Analog Devices Inc.(ADI) ICM7212AI/D

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Specifications
Type
Paramete
Type
Paramete
Operating Temperature
-20°C ~ 85°C
Package / Case
Die
Current - Supply
200 mA
Mounting Type
Surface Mount
Qualification
-
Voltage - Supply
4V ~ 6V
Configuration
7 Segment
Supplier Device Package
Die
Display Type
LED
Grade
-
Digits or Characters
4 Digits
Interface
BCD
Overview

ICM7212A Display Driver - Comprehensive Datasheet Summary

1. General Overview

ICM7212A is a four-digit, seven-segment LED display decoder/driver designed to drive non-multiplexed common-anode LED displays. It includes input data latches, BCD-to-segment decoders, and all necessary level translation and timing circuits.

Key Features:

  • Directly drives four-digit, 7-segment common-anode LED displays
  • No external components required
  • Low power CMOS technology
  • Code B output character font (suffix "A" indicates Code B font)
  • Available in two interface versions: Multiplexed BCD and Microprocessor (μP) interface
  • Reduces system cost by eliminating external level translators, segment drivers, and current-limiting resistors
  • 28 open-drain constant-current outputs (8mA typical per segment)


2. Device Nomenclature and Ordering Information

Device Types:

  • ICM7212: Hexadecimal output font
  • ICM7212A: Code B output font
  • ICM7212M: Microprocessor interface, hexadecimal font
  • ICM7212AM: Microprocessor interface, Code B font

Part Numbers and Packages:


Part NumberTemperature RangePackage
ICM7212AIPL-20°C to +85°C40-Lead Plastic DIP
ICM7212AIQ-20°C to +85°C44-Lead Plastic Chip Carrier (Quad Pack)
ICM7212AMIPL-20°C to +85°C40-Lead Plastic DIP (μP interface)
ICM7212AMIQ-20°C to +85°C44-Lead Plastic Chip Carrier (μP interface)
Note: Parts are also available in die form by adding "C/D" suffix (e.g., ICM7212AIC/D)


3. Pin Configurations

40-Lead DIP (Multiplexed BCD Version):


PinNameFunction
1V+Supply Voltage (+5V)
5BRTBrightness Control Input
27-34D1-D4, B0-B3BCD Data Inputs
35-38DIGIT SELECTDigit Strobe Inputs (D4-D1)
39-40, 2-4, 6-19SEGMENT OUTPUTS28 segment drivers (a-g, DP for 4 digits)
36OSCOscillator Input (unused for LED version)
MultipleGNDGround Pins

40-Lead DIP (Microprocessor Interface Version - M Suffix):

TableCopy


PinNameFunction
31-34DATA INPUTSBCD Data (D1-D4, B0-B3)
35-36DIGIT SELECTAddress lines (DS1, DS2)
33-34CHIP SELECTActive-low chip selects (CS1, CS2)

44-Lead Chip Carrier (Q Package):

  • Same functionality as DIP but in surface-mount Quad Pack configuration


4. Electrical Characteristics

Absolute Maximum Ratings:

  • Supply Voltage: 6.5V
  • Input Voltage: V+ + 0.3V to GND - 0.3V
  • Power Dissipation: 0.5W @ 70°C (package limit)
  • Operating Temperature: -20°C to +85°C
  • Storage Temperature: -55°C to +125°C

Operating Characteristics (V+ = 5V, TA = 25°C):

ICM7212A (Common Anode LED):


ParameterSymbolMinTypMaxUnits
Operating Supply VoltageVSUPP456V
Operating Current (Display Off)IOP-50100μA
Operating Current (Display all 8s)IOP-200-mA
Segment Leakage Current (Off)ISLK-±0.01±1μA
Segment On Current (Vo = 3V)ISEG689mA
Input Characteristics:

TableCopy
ParameterSymbolMinMaxUnits
Logical "1" Input VoltageVIH3V+V
Logical "0" Input VoltageVIL01V
Input Leakage CurrentILK±0.01±1μA
Input CapacitanceCIN-5pF


5. Functional Description

5.1 Digital Interface Options

A. Multiplexed BCD Interface

  • 8 input lines: 4 BCD data lines (D1-D4, B0-B3) + 4 digit strobes (DIGIT SELECT D4-D1)
  • Operation: When a digit strobe goes high, an internal pulse latches decoded data into the 7-bit latch for that digit
  • Data Setup Time: -100 ns (negative setup time allows strobe before data valid)
  • Data Hold Time: 200 ns minimum
  • Truth Table:Strobe high → Latch data for that digitStrobe low → Data held constant, no updates

