Altera EP2S180F1020C4N

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  • Part Number:

    EP2S180F1020C4N

  • Manufacturer:

    Altera

  • Category:

    Display Drivers

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

  • Description:

    IC FPGA 742 I/O 1020FBGA

  • In stock 4
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Specifications
Type
Paramete
Type
Paramete
Voltage - Supply
1.15V ~ 1.25V
Mounting Type
Surface Mount
Number of Gates
-
Number of LABs/CLBs
8970
Operating Temperature
0°C ~ 85°C (TJ)
Package / Case
1020-BBGA, FCBGA
Supplier Device Package
1020-FBGA (33x33)
Grade
-
Number of I/O
742
Number of Logic Elements/Cells
179400
Qualification
-
Total RAM Bits
9383040
Overview

EP2S180F1020C4N Device Information Summary

1. Device Overview

The EP2S180F1020C4N is a high-density member of the Altera Stratix® II FPGA family, offering advanced logic capacity, memory, and DSP capabilities for complex digital designs.

1.1 Key Features

  • Process Technology: 1.2-V, 90-nm, all-layer copper SRAM process
  • Logic Elements: 179,400 equivalent LEs
  • Adaptive Logic Modules (ALMs): 71,760
  • Adaptive LUTs (ALUTs): 143,520
  • Total RAM Bits: 9,383,040 bits (1,172,880 bytes)
  • DSP Blocks: 96 (supporting up to 384 18×18-bit multipliers)
  • PLLs: 12 total (4 enhanced PLLs + 8 fast PLLs)
  • Maximum User I/O Pins: 1,170

2. Device Resources

2.1 Logic and Memory Configuration


ResourceQuantity
ALMs71,760
ALUTs143,520
Equivalent LEs179,400
M512 RAM Blocks930
M4K RAM Blocks768
M-RAM Blocks9
Total RAM Bits9,383,040
DSP Blocks96
18×18 Multipliers384
Enhanced PLLs4
Fast PLLs8

2.2 Device Layout

  • LAB Columns: 100
  • LAB Rows: 96
  • M512 RAM Columns: 11
  • M4K RAM Columns: 8
  • DSP Block Columns: 4

3. Package Information

3.1 Physical Characteristics

  • Package Type: 1020-pin FineLine BGA® (FBGA)
  • Pitch: 1.00 mm
  • Package Area: 1,600 mm²
  • Dimensions: 40 mm × 40 mm
  • Temperature Grade: Commercial (0°C to 85°C junction temperature)

3.2 User I/O Availability

  • Total User I/O Pins: 1,170
  • Dedicated Clock Inputs: 16 (CLK[15..0])
  • Dedicated Fast PLL Clock Inputs: 8 (FPLL[7..10]CLKp/n)

3.3 I/O Bank Configuration

  • I/O Banks: 8 total (Banks 1-8)
  • PLL External Clock Banks: 4 (Banks 9-12)
  • Differential I/O Support: Banks 1, 2, 5, 6 (left/right), Banks 3, 4, 7, 8 (top/bottom)

4. Speed Grade Specifications (C4)

4.1 Performance Grades

  • Speed Grade: -4 (Commercial)
  • Maximum Clock Frequency: Up to 550 MHz (internal)
  • Supported Speed Grades: -3, -4, -5 (C4 indicates -4 grade, Commercial temperature)

4.2 Performance Benchmarks

Key performance metrics for -4 speed grade:

  • 16-to-1 Multiplexer: 523.83 MHz
  • 32-to-1 Multiplexer: 464.25 MHz
  • 16-bit Counter: 489.23 MHz
  • 64-bit Counter: 209.11 MHz
  • 9×9-bit Multiplier: 373.13 MHz
  • 18×18-bit Multiplier: 356.12 MHz (pipeline) / 391.23 MHz (full pipeline)
  • 36×36-bit Multiplier: 217.48 MHz

5. DC Characteristics

5.1 Operating Conditions


ParameterMinMaxUnit
VCCINT (Core)1.151.25V
VCCIO (I/O Buffers)1.14 (1.2V) to 3.135 (3.3V)1.26 to 3.465V
VCCPD (Pre-drivers)3.1353.465V
VCCA (Analog PLL)1.151.25V
VCCD (Digital PLL)1.151.25V
Junction Temperature085°C

5.2 Power Consumption (Typical Standby)


SupplyCurrent
ICCINT01.12 A
ICCPD06.8 mA
ICCIO04.0 mA

5.3 I/O Standards Support

The device supports multiple voltage-referenced and differential standards:

  • Single-Ended: LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V, 1.2V), PCI, PCI-X
  • Differential: LVDS, LVPECL, HyperTransport, SSTL-2, SSTL-18, HSTL-18, HSTL-15
  • On-Chip Termination: Series (25Ω/50Ω) and parallel (50Ω) with calibration

6. Configuration & Testing

6.1 Configuration Schemes

  • Supported Modes: Fast Passive Parallel (FPP), Active Serial (AS), Passive Serial (PS), Passive Parallel Asynchronous (PPA), JTAG
  • Configuration Features:Design security with AES encryptionData decompressionRemote system upgrade capability

6.2 JTAG Support

  • Boundary-Scan: IEEE Std. 1149.1 compliant
  • Device IDCODE: 0010 0000 1001 0110 (binary) for EP2S180
  • Boundary-Scan Register: 3,948 bits

6.3 SignalTap® II Embedded Logic Analyzer

  • Real-time logic analysis through JTAG port
  • No additional I/O pins required

7. Special Features

7.1 Hot Socketing

  • Hot Insertion: Supported without external components
  • I/O State: Tri-stated during power-up
  • Power Sequencing: Any VCCINT, VCCIO, VCCPD sequence allowed
  • Ramp Rate: 100 μs to 100 ms

7.2 Power-On Reset (POR)

  • PORSEL Pin: Selectable 12 ms or 100 ms delay
  • Brown-out Detection: Monitors VCCINT during user mode

7.3 Temperature Sensing

  • Diode Available: tempdiodep/tempdioden pins
  • Bias Current: 10-120 μA range
  • Measurement Range: -55°C to 125°C

8. Timing Characteristics

8.1 Clock Network Performance

  • Global Clocks: 16 networks
  • Regional Clocks: 32 networks (8 per quadrant)
  • Maximum Clock Skew: ±150 ps (entire chip, EP2S180)

8.2 I/O Timing (-4 Grade)

  • Input Register Setup/Hold: 140 ps / 82 ps (typical)
  • Clock-to-Output: 194 ps (typical)
  • Programmable Delays: Up to 3,860 ps input delay, 670 ps output delay

9. Memory Performance

9.1 TriMatrix Memory Performance


Memory TypeMax Frequency
M512 (32×18)373.13 MHz
M4K (128×36)401.60 MHz
M-RAM (4K×144)313.47 MHz

10. Ordering Information

10.1 Part Number Decode

  • EP: Altera Product
  • 2S: Stratix II Family
  • 180: 180K LE density
  • F: FBGA Package
  • 1020: 1020 pins
  • C: Commercial temperature grade (0°C to 85°C)
  • 4: -4 speed grade
  • N: Lead-free (RoHS compliant)

10.2 Availability

  • Device: EP2S180F1020C4N
  • Status: Final timing models available
  • Support: Full Quartus® II software support


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