Lite-On Inc. LTST-C191KGKT


- Part Number:
LTST-C191KGKT
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
- Description:
Green 571nm LED Indication - Discrete 2V 0603 (1608 Metric)
- In stock 152,475
Information of LTST-C191KGKT SMD LED
Basic Overview
- Product Type: Ultra-thin surface-mount device (SMD) LED with AlInGaP green chip
- Manufacturer: Lite-On Technology Corp.
- Document Reference: DS22-2000-228 (Rev. J, 06/22/2021)
- Core Function: Provides bright green illumination for backlighting, status indication, and signal luminary applications
- Key Features: RoHS compliant, extra-thin (0.55mm) profile, ultra-bright InGaN dice chip, EIA standard package, IR reflow solder compatible (260°C/10s), I.C. compatible, automatic placement friendly
- Key Identifiers:
Core Specifications
1. Absolute Maximum Ratings (Ta=25°C)
| Parameter | Value | Unit |
|---|---|---|
| Power Dissipation | 75 | mW |
| Peak Forward Current (1/10 duty cycle, 0.1ms pulse) | 80 | mA |
| DC Forward Current | 30 | mA |
| Reverse Voltage | 5 | V |
| Operating Temperature Range | -55 to +85 | °C |
| Storage Temperature Range | -55 to +85 | °C |
| IR Reflow Soldering Temperature | 260 (10s max) | °C |
2. Electrical and Optical Characteristics (Ta=25°C)
| Parameter | Symbol | Min | Typ | Max | Unit | Test Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | IV | 18.0 | - | 71.0 | mcd | IF=20mA |
| Viewing Angle (Half-Power) | 2θ1/2 | - | 130 | - | deg | - |
| Peak Emission Wavelength | λP | - | 574.0 | - | nm | Measured at peak |
| Dominant Wavelength | λd | 567.5 | - | 576.5 | nm | IF=20mA |
| Spectral Line Half-Width | Δλ | - | 15 | - | nm | - |
| Forward Voltage | VF | 1.9 | - | 2.4 | V | IF=20mA |
| Reverse Current | IR | - | - | 10 | μA | VR=5V |
3. Physical Dimensions
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Body Length | - | 1.10 | - | mm |
| Body Width | 0.70 | - | 0.80 | mm |
| Thickness | - | 0.55 | - | mm |
| Electrode Length (Anode/Cathode) | - | 0.40 | - | mm |
| Electrode Width | - | 0.18 | - | mm |
| Gap Between Electrodes | - | 0.30 | - | mm |
Packaging and Handling
1. Packaging Specifications
| Parameter | Detail |
|---|---|
| Tape Type | 8mm emboss tape |
| Reel Size | 7" diameter (178±2.0mm) |
| Quantity per Reel | 5000 pieces |
| Minimum Remainder Quantity | 500 pieces |
| Tape Dimensions | 4.00±0.1mm width, 0.25±0.03mm thickness |
| Pad Dimensions (PCB Recommendation) | 0.8mm × 0.8mm (two pads, 2.3mm center distance) |
| Compliance | ANSI/EIA 481 specifications |
2. Recommended Reflow Soldering Conditions (Pb-Free)
| Stage | Temperature | Duration |
|---|---|---|
| Ramp-Up | Max 3°C/sec | - |
| Preheat | 150–200°C | Max 120 sec |
| Soak (≥217°C) | - | 60–150 sec |
| Peak Temperature | 260°C (max) | 10–30 sec (within 5°C of peak) |
| Ramp-Down | Max 6°C/sec | - |
3. Storage Requirements
| Condition | Specification |
|---|---|
| Sealed Package | ≤30°C, ≤90% RH, shelf life 1 year |
| Opened Package | ≤30°C, ≤60% RH, reflow within 672 hrs (MSL2a) |
| Extended Storage (Opened) | Sealed container with desiccant or nitrogen ambient |
| Baking (After 672 hrs Open Storage) | 60°C for ≥20 hours before soldering |
Binning Information
1. Forward Voltage (VF) Bins (IF=20mA, Unit: V)
| Bin | Max Value | Tolerance |
|---|---|---|
| - | 2.00 | ±0.1V |
| - | 2.10 | ±0.1V |
| - | 2.20 | ±0.1V |
| - | 2.30 | ±0.1V |
| - | 2.40 | ±0.1V |
2. Luminous Intensity (IV) Bins (IF=20mA, Unit: mcd)
| Bin | Max Value | Tolerance |
|---|---|---|
| - | 28.0 | ±15% |
| - | 45.0 | ±15% |
| - | 71.0 | ±15% |
3. Dominant Wavelength (λd) Bins (Unit: nm)
| Bin Code | Min | Max | Tolerance |
|---|---|---|---|
| C | 567.5 | 570.5 | ±1nm |
| D | 570.5 | 573.5 | ±1nm |
| E | 573.5 | 576.5 | ±1nm |
Application Guidelines
1. Typical Applications
- Telecommunication equipment (cordless/cellular phones)
- Office automation and home appliances
- Industrial equipment status indicators
- Keypad/keyboard backlighting
- Micro-displays
- Signal and symbol luminary
2. Drive Circuit Recommendation
- LED is current-operated; use a series current-limiting resistor for each LED in parallel configurations (avoids brightness inconsistency)
- Avoid parallel connection without current limiters (variations in I-V characteristics cause uneven brightness)
3. ESD Protection
- Static electricity damages LEDs; use wrist bands, anti-electrostatic gloves, and grounded equipment
- Neutralize static with ion blowers (prevents charge buildup on lens)
- Test for ESD damage: Check Vf >[email protected] (AlInGaP product)
4. Cleaning Instructions
- Use ethyl alcohol or isopropyl alcohol at room temperature
- Immersion time ≤1 minute; avoid unspecified chemical cleaners (may damage package)
Reliability Testing
| Test Category | Test Item | Conditions | Reference Standard |
|---|---|---|---|
| Endurance | Operation Life | Room temp, max rating, 1000hrs | MIL-STD-750D:1026, MIL-STD-883D:1005 |
| Environmental | High Temp/High Humidity Storage | 65±5°C, 90–95% RH, 240hrs | MIL-STD-202F:103B |
| High Temp Storage | 105±5°C, 1000hrs | MIL-STD-883D:1008 | |
| Low Temp Storage | -55±5°C, 1000hrs | JIS C 7021:B-12 | |
| Temperature Cycling | 105°C↔-55°C (30mins each), 10 cycles | MIL-STD-202F:107D | |
| Thermal Shock | 85°C↔-40°C (10mins each), 10 cycles | MIL-STD-883D:1011 | |
| Soldering | IR Reflow | Peak 260°C, 10–30sec | J-STD-020D |
| Solderability | 235±5°C, 2±0.5sec immer |
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Lite-On Inc.

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