Lite-On Inc. LTST-C191KGKT

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  • Part Number:

    LTST-C191KGKT

  • Manufacturer:

    Lite-On Inc.

  • Category:

    LED Lighting Kits

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

  • Description:

    Green 571nm LED Indication - Discrete 2V 0603 (1608 Metric)

  • In stock 152,475
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Specifications
Type
Paramete
Type
Paramete
Lens Transparency
Clear
Wavelength - Peak
574nm
Current - Test
20mA
Lens Color
Colorless
Millicandela Rating
35mcd
Voltage - Forward (Vf) (Typ)
2V
Size / Dimension
1.60mm L x 0.80mm W
Lens Style
Rectangle with Flat Top
Lens Size
1.10mm x 0.80mm
Height (Max)
0.65mm
Mfr
Lite-On Inc.
Package / Case
0603 (1608 Metric)
Configuration
Standard
Color
Green
Features
-
Viewing Angle
130°
Base Product Number
LTST-C191
Mounting Type
Surface Mount
Wavelength - Dominant
571nm
Overview

Information of LTST-C191KGKT SMD LED

Basic Overview

  • Product Type: Ultra-thin surface-mount device (SMD) LED with AlInGaP green chip
  • Manufacturer: Lite-On Technology Corp.
  • Document Reference: DS22-2000-228 (Rev. J, 06/22/2021)
  • Core Function: Provides bright green illumination for backlighting, status indication, and signal luminary applications
  • Key Features: RoHS compliant, extra-thin (0.55mm) profile, ultra-bright InGaN dice chip, EIA standard package, IR reflow solder compatible (260°C/10s), I.C. compatible, automatic placement friendly
  • Key Identifiers:

Core Specifications

1. Absolute Maximum Ratings (Ta=25°C)


ParameterValueUnit
Power Dissipation75mW
Peak Forward Current (1/10 duty cycle, 0.1ms pulse)80mA
DC Forward Current30mA
Reverse Voltage5V
Operating Temperature Range-55 to +85°C
Storage Temperature Range-55 to +85°C
IR Reflow Soldering Temperature260 (10s max)°C

2. Electrical and Optical Characteristics (Ta=25°C)


ParameterSymbolMinTypMaxUnitTest Condition
Luminous IntensityIV18.0-71.0mcdIF=20mA
Viewing Angle (Half-Power)2θ1/2-130-deg-
Peak Emission WavelengthλP-574.0-nmMeasured at peak
Dominant Wavelengthλd567.5-576.5nmIF=20mA
Spectral Line Half-WidthΔλ-15-nm-
Forward VoltageVF1.9-2.4VIF=20mA
Reverse CurrentIR--10μAVR=5V

3. Physical Dimensions


ParameterMinTypMaxUnit
Body Length-1.10-mm
Body Width0.70-0.80mm
Thickness-0.55-mm
Electrode Length (Anode/Cathode)-0.40-mm
Electrode Width-0.18-mm
Gap Between Electrodes-0.30-mm

Packaging and Handling

1. Packaging Specifications


ParameterDetail
Tape Type8mm emboss tape
Reel Size7" diameter (178±2.0mm)
Quantity per Reel5000 pieces
Minimum Remainder Quantity500 pieces
Tape Dimensions4.00±0.1mm width, 0.25±0.03mm thickness
Pad Dimensions (PCB Recommendation)0.8mm × 0.8mm (two pads, 2.3mm center distance)
ComplianceANSI/EIA 481 specifications

2. Recommended Reflow Soldering Conditions (Pb-Free)


StageTemperatureDuration
Ramp-UpMax 3°C/sec-
Preheat150–200°CMax 120 sec
Soak (≥217°C)-60–150 sec
Peak Temperature260°C (max)10–30 sec (within 5°C of peak)
Ramp-DownMax 6°C/sec-

3. Storage Requirements


ConditionSpecification
Sealed Package≤30°C, ≤90% RH, shelf life 1 year
Opened Package≤30°C, ≤60% RH, reflow within 672 hrs (MSL2a)
Extended Storage (Opened)Sealed container with desiccant or nitrogen ambient
Baking (After 672 hrs Open Storage)60°C for ≥20 hours before soldering

Binning Information

1. Forward Voltage (VF) Bins (IF=20mA, Unit: V)


BinMax ValueTolerance
-2.00±0.1V
-2.10±0.1V
-2.20±0.1V
-2.30±0.1V
-2.40±0.1V

2. Luminous Intensity (IV) Bins (IF=20mA, Unit: mcd)


BinMax ValueTolerance
-28.0±15%
-45.0±15%
-71.0±15%

3. Dominant Wavelength (λd) Bins (Unit: nm)


Bin CodeMinMaxTolerance
C567.5570.5±1nm
D570.5573.5±1nm
E573.5576.5±1nm

Application Guidelines

1. Typical Applications

  • Telecommunication equipment (cordless/cellular phones)
  • Office automation and home appliances
  • Industrial equipment status indicators
  • Keypad/keyboard backlighting
  • Micro-displays
  • Signal and symbol luminary

2. Drive Circuit Recommendation

  • LED is current-operated; use a series current-limiting resistor for each LED in parallel configurations (avoids brightness inconsistency)
  • Avoid parallel connection without current limiters (variations in I-V characteristics cause uneven brightness)

3. ESD Protection

  • Static electricity damages LEDs; use wrist bands, anti-electrostatic gloves, and grounded equipment
  • Neutralize static with ion blowers (prevents charge buildup on lens)
  • Test for ESD damage: Check Vf >[email protected] (AlInGaP product)

4. Cleaning Instructions

  • Use ethyl alcohol or isopropyl alcohol at room temperature
  • Immersion time ≤1 minute; avoid unspecified chemical cleaners (may damage package)

Reliability Testing


Test CategoryTest ItemConditionsReference Standard
EnduranceOperation LifeRoom temp, max rating, 1000hrsMIL-STD-750D:1026, MIL-STD-883D:1005
EnvironmentalHigh Temp/High Humidity Storage65±5°C, 90–95% RH, 240hrsMIL-STD-202F:103B
High Temp Storage105±5°C, 1000hrsMIL-STD-883D:1008
Low Temp Storage-55±5°C, 1000hrsJIS C 7021:B-12
Temperature Cycling105°C↔-55°C (30mins each), 10 cyclesMIL-STD-202F:107D
Thermal Shock85°C↔-40°C (10mins each), 10 cyclesMIL-STD-883D:1011
SolderingIR ReflowPeak 260°C, 10–30secJ-STD-020D
Solderability235±5°C, 2±0.5sec immer


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