Renesas CA3083M96


- Part Number:
CA3083M96
- Manufacturer:
- Category:
- RoHs:
Non-RoHS Compliant - Datasheet:
CA3083M96_Datesheet - Description:
TRANS 5NPN 15V 0.1A 16SOIC
- In stock 0
Information of CA3083M96 NPN Transistor Array
Basic Overview
- Product Type: General-purpose high-current NPN transistor array
- Manufacturer: Intersil Corporation
- Document Reference: FN481.7 (December 15, 2011)
- Core Configuration: 5 independent high-current NPN transistors on a common monolithic substrate; Q1 and Q2 are matched for low-offset applications
- Key Features: High collector current (up to 100mA), low saturation voltage, separate substrate connection, Pb-free RoHS-compliant, wide operating temperature range
- Target Applications: Signal processing/switching (DC to VHF), lamp/relay drivers, differential amplifiers, temperature-compensated amplifiers, thyristor firing
Core Specifications
1. Absolute Maximum Ratings (Per Transistor)
| Parameter | Specification |
|---|---|
| Collector-to-Emitter Voltage (VCEO) | 15V |
| Collector-to-Base Voltage (VCBO) | 20V |
| Collector-to-Substrate Voltage (VCIO) | 20V |
| Emitter-to-Base Voltage (VEBO) | 5V (Min), 6.9V (Typ) |
| Collector Current (IC) | 100mA (Max) |
| Base Current (IB) | 20mA (Max) |
| Maximum Power Dissipation (Per Transistor) | 500mW |
| Junction Temperature (Plastic Package) | 150°C (Max) |
| Storage Temperature Range | -65°C to 150°C |
| Lead Temperature (Soldering, 10s) | 300°C (SOIC, lead tips only) |
2. Thermal Characteristics (SOIC Package)
| Parameter | Specification |
|---|---|
| Thermal Resistance (θJA) | 200°C/W (Typ) |
| Thermal Resistance (θJC) | N/A |
3. Electrical Performance (TA=25°C)
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Units |
|---|---|---|---|---|---|---|
| Collector-to-Base Breakdown Voltage | V(BR)CBO | IC=100μA, IE=0 | 20 | 60 | - | V |
| Collector-to-Emitter Breakdown Voltage | V(BR)CEO | IC=1mA, IB=0 | 15 | 24 | - | V |
| Collector-to-Substrate Breakdown Voltage | V(BR)CIO | ICI=100μA, IB=0, IE=0 | 20 | 60 | - | V |
| Collector Cutoff Current (CEO) | ICEO | VCE=10V, IB=0 | - | - | 10 | μA |
| Collector Cutoff Current (CBO) | ICBO | VCB=10V, IE=0 | - | - | 1 | μA |
| DC Forward Current Transfer Ratio | hFE | VCE=3V, IC=10mA | 40 | 76 | - | - |
| VCE=3V, IC=50mA | 40 | 75 | - | - | ||
| Base-to-Emitter Voltage | VBE | VCE=3V, IC=10mA | 0.65 | 0.74 | 0.85 | V |
| Collector-to-Emitter Saturation Voltage | VCE(SAT) | IC=50mA, IB=5mA | - | 0.40 | 0.70 | V |
| Gain Bandwidth Product | fT | VCE=3V, IC=10mA | - | 450 | - | MHz |
4. Matched Pair (Q1 & Q2, Differential Amplifier Configuration)
| Parameter | Symbol | Test Conditions | Typ | Max | Units |
|---|---|---|---|---|---|
| Absolute Input Offset Voltage | VIOL | VCE=3V, IC=1mA | 1.2 | 5 | mV |
| Absolute Input Offset Current | IIOL | VCE=3V, IC=1mA | 0.7 | 2.5 | μA |
Package and Mechanical Details
1. Package Specifications
| Parameter | Specification |
|---|---|
| Package Type | 16-lead SOIC (Small Outline Integrated Circuit) |
| Package Drawing Number | M16.15 |
| Packaging Method | Tape and Reel |
| Part Marking | 3083 |
| Lead Finish | 100% matte tin (Pb-free, RoHS compliant) |
| Moisture Sensitivity Level (MSL) | Meets IPC/JEDEC J-STD-020 requirements for Pb-free reflow |
2. Key Package Notes
- Pb-free compatibility: Suitable for both SnPb and Pb-free soldering operations
- Substrate Connection: Terminal 5 (separate substrate pin) must be connected to a voltage more negative than any collector voltage (or DC/signal ground) for transistor isolation
- SOIC Package Restriction: Soldering limited to lead tips only (300°C for 10s max)
Ordering and Compliance
| Orderable Part Number | Part Marking | Temperature Range | Package | Compliance |
|---|---|---|---|---|
| CA3083M96 | 3083 | -55°C to 125°C | 16-lead SOIC (Tape and Reel) | RoHS compliant, Pb-free |
Complementary Part Variants
- CA3083: 16-lead PDIP (through-hole, -55°C to 125°C)
- CA3083Z: 16-lead Pb-free PDIP (wave solder only)
- CA3083MZ: 16-lead Pb-free SOIC
- CA3083MZ96: 16-lead Pb-free SOIC (Tape and Reel)
Operational Guidelines
- Substrate Handling: Connect substrate terminal to ground (DC or AC) with a bypass capacitor to avoid cross-coupling between transistors
- Matching Usage: Utilize Q1 and Q2 for low-offset applications (e.g., differential amplifiers) to leverage their matched VBE and input offset parameters
- Temperature Considerations: Operate within -55°C to 125°C ambient temperature; hFE and VBE vary with temperature (refer to Typical Performance Curves)
- ESD Sensitivity: Follow proper IC handling procedures to prevent electrostatic discharge damage
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