Samsung KLM8G1GETF‑B041 Comprehensive Datasheet Summary

1. Basic Device Information

• Full Part Number: KLM8G1GETF‑B041
• Device Type: Embedded Multimedia Card (e·MMC)
• Capacity: 8GB
• Interface Standard: e·MMC 5.1 (JEDEC standard)
• NAND Flash Configuration: 64Gb × 1
• Package: 153‑ball FBGA
• Dimensions: 11.5 mm × 13 mm × 0.8 mm
• Document Version: Rev. 1.21 (July 2017)
• Status: Mass production

2. Core Features

• Supports HS400 high‑speed mode (up to 400 MB/s)
• Supports HS200, DDR52, and legacy high‑speed modes
• Data bus width: 1‑bit (default), 4‑bit, 8‑bit
• Clock frequency: up to 200 MHz for HS400/HS200
• Embedded controller with ECC, wear leveling, bad block management
• Supports Command Queuing, Enhanced Strobe, Secure Write Protection
• Supports RPMB (Replay Protected Memory Block) with improved throughput
• Supports partition management: boot, RPMB, general‑purpose, user, enhanced areas
• Auto power saving mode for low power consumption

3. Voltage Specifications

• Memory Core Voltage (VCC): 2.7 V – 3.6 V
• Interface I/O Voltage (VCCQ): 1.70 V – 1.95 V or 2.7 V – 3.6 V
• Ground (VSS): –0.5 V – +0.5 V

4. Temperature Range

• Operating Temperature: –25 °C to +85 °C
• Storage Temperature: –40 °C to +85 °C

5. Performance Specifications

• Sequential Read: Up to 330 MB/s (8‑bit, HS400)
• Sequential Write: 50 MB/s (8‑bit, HS400)
• Command Queue Depth: 16 levels (CMDQ_DEPTH = 0x0F)
• Boot ACK Time: < 50 ms
• Boot Data Time: < 100 ms
• Initialization Time: < 3 s (with partition); < 1 s (default)

6. Partition & Memory Layout

• Boot Partitions (2): 4096 KB each
• RPMB Partition: 512 KB default (max 4096 KB)
• User Density: 7,818,182,656 bytes
• Max Enhanced Partition Size: 3,909,091,328 bytes
• Supports 4 general‑purpose partitions (GPP)

7. Package & Pin Configuration

• Package: 153‑ball FBGA
• Size: 11.5 × 13 × 0.8 mm
• Key Signals:

8. AC & DC Characteristics

AC Timing (HS400)

• Clock cycle time: 5 ns min
• Input setup/hold time: 0.4 ns
• Slew rate: 1.125 V/ns

DC Parameters

• Active current (VCCQ): 180 mA (typ)
• Standby current (25 °C): 400 μA (typ)
• Sleep current (25 °C): 120 μA (typ)

9. Supported e·MMC 5.1 Features

• Command Queuing (CMDQ)
• Enhanced Strobe mode
• Improved RPMB throughput
• Secure Write Protection
• Cache control & flush
• Background operations (BKOPS)
• Field Firmware Update (FFU)
• Partition configuration & protection

10. Registers Summary

• OCR: Supports 1.70–1.95 V and 2.7–3.6 V I/O
• CID: Manufacturer ID 0x15; device name encodes 8GB
• CSD: Defines access timing, block length, device size
• EXT_CSD: Rev 0x08 (e·MMC 5.1); enables HS400, CMDQ, RPMB, WP

11. Reliability & Quality

• Integrated ECC, bad block management, wear leveling
• Data integrity during power failure
• Hardware reset (RST_n) support
• RoHS compliant, halogen‑free available

12. Target Applications

• Smartphones, tablets, portable devices
• Automotive infotainment
• Industrial embedded systems
• IoT gateways & edge devices
• Set‑top boxes & digital signage