B. Microprocessor Interface (M Suffix)

  • 8 input lines: 4 BCD data lines + 2 digit address lines (DS1, DS2) + 2 active-low chip selects (CS1, CS2)
  • Operation: Data written when both CS lines are low; internal one-shot transfers data to digit latch
  • Accessed as: 4 "write-only" memory locations
  • Chip Select Pulse Width: 200 ns minimum
  • Data Setup/Hold: 100 ns setup, 10 ns hold

5.2 Character Font (Code B - ICM7212A)

TableCopy


Binary InputHexadecimal Display (ICM7212)Code B Display (ICM7212A)
0000 - 10010 - 90 - 9
1010A- (dash)
1011b(blank)
1100C(blank)
1101d(blank)
1110E(blank)
1111F(blank)


6. Timing Characteristics

Multiplexed Input Configuration:

  • Digit Select Active Pulse Width: 1 μs minimum
  • Inter-Digit Select Time: 2 μs minimum

Microprocessor Interface:

  • Chip Select Active Pulse Width: 200 ns
  • Inter-Chip Select Time: 2 μs
  • Data Ready Pulse: Automatic one-shot generation


7. Application Information

7.1 Brightness Control

Two methods for LED brightness adjustment:

Method 1: Voltage Control

  • BRT pin (pin 5) voltage controls segment current
  • Use 100kΩ to 1MΩ potentiometer
  • Can be combined with photoresistor for automatic ambient light adjustment
  • Method 2: Duty Cycle Modulation
  • Pulse BRT pin between "full on" and "blanked" states
  • Can use ICM7555 timer or similar circuit
  • Allows PWM-based brightness control

7.2 Power Dissipation Management

Maximum power dissipation must not exceed 500mW @ 70°C.

Example Calculation (Display "8888"):

  • Power = 28 segments × 8mA × (5V - 1.6V) = 760mW (EXCEEDS LIMIT)
  • Solutions:
  1. Reduce LED current: Use brightness control
  2. Reduce voltage across drivers:Lower system V+ supplyAdd series diodes (2 diodes reduce power by ~35%)

7.3 Display Blanking

  • BRT pin at V+ → Full brightness
  • BRT pin at GND → Display blanked (all segments off)


8. Typical Application Circuits

8.1 Basic 4-Digit LED Display


+5V → V+ (Pin 1)
BRT (Pin 5) → Brightness control potentiometer
Data inputs → Microcontroller BCD outputs
Digit strobes → Microcontroller select lines
28 segment outputs → LED display segments
GND → Ground pins

8.2 Microprocessor Interface Example (8048)

  • Use MOVX instructions to address external RAM locations
  • 74LS138 decoder generates CS signals for 8 blocks of 4 bytes each
  • Starting address: 32 decimal

8.3 Reducing Power Dissipation

Copy


+5V → V+ (Pin 1)
BRT (Pin 5) → Brightness control
LED Display Anodes → +5V through 2× 1N4001 diodes
Segment outputs → LED segments
This reduces voltage across drivers from 3.4V to 2.2V


9. Physical Characteristics

Package Details:

  • 40-Lead Plastic DIP (PL):Dimensions: 0.600" - 0.620" width, 2.086" lengthThermal Resistance: θJA = 10°C/W, θJC = 45°C/W
  • 44-Lead Chip Carrier (Q):Quad Pack surface mount package0.050" lead spacing

ESD Protection:

  • All pins except pin 29: >2000V (MIL-STD-883B)
  • Pin 29: 1500V (due to special test functions)


10. Design Considerations

Important Notes:

  1. Power Sequencing: In multi-supply systems, power ICM7212 first before applying signals from external sources
  2. Latch-up Prevention: Do not apply voltages >V+ or <GND to any terminal due to SCR structure in CMOS process
  3. Unused Segments: Should be tied to ground, not left floating
  4. Grounding: Use both ground pins for high current applications to minimize IR drops
  5. Thermal Management: Monitor power dissipation especially when driving all segments at high ambient temperatures


11. Related Products

  • ICM7211: LCD display driver version (non-multiplexed)
  • ICM7217: 4-digit LED decoder with multiplexed output capability
  • ICL7135: 4½ digit A/D converter (can interface with ICM7212A)
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