Rochester Sensors EP900DM/B


- Part Number:
EP900DM/B
- Manufacturer:
- Category:
- RoHs:
Non-RoHS Compliant - Datasheet:
- Description:
EP900DM/B
- In stock 1,200
EP900DM/B Classic EPLD Specification Sheet
1. General Description
The EP900DM/B belongs to Altera’s Classic EPLD (Erasable Programmable Logic Device) family, manufactured by Rochester Electronics. It is designed for high-speed, low-power logic integration, leveraging advanced CMOS technology to support 100% TTL emulation. This device integrates multiple PAL- and GAL-type logic functions, offering a balance of logic density, speed, and flexibility for industrial, military, and space-grade applications. It features non-volatile EPROM configuration elements, enabling erasure and reprogramming, and supports a wide range of packages for versatile system integration.
2. Key Features
- Logic Density: Estimated 450 usable gates (aligning with the EP910 variant in the Classic family)
- Macrocells: 24 programmable macrocells, configurable for sequential (D, T, JK, SR flipflops) or combinatorial operation
- I/O Capabilities: Up to 38 maximum user I/O pins, with programmable I/O architecture
- Performance:
- Programmability:
- Clock Flexibility: Dual global clock pins (CLK1, CLK2) and array clock capability for independent register clocking
- Software & Hardware Support: Compatible with Altera MAX+PLUS II development system; programmable via Altera MPU, Data I/O, and third-party programmers
- Quality & Reliability:
3. Package Information
- Package Types: Compatible with the Classic family’s EP910 variant packages, including:
- Lead Finish: RoHS-compliant (Pb-free) options available (per Rochester’s manufacturing standards)
- Temperature Range: Industrial (-40°C to 85°C) and commercial (0°C to 70°C) grades supported
- Storage Temperature: -65°C to 150°C (no bias)
4. Functional Architecture
4.1 Core Components
- Macrocells: 24 macrocells, each with 8 product terms (programmable-AND/fixed-OR structure) and an XOR gate for polarity control. Supports asynchronous clear via a dedicated product term.
- Programmable Registers: Individually configurable as D, T, JK, or SR flipflops, or bypassed for combinatorial logic. Automatically cleared on power-up.
- Clock & Output Control: Two operating modes for output enable/clock select:
- Feedback Select: Global feedback configuration (similar to EP910), allowing macrocell outputs or I/O pin inputs to feed back to the AND array, accessible to all macrocells.
4.2 Block Diagram Overview
plaintext
[Dedicated Inputs / I/O Pins] → [Global Bus (True/Complement Signals)] → [Programmable-AND Array] → [OR Gate] → [XOR Gate] → [Programmable Register / Combinatorial Path] → [Tri-State Output Buffer] → [I/O Pins]
↑ ↑
[Feedback Multiplexer] [Clock/Output Enable Select]
↑ ↑
[Macrocell/I/O Feedback] [Global Clock / Array Clock]
5. Electrical Characteristics
5.1 Absolute Maximum Ratings
| Parameter | Conditions | Min | Max | Unit |
|---|---|---|---|---|
| VCC | Supply voltage (with respect to ground) | -2.0 | 7.0 | V |
| VI | DC input voltage | -2.0 (EP910) / -0.5 (EP910I) | 7.0 (EP910) / VCC+0.5 (EP910I) | V |
| IMAX | DC VCC or ground current | -250 | 250 | mA |
| IOUT | DC output current (per pin) | -25 | 25 | mA |
| TSTG | Storage temperature (no bias) | -65 | 150 | °C |
| TAMB | Ambient temperature (under bias) | -65 | 135 | °C |
| TJ | Junction temperature (ceramic packages, under bias) | - | 150 | °C |
| TJ | Junction temperature (plastic packages, under bias) | - | 135 | °C |
5.2 Recommended Operating Conditions
| Parameter | Conditions | Min | Max | Unit |
|---|---|---|---|---|
| VCC | Supply voltage (commercial) | 4.75 | 5.25 | V |
| VCC | Supply voltage (industrial) | 4.5 | 5.5 | V |
| VI | Input voltage | -0.3 | VCC+0.3 | V |
| VO | Output voltage | 0 | VCC | V |
| TA | Operating temperature (commercial) | 0 | 70 | °C |
