Renesas CA3083M96

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Specifications
Type
Paramete
Type
Paramete
Current - Collector (Ic) (Max)
100mA
Qualification
-
Grade
-
Transistor Type
5 NPN
Frequency - Transition
450MHz
Package / Case
16-SOIC (0.154", 3.90mm Width)
Operating Temperature
150°C (TJ)
Power - Max
500mW
Vce Saturation (Max) @ Ib, Ic
700mV @ 5mA, 50mA
Mounting Type
Surface Mount
Voltage - Collector Emitter Breakdown (Max)
15V
Current - Collector Cutoff (Max)
10µA
DC Current Gain (hFE) (Min) @ Ic, Vce
40 @ 50mA, 3V
Supplier Device Package
16-SOIC
Overview

Information of CA3083M96 NPN Transistor Array

Basic Overview

  • Product Type: General-purpose high-current NPN transistor array
  • Manufacturer: Intersil Corporation
  • Document Reference: FN481.7 (December 15, 2011)
  • Core Configuration: 5 independent high-current NPN transistors on a common monolithic substrate; Q1 and Q2 are matched for low-offset applications
  • Key Features: High collector current (up to 100mA), low saturation voltage, separate substrate connection, Pb-free RoHS-compliant, wide operating temperature range
  • Target Applications: Signal processing/switching (DC to VHF), lamp/relay drivers, differential amplifiers, temperature-compensated amplifiers, thyristor firing

Core Specifications

1. Absolute Maximum Ratings (Per Transistor)


ParameterSpecification
Collector-to-Emitter Voltage (VCEO)15V
Collector-to-Base Voltage (VCBO)20V
Collector-to-Substrate Voltage (VCIO)20V
Emitter-to-Base Voltage (VEBO)5V (Min), 6.9V (Typ)
Collector Current (IC)100mA (Max)
Base Current (IB)20mA (Max)
Maximum Power Dissipation (Per Transistor)500mW
Junction Temperature (Plastic Package)150°C (Max)
Storage Temperature Range-65°C to 150°C
Lead Temperature (Soldering, 10s)300°C (SOIC, lead tips only)

2. Thermal Characteristics (SOIC Package)


ParameterSpecification
Thermal Resistance (θJA)200°C/W (Typ)
Thermal Resistance (θJC)N/A

3. Electrical Performance (TA=25°C)


ParameterSymbolTest ConditionsMinTypMaxUnits
Collector-to-Base Breakdown VoltageV(BR)CBOIC=100μA, IE=02060-V
Collector-to-Emitter Breakdown VoltageV(BR)CEOIC=1mA, IB=01524-V
Collector-to-Substrate Breakdown VoltageV(BR)CIOICI=100μA, IB=0, IE=02060-V
Collector Cutoff Current (CEO)ICEOVCE=10V, IB=0--10μA
Collector Cutoff Current (CBO)ICBOVCB=10V, IE=0--1μA
DC Forward Current Transfer RatiohFEVCE=3V, IC=10mA4076--
VCE=3V, IC=50mA4075--
Base-to-Emitter VoltageVBEVCE=3V, IC=10mA0.650.740.85V
Collector-to-Emitter Saturation VoltageVCE(SAT)IC=50mA, IB=5mA-0.400.70V
Gain Bandwidth ProductfTVCE=3V, IC=10mA-450-MHz

4. Matched Pair (Q1 & Q2, Differential Amplifier Configuration)


ParameterSymbolTest ConditionsTypMaxUnits
Absolute Input Offset VoltageVIOLVCE=3V, IC=1mA1.25mV
Absolute Input Offset CurrentIIOLVCE=3V, IC=1mA0.72.5μA

Package and Mechanical Details

1. Package Specifications


ParameterSpecification
Package Type16-lead SOIC (Small Outline Integrated Circuit)
Package Drawing NumberM16.15
Packaging MethodTape and Reel
Part Marking3083
Lead Finish100% matte tin (Pb-free, RoHS compliant)
Moisture Sensitivity Level (MSL)Meets IPC/JEDEC J-STD-020 requirements for Pb-free reflow

2. Key Package Notes

  • Pb-free compatibility: Suitable for both SnPb and Pb-free soldering operations
  • Substrate Connection: Terminal 5 (separate substrate pin) must be connected to a voltage more negative than any collector voltage (or DC/signal ground) for transistor isolation
  • SOIC Package Restriction: Soldering limited to lead tips only (300°C for 10s max)

Ordering and Compliance


Orderable Part NumberPart MarkingTemperature RangePackageCompliance
CA3083M963083-55°C to 125°C16-lead SOIC (Tape and Reel)RoHS compliant, Pb-free

Complementary Part Variants

  • CA3083: 16-lead PDIP (through-hole, -55°C to 125°C)
  • CA3083Z: 16-lead Pb-free PDIP (wave solder only)
  • CA3083MZ: 16-lead Pb-free SOIC
  • CA3083MZ96: 16-lead Pb-free SOIC (Tape and Reel)

Operational Guidelines

  • Substrate Handling: Connect substrate terminal to ground (DC or AC) with a bypass capacitor to avoid cross-coupling between transistors
  • Matching Usage: Utilize Q1 and Q2 for low-offset applications (e.g., differential amplifiers) to leverage their matched VBE and input offset parameters
  • Temperature Considerations: Operate within -55°C to 125°C ambient temperature; hFE and VBE vary with temperature (refer to Typical Performance Curves)
  • ESD Sensitivity: Follow proper IC handling procedures to prevent electrostatic discharge damage


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