Micron MT40A1G8SA-062E IT:E 8Gb DDR4 SDRAM – Complete Attachment Summary

1. Basic Identification

• Manufacturer: Micron Technology, Inc.
• Part Number: MT40A1G8SA-062E IT:E
• Device Type: 8Gb CMOS DDR4 SDRAM
• Organization: 1Gb × 8 (1G x8)
• Data Width: 8-bit
• Speed Grade: -062E (DDR4–3200)
• Temperature Grade: Industrial (IT)
• Package: 78‑ball FBGA (WE: 8 mm × 12 mm)
• Compliance: RoHS‑compliant, halogen‑free, lead‑free
• Revision: Based on Rev. N (06/18)

2. Key Features

• Core voltage: VDD = VDDQ = 1.2 V ± 60 mV
• Pump voltage: VPP = 2.5 V (−125 mV / +250 mV)
• On‑die adjustable VREFDQ generation
• 1.2 V pseudo open‑drain I/O
• 8n‑bit prefetch architecture
• 16 internal banks (4 bank groups × 4 banks)
• Programmable burst length: 4/8 (sequential/interleave)
• Dynamic ODT (RTT_NOM, RTT_WR, RTT_PARK)
• Write leveling, ZQ calibration, write CRC
• Data bus inversion (DBI, x8 only)
• Command/address parity & CA latency (CAL)
• Self refresh, low‑power auto self refresh (LPASR)
• Temperature‑controlled refresh (TCR)
• Fine granularity refresh, per‑DRAM addressability (PDA)
• Multipurpose register (MPR) for test & calibration
• Post‑package repair: sPPR, hPPR

3. Speed & Timing Parameters

• Data Rate: 3200 MT/s
• Cycle Time: tCK = 0.625 ns
• CAS Latency: CL = 22
• Timing: CL–tRCD–tRP = 22–22–22
• tCK (MIN): 0.625 ns
• Access Time: ~13.75 ns
• tRAS: 39.75 ns
• tRC: 61.25 ns

4. Electrical Specifications

Recommended Operating Conditions

表格

Absolute Maximum Ratings

• VDD/VDDQ: −0.3 V ~ 1.5 V
• VPP: −0.3 V ~ 3.0 V
• Input/Output voltage: −0.3 V ~ 1.5 V

5. Temperature & Refresh

• Operating Case Temp (TC): −40 °C ~ +95 °C
• Storage Temp: −55 °C ~ +105 °C
• Refresh:
• tRFC: 350 ns (normal); 260 ns (2x); 160 ns (4x)

6. Bank & Address Mapping (1Gb ×8)

• Bank groups: 4
• Banks per group: 4
• Row address: A[15:0] (64K)
• Column address: A[9:0] (1K)
• Page size: 1 KB
• Address mapping: BG[1:0], BA[1:0], A[15:0] (row), A[9:0] (column)

7. Package & Mechanical

• Package type: 78‑ball FBGA (WE marking)
• Outline: 8.0 mm × 12.0 mm
• Ball pitch: 0.45 mm
• Solder ball: SAC302
• Package thickness: 0.34 ± 0.05 mm (post‑reflow)
• Mounting: Surface‑mount

8. Key Functions & Modes

• DLL enable/disable & reset
• Gear‑down mode (1/2, 1/4 rate)
• Read/write preamble (1tCK / 2tCK)
• Read preamble training
• Power‑down modes (active/precharge)
• Maximum power‑saving mode (MPSM)
• Connectivity test (CT) mode
• CA parity persistent error mode
• Internal VREF monitoring

9. Reliability & Compliance

• RoHS compliant
• Halogen‑free
• Lead‑free assembly
• Industrial‑grade quality
• JEDEC JESD79‑4 compliant