| TA | Operating temperature (industrial) | -40 | 85 | °C |
| tR / tF | Input rise/fall time (commercial) | - | 100 | ns |
| tR / tF | Input rise/fall time (industrial) | - | 50 | ns |
5.3 DC Electrical Characteristics (VCC = 5V ±5%, TA = 25°C)
| Parameter | Conditions | Min | Max | Unit |
|---|---|---|---|---|
| VIH | High-level input voltage | 2.0 | VCC+0.3 | V |
| VIL | Low-level input voltage | -0.3 | 0.8 | V |
| VOH (TTL) | High-level output voltage (IOH = -4 mA) | 2.4 | - | V |
| VOH (CMOS) | High-level output voltage (IOH = -0.6 mA) | 3.84 | - | V |
| VOL | Low-level output voltage (IOL = 4 mA) | - | 0.45 | V |
| II | I/O pin leakage current (dedicated inputs) | -10 | 10 | μA |
| IOZ | Tri-state output leakage current | -10 | 10 | μA |
5.4 Supply Current (ICC)
| Parameter | Conditions | Typ | Max | Unit |
|---|---|---|---|---|
| ICC1 (Non-Turbo, Standby) | No load, no logic transitions | 20 (EP910) / 60 (EP910I) | 150 | μA |
| ICC2 (Non-Turbo, Active) | No load, f = 1 MHz | 6 (EP910) / 4 (EP910I) | 20 (EP910) / 12 (EP910I) | mA |
| ICC3 (Turbo, Active) | No load, f = 1 MHz | 45 (EP910) / 120 (EP910I) | 80 (100) (EP910) / 150 (EP910I) | mA |
5.5 Capacitance (TA = 25°C, f = 1 MHz)
| Parameter | Conditions | Max | Unit |
|---|---|---|---|
| CIN | Input pin capacitance | 20 (EP910) / 8 (EP910I) | pF |
| CIO | I/O pin capacitance | 20 (EP910) / 8 (EP910I) | pF |
| CCLK1 | CLK1 pin capacitance | 20 (EP910) / 10 (EP910I) | pF |
| CCLK2 | CLK2 pin capacitance | 60 (EP910) / 12 (EP910I) | pF |
6. Timing Parameters (Turbo Mode Enabled)
6.1 External Timing Parameters (EP910I-12 Variant Reference)
| Parameter | Conditions | Min | Max | Unit |
|---|---|---|---|---|
| tPD1 | Input to non-registered output (C1 = 35 pF) | - | 12.0 | ns |
| tPD2 | I/O input to non-registered output (C1 = 35 pF) | - | 12.0 | ns |
| tPZX | Input to output enable (C1 = 35 pF) | - | 15.0 | ns |
| tPXZ | Input to output disable (C1 = 5 pF) | - | 15.0 | ns |
| tCLR | Asynchronous output clear time (C1 = 35 pF) | - | 15.0 | ns |
| fMAX | Maximum pipelined frequency | 125.0 | - | MHz |
| tSU (Global) | Global clock setup time | 8.0 | - | ns |
| tH (Global) | Global clock hold time | 0.0 | - | ns |
| tCH | Global clock high time | 5.0 | - | ns |
| tCL | Global clock low time | 5.0 | - | ns |
| tCO1 | Global clock to output delay (C1 = 35 pF) | - | 8.0 | ns |
| tCNT | Global clock minimum period | - | 13.0 | ns |
| fCNT | Maximum internal global clock frequency | 76.9 | - | MHz |
6.2 Internal Timing Parameters (EP910I-12 Variant Reference)
| Parameter | Conditions | Max | Unit |
|---|---|---|---|
| tIN | Input pad and buffer delay | 2.0 | ns |
| tIO | I/O input pad and buffer delay | 0.0 | ns |
| tLAD | Logic array delay | 8.0 | ns |
| tOD | Output buffer and pad delay (C1 = 35 pF) | 2.0 | ns |
| tZX | Output buffer enable delay (C1 = 35 pF) | 5.0 | ns |
| tXZ | Output buffer disable delay (C1 = 5 pF) | 5.0 | ns |
| tSU (Register) | Register setup time | 4.0 | ns |
| tH (Register) | Register hold time | 4.0 | ns |
| tIC | Array clock delay | 12.0 | ns |
| tICS | Global clock delay | 4.0 | ns |
| tFD | Feedback delay | 1.0 | ns |
| tCLR (Register) | Register clear time | 11.0 | ns |
7. Programming & Design Support
7.1 Programming
- Erasure: UV light erasure (windowed ceramic packages) for design modifications.
- Programming Tools: Altera Master Programming Unit (MPU), Data I/O, BP Microsystems, and third-party programmers.
- Security: Programmable security bit to prevent design copying; reset only via UV erasure.
7.2 Software Support
- Development System: Altera MAX+PLUS II (runs on Windows PCs, Sun SPARCstation, HP 9000, IBM RISC System/6000).
- Design Entry: Schematic, VHDL, Verilog HDL, AHDL, EDIF, and LPM interfaces.
- Simulation & Timing: Integrated timing analysis, simulation, and point-to-point delay prediction.
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