Specification Sheet for SOT232N70S702K MOSFET

Basic Information

• Part Number: SOT232N70S702K
• Description: SMD Plastic-Encapsulate MOSFETs, SOT-23 series, 3 pads
• Type: 2N7002K Type, 60V N-Channel Enhancement Mode MOSFET
• Vendor: NextGen Components, Inc.
• Compliance: RoHS/RoHS III compliant
• Package: Tape/Reel, 3000pcs/Reel

Main Features

• High density cell design for low RDS(ON)
• Voltage controlled small signal switch
• Rugged and reliable
• High saturation current capability
• HMB ESD protected (2000V)

Applications

• Load Switch for Portable Devices
• DC/DC Converter

Package and Marking

• Package Code: SOT23
• Marking Code: 702K
• Dimensions:A: 1.0 - 1.4 mmA1: 0.10 mmb: 0.35 - 0.50 mmc: 0.10 - 0.20 mmD: 2.70 - 3.10 mmE: 1.40 - 1.60 mmE1: 2.40 - 2.80 mme: 1.9 mmL: 0.10 - 0.30 mmL1: 0.40 mmƟ: 0° - 10°

Electrical Characteristics (Ta=25°C unless otherwise specified)

Max. Ratings

• Drain-Source Voltage (VDS): 60V
• Gate-Source Voltage (VGS): ±20V
• Continuous Drain Current (ID): 0.6A
• Power Dissipation (PD): 0.3W
• Thermal Resistance (RθJA): 400°C/W
• Junction Temperature (TJ): +150°C
• Storage Temperature Range (TSTG): -50°C to +150°C

MOSFET Electrical Characteristics

• Drain-Source Breakdown Voltage (V(BR)DSS): 60V (VGS=0V, ID=250μA)
• Zero Gate Voltage Drain Current (IDSS): 1µA (VDS=60V, VGS=0V) at 25°C, 100µA at 125°C
• Gate-Body Leakage Current (IGSS): ±10µA (VGS=±20V, VDS=0V)
• Gate Threshold Voltage (VGS(TH)): 1.0 - 2.5V (VDS=VGS, ID=250μA)
• Drain-Source On-State Resistance (RDS(ON)):0.9Ω @ VGS=10V, ID=0.5A1.4Ω @ VGS=4.5V, ID=0.3A

Dynamic Electrical Characteristics

• Input Capacitance (Ciss): 23.8pF (VDS=30V, VGS=0V, f=1MHz)
• Output Capacitance (Coss): 3.9pF
• Reverse Transfer Capacitance (Crss): 1.5pF
• Total Gate Charge (Qg): 0.93nC (VDS=30V, ID=0.5A)

Switching Characteristics

• Turn on Delay Time (td(on)): 6ns (VDD=30V, ID=0.3A, RG=3.3Ω, VGS=10V)
• Turn on Rise Time (tr): 3.5ns
• Turn Off Delay Time (td(off)): 20ns
• Turn Off Fall Time (tf): 5.9ns

Source Drain Diode Characteristics

• Source drain current (Body Diode) (ISD): 0.2A (VGS=0V, ID=250μA)
• Forward on voltage (VSD): 0.78 - 1.2V (VDS=60V, VGS=0V)

Mechanical Data

• JEDEC SOT-23 molded plastic body
• Matte tin plated
• Polarity symbol marking on case
• Weight per piece: 0.00019 Ounce, 0.00591 grams

Reliability Tests

• Solder Resistance Test: 260°C±5°C for 10±2 sec.
• Solderability Test: 230°C±5°C for 5 sec.
• Pull Test: 1kg in axial lead direction for 10 sec.
• Bend Test: 0.5Kg Weight Applied To Each Lead, Bending Arcs 90°C±5°C for 3 times
• High Temperature Reverse Bias Test: TA=100°C for 1000 Hours at VR=80% Rated VR
• Forward Operation Life Test: TA=25°C Rated Average Rectified Current
• Intermittent Operation Life Test: On state: 5 min with rated IRMS, Power Off state: 5 min with Cool Forced Air, On and off for 1000 cycles
• Pressure Cooker Test: 15 PSIG, TA=121°C, 4 hours
• Temperature Cycling Test: -55°C to +125°C; 30 Minutes For Dwelled Time, 5 minutes for transferred time, Total: 10 cycles
• Thermal Shock Test: 0°C for 5 minutes, 100°C for 5 minutes, Total: 10 cycles
• Forward Surge Test: 8.3ms Single Sale Sine-wave One Surge
• Humidity Test: TA=65°C, RH=98% for 1000 hours
• High Temperature Storage life Test: 150°C for 1000 Hours

Suggested Reflow Profile

• Recommended peak temperature: over 245°C
• If peak temperature is below 245°C, adjust parameters: time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker)
• Welding shall not exceed 2 times
• Remark: lead-free solder paste (96.5 Sn/3.0 Ag/0.5Cu)

Packaging Information

• Carrier Width (A): 3.15 mm ± 0.1 mm
• Carrier Length (B): 2.77 mm ± 0.1 mm
• Carrier Depth (C): 1.22 mm ± 0.1 mm
• Sprocket Hole (d): 1.55 mm ± 0.05 mm
• Reel Outside Diameter (D): 178.00 mm ± 2.0 mm
• Reel Inner Diameter (D1): Min. 54.4 mm
• Feed Hole Diameter (D2): 13.00 mm ± 0.5 mm
• Sprocket Hole Position (E): 1.75 mm ± 0.1 mm
• Punch Hole Position (F): 3.50 mm ± 0.1 mm
• Punch Hole Pitch (P): 4.00 mm ± 0.1 mm
• Sprocket Hole Pitch (P0): 4.00 mm ± 0.1 mm
• Embossment Center (P1): 2.00 mm ± 0.1 mm
• Overall Tape Thickness (T): 0.25 mm ± 0.1 mm
• Tape Width (W): 8.00 mm ± 0.3 mm
• Reel Width (W1): 19.50 mm ± 1.0 mm

Disclaimer

NextGen Component, Inc. reserves the right to make changes to the product(s) and/or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.