Micron DDR4 SDRAM – MT40A1G16TB-062E:F TR Full Specification Summary

1. Basic Identification

• Manufacturer: Micron Technology Inc.
• Part Number: MT40A1G16TB-062E:F TR
• Product Type: 16Gb DDR4 SDRAM
• Density Organization: 1Gb x16
• Package: 96‑ball FBGA (code TB)
• Speed Grade: ‑062E (DDR4‑3200)
• Revision: F
• Packaging: Tape & Reel (TR)
• Compliance: RoHS compliant, lead‑free
• Document Revision: Rev. H (Aug 2021)

2. Core Specifications

• Memory Architecture: 8 internal banks (2 bank groups × 4 banks each)
• Prefetch: 8n prefetch DDR architecture
• Data Rate: 3200 MT/s
• Clock Cycle Time: 0.625 ns
• CAS Latency (CL): 22
• Target Timing: 22‑22‑22 (CL‑RCD‑RP)

3. Electrical Characteristics

• Core Supply Voltage (VDD/VDDQ): 1.2V ±60 mV
• Boost Voltage (VPP): 2.5V −125 mV / +250 mV
• Reference Voltage: On‑die internal VREFDQ generation
• I/O Type: 1.2V pseudo open‑drain

4. Operating Conditions

• Case Temperature (TC): 0°C to +95°C (commercial grade)
• Refresh:

5. Package & Mechanical

• Package Type: 96‑ball FBGA (TB)
• Dimensions: 7.5 mm × 13 mm
• Mounting: Surface mount
• Solder Alloy: SAC305
• Ball Pitch: Standard DDR4 fine pitch

6. Key Features

• JEDEC JESD79‑4 compliant
• Differential clock (CK_t/CK_c)
• Programmable burst length: BL8 / BC4 (on‑the‑fly)
• Burst type: Sequential or interleaved
• On‑die termination (ODT): Nominal, park, dynamic modes
• Data bus inversion (DBI) & data mask (DM)
• Write leveling & command/address latency (CAL)
• CA parity & write CRC support
• Per‑DRAM addressability (PDA)
• Temperature‑controlled refresh (TCR)
• Low‑power auto self‑refresh (LPASR)
• Fine granularity refresh
• ZQ calibration for output driver
• Hardware RESET_n
• Multi‑purpose register (MPR) for calibration/test
• sPPR / hPPR post‑package repair support

7. Timing Parameters (‑062E, DDR4‑3200)

• tAA: 13.75 ns
• tRCD: 13.75 ns
• tRP: 13.75 ns
• Read Latency (RL): CL + AL = 22
• Write Latency (WL): CWL + AL = 16

8. Reliability & Quality

• 100k erase/write cycles per block
• Data retention: Up to 20 years at 55°C
• ECC support by host controller
• Designed for industrial and embedded longevity

9. Target Applications

• Desktop/notebook computing
• Consumer electronics
• Embedded systems
• High‑speed memory subsystems
• Networking and storage