Micron LPDDR4 SDRAM – MT53E1G32D2FW‑046 WT:B Full Specification Summary

1. Basic Identification

• Manufacturer: Micron Technology Inc.
• Part Number: MT53E1G32D2FW‑046 WT:B
• Product Family: Mobile LPDDR4 / LPDDR4X SDRAM
• Document: Rev. G (May 2022) – Z42M embedded LPDDR4X/LPDDR4 datasheet
• Status: Mass production
• Application: Industrial, embedded, consumer mobile, high‑reliability systems

2. Core Memory Specifications

• Memory Type: Volatile DRAM – Mobile LPDDR4 SDRAM
• Total Density: 32 Gbit (4 GB)
• Memory Organization: 1G x 32 (2 channels × 16 I/O per channel)
• Die Configuration: Dual‑die, dual‑channel
• Architecture: 16n prefetch DDR; 8 banks per channel
• Speed Grade: ‑046
• Clock Frequency: 2133 MHz
• Data Rate per Pin: 4266 Mb/s
• Max Bandwidth: Up to 8.5 GB/s per die

3. Timing Parameters (‑046 Speed Grade)

• Read Latency (RL):
• Write Latency (WL): 18 (Set A)
• Burst Length (BL): Programmable 16 / 32
• Refresh Timing:

4. Electrical Characteristics

• Supply Voltages:
• Power Features:

5. Package & Mechanical

• Package Type: 200‑ball TFBGA (package code FW)
• Dimensions: 10.0 mm × 14.5 mm × 1.1 mm
• Solder Balls: 200× Ø0.436 mm (reflowed on Ø0.40 mm SMD pads)
• Mounting: Surface mount
• Solder Alloy: SACQ (Sn‑4Ag‑0.5Cu‑3Bi‑0.05Ni)
• Marking Code: D9ZQX

6. Operating Conditions

• Temperature Grade: WT (commercial/industrial extended)
• Operating Temperature: ‑25°C to +85°C (TC)
• RoHS Compliance: RoHS compliant, lead‑free “green” package

7. Key Features

• JEDEC compliant LPDDR4 / LPDDR4X
• Differential CK and DQS; supports single‑ended CK/DQS
• Bidirectional data strobe per byte lane
• Programmable read/write latencies and burst lengths
• Per‑bank refresh for concurrent operation
• Data Bus Inversion (DBI) and Data Mask (DM)
• Hardware RESET_n
• Command queue, HPI, BKOPS support
• ZQ calibration for impedance control
• Internal VREF calibration for CA and DQ
• Post‑package repair (PPR) support
• Clock stop and frequency change support

8. Reliability & Compliance

• ECC and internal block management
• High shock and vibration resistance
• Designed for long‑term embedded use
• Micron quality and reliability standards

9. Target Applications

• Industrial embedded systems
• Mobile computing & tablets
• Automotive infotainment (non‑AEC‑Q version)
• High‑performance IoT gateways
• Portable industrial terminals