Nexperia USA Inc. PEMD3,315

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Specifications
Type
Paramete
Type
Paramete
Power - Max
300mW
Qualification
-
Resistor - Emitter Base (R2)
10kOhms
Voltage - Collector Emitter Breakdown (Max)
50V
Frequency - Transition
-
Supplier Device Package
SOT-666
Package / Case
SOT-563, SOT-666
Grade
-
Transistor Type
1 NPN, 1 PNP - Pre-Biased (Dual)
Resistor - Base (R1)
10kOhms
Current - Collector (Ic) (Max)
100mA
DC Current Gain (hFE) (Min) @ Ic, Vce
30 @ 5mA, 5V
Mounting Type
Surface Mount
Current - Collector Cutoff (Max)
1µA
Vce Saturation (Max) @ Ib, Ic
150mV @ 500µA, 10mA
Overview

PEMD3 Datasheet Summary

Product Overview

The PEMD3 is a 50V, 100mA NPN/PNP resistor-equipped double transistor designed for low current applications. It features built-in bias resistors (R1 = 10kΩ, R2 = 10kΩ) and is housed in an ultra-small and flat lead SOT666 Surface-Mounted Device (SMD) plastic package. This device simplifies circuit design by reducing component count and pick-and-place costs.

Features

  • Output Current Capability: 100mA
  • Built-in Bias Resistors: R1 = 10kΩ, R2 = 10kΩ
  • Simplifies Circuit Design: Reduces component count and assembly costs
  • Suitable for Low Current Applications: Ideal for peripheral drivers and controlling IC inputs

Applications

  • Low Current Peripheral Driver: Suitable for driving low current devices
  • Controlling IC Inputs: Ideal for digital applications
  • Replaces General-Purpose Transistors: Can be used in various digital applications

Quick Reference Data

TableCopy


ParameterConditionsMinTypMaxUnit
Collector-Emitter Voltage (VCEO)Open base-150V
Output Current (IO)---100mA
Bias Resistor 1 (R1)[1]71013
Bias Resistor Ratio (R2/R1)[1]0.811.2-
[1] See "Section 11: Test Information" for resistor calculation and test conditions.

Pinning Information

TableCopy


PinSymbolDescription
1GND1Ground (emitter) TR1
21Input (base) TR1
302Output (collector) TR2
412Input (base) TR2
501Output (collector) TR1

Ordering Information

  • Type Number: PEMD3
  • Package: SOT666 (plastic, surface-mounted package; 6 leads; 0.5 mm pitch; 1.6mm x 1.2mm x 0.55mm body)
  • Version: SOT666

Marking

  • Marking Code: D3

Limiting Values

TableCopy


ParameterConditionsMinMaxUnit
Collector-Base Voltage (VCBO)Open emitter-50V
Collector-Emitter Voltage (VCEO)Open base-50V
Emitter-Base Voltage (VEBO)Open collector-40-10V
Input Voltage (VI)--10-40V
Output Current (IO)--100mA
Total Power Dissipation (Ptot)Tamb ≤ 25°C-200mW (per transistor)
Total Power Dissipation (Ptot)Tamb ≤ 25°C-300mW (per device)
Junction Temperature (Tj)--150°C
Ambient Temperature (Tamb)-65150°C
Storage Temperature (Tstg)-65150°C

Thermal Characteristics

TableCopy


ParameterConditionsMinTypMaxUnit
Junction to Ambient Thermal Resistance (Rth(j-a))[1]-625K/W (per transistor)
Junction to Ambient Thermal Resistance (Rth(j-a))[1]-417K/W (per device)
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided, 35μm copper, tin-plated, and standard footprint.

Characteristics

TableCopy


ParameterConditionsMinTypMaxUnit
Collector-Base Breakdown Voltage (V(BR)CBO)IC = 100 µA, IE = 0 A, Tamb = 25°C50--V
Collector-Emitter Breakdown Voltage (V(BR)CEO)IC = 2 mA, IB = 0 A, Tamb = 25°C50--V
Collector-Base Cut-Off Current (ICBO)VCB = 50 V, IE = 0 A, Tamb = 25°C--100nA
Collector-Emitter Cut-Off Current (ICEO)VCE = 30 V, IB = 0 A, Tamb = 25°C--1µA
Emitter-Base Cut-Off Current (IEBO)VEB = 5 V, IC = 0 mA, Tamb = 25°C--400µA
DC Current Gain (hFE)VCE = 5 V, IC = 5 mA, Tamb = 25°C30---
Collector-Emitter Saturation Voltage (VCEsat)IC = 10 mA, IB = 0.5 mA, Tamb = 25°C--150mV
Off-State Input Voltage (VI(off))VCE = 5 V, IC = 100 µA, Tamb = 25°C-1.10.8V
On-State Input Voltage (VI(on))VCE = 0.3 V, IC = 10 mA, Tamb = 25°C2.51.8-V
Bias Resistor 1 (R1)[1]71013
Bias Resistor Ratio (R2/R1)[1]0.811.2-
[1] See "Section 11: Test Information" for resistor calculation and test conditions.

Package Outline

  • Package Type: SOT666
  • Dimensions: 1.6mm x 1.2mm x 0.55mm body, 0.5 mm pitch, 6 leads

Soldering Information

  • Reflow Soldering Footprint: Suitable for SOT666 package
  • Solder Lands: 0.4mm (6x)
  • Placement Area: 1.075mm x 0.55mm
  • Solder Paste Occupied Area: 0.325mm x 0.375mm (4x)

Revision History

  • Document ID: PEMD3v.12
  • Release Date: 2022-12-28
  • Changes: Family data sheet reduced to single type data sheet. Product(s) changed to non-automotive qualification.


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