CD74FCT162501CTSM
Fast CMOS 18-Bit Registered Transceiver
Harris / ARRIS Semiconductor – Oct 1997

1. Ordering & Packaging• Part Number: CD74FCT162501CTSM• Package: 56-lead SSOP (M56.300-P)• Temperature Range: –40 °C to +85 °C• Lead Finish: Matte-Tin (indicated by “T” suffix)
2. Brief Description18-bit registered bus transceiver with D-type latches/flip-flops, permitting transparent, latched or clocked data transfer in both A→B and B→A directions. Integrates 24 mA balanced output drivers with on-chip current-limiting resistors to minimise ground-bounce and eliminate external termination in most applications.
3. Key Features• Advanced 0.6 µm CMOS, 5 V ±10 % operation• Balanced ±24 mA output drive (no external resistors required)• Typical output ground-bounce <0.6 V (VCC = 5 V, 25 °C)• Live-insertion capability – outputs power-off high-impedance (IOFF ≤ ±100 µA with VCC = 0 V, Vin/Vout ≤ 4.5 V)• Inputs with 100 mV (min) hysteresis for improved noise immunity• Edge-controlled output slew rate for reduced system noise• Bus-hold on data inputs (maintains last active logic state, removes need for external pull-up/down resistors)• Flow-through pin-out for simplified PCB layout• ESD-sensitive device – standard IC handling procedures required
4. Functional Blocks & Control• Independent paths: A→B controlled by OEAB, LEAB, CLKAB; B→A controlled by OEBA, LEBA, CLKBA• Transparent mode when respective latch-enable is HIGH• Data latched on HIGH-to-LOW transition of clock when latch-enable is LOW• Three-state outputs when output-enable is inactive
5. Absolute Maximum Ratings• Supply voltage (VCC): –0.5 V to +7.0 V• DC output current: ±120 mA max• Junction temperature: +150 °C• Storage temperature: –65 °C to +150 °C• Lead soldering (10 s): +300 °C (lead tips only)
6. DC Electrical Characteristics (–40 °C to +85 °C, VCC = 5 V ±10 %)• VIH = 2.0 V min; VIL = 0.8 V max• VOH = 2.4 V min (IOH = –24 mA, VCC min)• VOL = 0.55 V max (IOL = 24 mA, VCC min)• Input leakage ±1 µA (standard pins); ±100 µA (bus-hold pins)• Bus-hold sustain current –50 µA min (VIN = 0.8 V or 2.0 V)• Power-off leakage ±100 µA max
7. Dynamic & AC Specifications (CL = 50 pF, RL = 500 Ω)• Maximum clock frequency: 150 MHz (min guaranteed)• Propagation delay (data A↔B): 1.5 ns min / 4.6 ns max• Propagation delay (clock-to-output): 1.5 ns min / 4.2 ns max• Output skew (same package, same edge): 0.5 ns max• Setup time (data before clock): 2.4 ns min• Hold time (data after clock): 0 ns min• Latch/clock pulse width HIGH/LOW: 3.0 ns min• Three-state enable/disable times: 4.8 ns–6.0 ns max
8. Power-Supply Currents (typical @ 25 °C, VCC = 5 V)• Quiescent ICC: 0.1 mA (inputs at GND or VCC)• TTL input overhead: 1.5 mA max per pin @ VIN = 3.4 V• Dynamic current coefficient: 120 µA/MHz per bit (50 % duty)• Total ICC formula provided for system power budgeting
9. Capacitance (1 MHz, 25 °C)• CIN = 6 pF max (input)• COUT = 8 pF max (output)
10. Thermal Data• θJA SSOP: 70 °C/W (mounted on evaluation PCB, free air)
11. Handling & ESD CautionDevice is ESD-sensitive; follow proper grounding and handling procedures to prevent damage.