuits
  • Power Supply Decoupling:
  • Layout Guidelines: Symmetrical input/output paths; keep decoupling caps close; maintain ≥8 mm creepage/clearance; separate high‑side/low‑side grounds

12. Ordering & Packaging Details


  • Orderable Part: AMC3330QDWERQ1, AMC3330QDWERQ1.A
  • Package: 16‑pin SOIC (DWE), tape‑and‑reel
  • Dimensions: Reel diameter 330.0 mm, width 16.4 mm; tape pitch 12.0 mm
  • Marking: AMC3330Q
  • MSL: Level 3, peak reflow 260 °C

13. Revision Highlights (SBASA35B, Sep 2024)


  • Updated isolation certification to DIN EN IEC 60747‑17 (VDE 0884‑17)
  • Extended DIAG pin max voltage to 6.5 V
  • Added output load capacitance/resistance specs
  • Updated barrier capacitance to 4.5 pF
  • Added DIAG electrical specs, VDD UV/POR thresholds, IH for 4.5–5.5 V
  • Improved layout and decoupling recommendations


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