NFM41PC155B1H3L Device Information Summary

Overview

The NFM41PC155B1H3L is a Large Current 3-Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general-purpose electronic applications. It is manufactured by Murata and is suitable for use in a variety of circuits requiring high current handling and low equivalent series inductance (ESL).

Part Number Breakdown

• NFM: Series identifier.
• 41: Dimensions code.
• PC: Features code.
• 155: Nominal capacitance code (1.5 µF).
• B: Characteristics code.
• 1H: DC rated voltage code (50 V).
• 3: Packaging code.

Key Features

• Nominal Capacitance: 1.5 µF.
• DC Rated Voltage: 50 V.
• Rated Current: 6 A (DC).
• DC Resistance: 9 mΩ max.
• Insulation Resistance: 100 MΩ min.
• Operating Temperature Range: -55°C to +85°C.
• Storage Temperature Range: -55°C to +85°C.
• Package Type: SC-75/SOT-416.

Dimensions

• Length (L): 4.5 ± 0.3 mm.
• Width (W): 1.6 ± 0.3 mm.
• Height (H): 1.0 ± 0.2 mm.
• Lead Length (e): 0.4 ± 0.3 mm.
• Lead Width (b): 0.7 mm min.
• Lead Separation (T): 1.5 ± 0.3 mm.

Electrical Characteristics

• Capacitance Tolerance: ±20%.
• Insulation Resistance (I.R.): 100 MΩ min.
• Withstanding Voltage: Rated voltage x 250% for 1 to 5 seconds.
• Operating Temperature: -55°C to +85°C.
• Storage Temperature: -55°C to +85°C.

Packaging

• Marking: EMBOSSED W12P4.
• Packaging Unit: 4000 pcs./Reel.
• Reel Dimensions: 180 mm.

Test Methods

• Capacitance Measurement: Frequency 1.0 ± 0.1 kHz, Voltage 1 ± 0.2 V (rms).
• Insulation Resistance: Applied voltage at rated voltage for 2 minutes max.
• DC Resistance: Measured with 100 mA max.
• Withstanding Voltage: Test voltage at rated voltage x 250% for 1 to 5 seconds.
• Operating Temperature: Includes self-heating.
• Storage Temperature: As specified in the rated value.

Mechanical Performance

• Appearance and Dimensions: Visual inspection and measurement.
• Solderability: Flux solution of rosin ethanol 25% (mass), pre-heat 150 ± 10°C, solder Sn-3.0Ag-0.5Cu, solder temperature 240 ± 3°C.
• Resistance to Soldering Heat: Pre-heat 150 ± 10°C, solder temperature 270 ± 5°C.
• Bending Strength: Deflection 2 mm, keeping time 30 seconds.
• Drop Test: Free fall from a height of 1 meter, total 10 times.
• Bonding Strength: Applying force 9.8 N, applying time 30 seconds.
• Vibration: Oscillation frequency 10 to 2000 Hz, total amplitude 1.5 mm or acceleration amplitude 196 m/s².

Environmental and Reliability Tests

• Temperature Cycling: -55°C to +85°C, 10 cycles.
• Humidity Test: 70 ± 2°C, 90 to 95% RH, 1000 hours.
• Humidity Life: 70 ± 2°C, 90 to 95% RH, 500 hours.
• Heat Life: -85°C, 1000 hours, rated voltage x 200%.
• Cold Resistance: -55°C, 500 hours.

Storage and Handling

• Storage Conditions: Room temperature +5°C to +40°C, relative humidity 20% to 80%.
• Long-term Storage: Check packaging, mounting, and solderability after more than six months.
• Corrosive Gases: Avoid storage in atmospheres containing corrosive gases.
• Direct Sunlight: Avoid exposure to direct sunlight or high humidity.

Soldering and Mounting

• Mounting Position: Minimize stress on the capacitor during flexing or bending of the PCB.
• Preheating: Required to prevent mechanical damage due to sudden temperature changes.
• Reflow Soldering: Peak temperature 240 to 260°C, preheating 140 to 160°C.
• Flow Soldering: Peak temperature 250 to 260°C, preheating 140 to 160°C.
• Solder Amount: Optimize solder amount to avoid excessive fillet height or insufficient adhesion.

Additional Information

• Applications: General-purpose electronic circuits requiring high current and low ESL.
• Documentation: Refer to the datasheet for detailed specifications and test methods.
• Contact Information: For further inquiries, contact Murata's technical support or sales representatives.