TPS82150SILR - Package & Ordering Information

1. Core Device Overview

TPS82150SILR is an 17-V input, 1-A synchronous step-down converter in Texas Instruments’ 8-pin µSiP (SIL) package, part of the TPS82150 family optimized for compact size (3.0 mm × 2.8 mm × 1.5 mm) and high efficiency with an integrated inductor. It is pin-to-pin compatible with TPS82130 and TPS82140, operating over a temperature range of -40°C to 125°C.

2. Orderable Part Status & Key Attributes

3. Packaging & Carrier Details

3.1 Tape and Reel Configuration

• Package Quantity (SPQ): 3000 units per reel
• Carrier Type: LARGE T&R (Tape and Reel)
• Pin 1 Orientation: Quadrant Q1 (per tape pocket quadrant assignment)
• Reel & Tape Dimensional Specs (Nominal, mm)

3.2 Tape and Reel Box Dimensions (Nominal, mm)

• Length: 383.0
• Width: 353.0
• Height: 58.0

4. Package Mechanical Specifications (SIL0008D)

4.1 Core Package Dimensions (Nominal, mm)

• Max height: 1.53 mm
• Body size: 3.0 mm × 2.8 mm (nominal)
• Exposed thermal pad (required for soldering to GND for thermal/mechanical reliability)
• Pin pitch: 8× 0.42/0.38 mm (pin size), 6× 0.65 mm (spacing)
• Pick and place recommendation: Nozzle 1.3 mm or smaller

4.2 PCB Layout & Stencil Guidelines

• Land Pattern: Solder mask defined, 8× (0.5 mm) pin lands, 8× (0.4 mm) secondary lands, thermal pad with via array (0.2 mm via nominal)
• Stencil Design: 0.125 mm thick stencil, 85% solder coverage for exposed thermal pad by area, laser-cut apertures with trapezoidal walls/rounded corners recommended
• Thermal Pad Requirement: Must be soldered to PCB ground plane (bottom/internal layer) with vias for enhanced heat dissipation (per TI literature SLUA271)

5. Complementary Part (TPS82150SILT)

TPS82150SILT is the small-format reel variant of the same TPS82150SIL core, with key differences:

• SPQ: 250 units per reel
• Carrier: SMALL T&R
• Reel Diameter: 178.0 mm
• Reel Width (W1):13.2 mm
• Tape and Reel Box Dimensions: 223.0 (L) × 194.0 (W) × 35.0 (H) mm
• All other electrical/mechanical specs match TPS82150SILR.

6. Critical Packaging Notes

1. The exposed thermal pad of the µSiP package must be soldered to the PCB ground to achieve specified power dissipation and mechanical reliability.
2. Dimensioning and tolerancing follow ASME Y14.5M; all linear dimensions are in millimeters (parenthetical values for reference only).
3. Package drawings (SIL0008C/SIL0008D) are subject to change without notice.
4. For solder paste and stencil design, IPC-7525 standards may provide alternate recommendations.
5. TPS82150SILR.A is a variant of TPS82150SILR with identical production/performance specs, only differing in minor marking/packaging nuances.