DESCRIPTION

· High-performance, low-power IMPACT™ PAL® circuits.

· Functionally equivalent but faster than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A.

· Utilizes Advanced Low-Power Schottky technology with titanium-tungsten fuses.

· Available in both plastic and ceramic chip carriers, as well as plastic and ceramic DIPs.

· Characterized for operation from 0°C to 75°C (C suffix) and -55°C to 125°C (M suffix).p>

FEATURES

· Propagation delay: 25 ns max for C suffix, 30 ns max for M suffix.

· Power-up clear on registered devices (all register outputs set high, output pins go low).

· Easy programmability for quick design of custom functions.

· Compact circuit board design with available chip carriers for further space reduction.

· Dependable Texas Instruments quality and reliability.

APPLICATIONS

· Custom logic functions in compact designs.

· High-speed logic applications requiring reliable performance.

· Military and industrial applications with wide temperature range requirements.

· Space-constrained circuit boards utilizing chip carriers.