Qorvo QPA2610

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  • Part Number:

    QPA2610

  • Manufacturer:

    Qorvo

  • Category:

    RF Accessories

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf QPA2610_Datesheet

  • Description:

    RF Amplifier IC General Purpose 8.5GHz ~ 10.5GHz 24-QFN (5x5)

  • In stock 100
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Specifications
Type
Paramete
Type
Paramete
Supplier Device Package
24-QFN (5x5)
Grade
-
Mounting Type
Surface Mount
P1dB
-
RF Type
General Purpose
Voltage - Supply
-
Frequency
8.5GHz ~ 10.5GHz
Gain
38.5dB
Test Frequency
-
Current - Supply
-
Qualification
-
Noise Figure
-
Package / Case
24-VQFN Exposed Pad
Overview

QPA2610 Model Information

Model Overview

  • Model Number: QPA2610
  • Frequency Range: 8.5 – 10.5 GHz
  • Package Type: 5 mm x 5 mm plastic overmold QFN
  • Operating Temperature Range: -40°C to +85°C
  • Storage Temperature Range: -55°C to +100°C
  • Key Features
  • Output Power (PIN = 10 dBm): > 33 dBm
  • Power Added Efficiency (PAE) (PIN = 10 dBm): > 47%
  • Small Signal Gain: > 37.5 dB
  • Input Return Loss: > 14 dB
  • Output Return Loss: > 12 dB
  • Recommended Bias: VD = 20 V, IDQ = 56 mA
  • Package Size: 5.0 mm x 5.0 mm x 0.85 mm
  • Lead-free and RoHS Compliant
  • Product Overview
    Qorvo's QPA2610 is a high-performance power amplifier designed for X-Band applications. Fabricated on Qorvo's production 0.15 um GaN on SiC process (QGaN15), the QPA2610 delivers > 2 W of saturated output power and 23 dB of large-signal gain while achieving an impressive 47% power-added efficiency. The amplifier is packaged in a compact 5 x 5 mm plastic overmold QFN, making it suitable for phased array radar applications. The RF input and output ports are matched to 50 Ω and include integrated DC blocking capacitors. The QPA2610 is part of a three-amplifier family and is pin-compatible with QPA2612 and QPA2611.
  • Ordering Information
  • Part No.: QPA2610
  • Description: 2 Watt X-Band Power Amplifier
  • Part No.: QPA2610TR7
  • Description: 500 pcs. on 7 inch reel
  • Part No.: QPA2610EVB
  • Description: QPA2610 Evaluation Board
  • Applications
  • Radar: Suitable for radar systems requiring high power and efficiency
  • Communications: Ideal for high-frequency communication systems
  • Satcom: Suitable for satellite communication applications
  • Electrical Specifications
  • Operational Frequency: 8.5 – 10.5 GHz
  • Output Power (PIN = 10 dBm): > 33.9 dBm
  • Power Added Efficiency (PIN = 10 dBm): > 47.4%
  • Small Signal Gain (CW): > 38.5 dB
  • Input Return Loss (CW): > 19 dB
  • Output Return Loss (CW): > 14 dB
  • 3rd Order IMD (PIN/Tone = 0 dBm): -15 dBc at 10 MHz tone spacing
  • POUT Temp. Coeff. (85°C to 25°C, PIN = 10 dBm): -0.21 dB/°C
  • Small Signal Gain Temp. Coefficient (85°C to -40°C): -0.09 dB/°C
  • Gate Leakage Current (VD = 10 V, VG = -3.7 V): -1.23 mA
  • Absolute Maximum Ratings
  • Drain Voltage (VD): 29.5 V
  • Gate Voltage Range (VG): -4 to 0 V
  • Drain Current (ID): 700 mA
  • Gate Current (IG): See plot on page 16
  • Power Dissipation (PDISS), TBASE = 85 °C: 8.8 W
  • Input Power (PIN), Pulsed (100us/10%), 50 Ω, VD = 20 V, TBASE = 85 °C: 18 dBm
  • Input Power (PIN), Pulsed (100us/10%), VSWR 3:1, VD = 20 V, TBASE = 85 °C: 18 dBm
  • Mounting Temperature (30 seconds max.): 260 °C
  • Storage Temperature: -55 to 150 °C
  • Performance Plots
  • Output Power vs. Frequency: Varies with frequency and temperature, see charts for detailed data.
  • Power Added Efficiency vs. Frequency: Varies with frequency and temperature, see charts for detailed data.
  • Drain Current vs. Frequency: Varies with frequency and temperature, see charts for detailed data.
  • Gate Current vs. Frequency: Varies with frequency and temperature, see charts for detailed data.
  • Output Power vs. Input Power: Varies with input power and frequency, see charts for detailed data.
  • Power Added Efficiency vs. Input Power: Varies with input power and frequency, see charts for detailed data.
  • Drain Current vs. Input Power: Varies with input power and frequency, see charts for detailed data.
  • Gate Current vs. Input Power: Varies with input power and frequency, see charts for detailed data.
  • Thermal and Reliability Information
  • Thermal Resistance (θJC): 11.30 °C/W (Tbase = +85 °C, VD = 20 V, IDQ = 56 mA, PDISS = 1.12 W)
  • Channel Temperature (TCH): 97.7 °C (under RF conditions)
  • Bias-up and Bias-down Procedure
  • Bias-up: Set ID limit to 750 mA, IG limit to 10 mA. Apply -4 V to VG, then +20 V to VD. Adjust VG until IDQ = 56 mA.
  • Bias-down: Turn off RF signal. Reduce VG to -4 V, then set VD to 0 V. Turn off VD and VG supplies.
  • Mechanical Information
  • Package Base and Leads: Ni-Au plated
  • Part Markings: QPA2610, Assembly Year, Assembly Week, Lot Number
  • Handling Precautions
  • ESD-Sensitive Device: Handle with care to avoid ESD damage.
  • Moisture Sensitivity Level (MSL): Level 3
  • RoHS Compliance: Compliant with 2011/65/EU RoHS directive
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