Micron Technology Inc. MT62F2G32D4DS-023 WT: C

View All Display Drivers by Micron Technology Inc.

Part Number:
MT62F2G32D4DS-023 WT: C
Manufacturer:
Micron Technology Inc.
Category:
Display Drivers
RoHs:
Non-RoHS Compliant
Datasheet:
Description:
Low-power LPDDR5X architecture for high performance and energy efficiency
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Overview

MT62F2G32D4DS-023 WT:C – Product Information Summary

1. Basic Identification

Manufacturer: Micron Technology Inc.
Part Number: MT62F2G32D4DS-023 WT:C
Product Category: DRAM – Mobile LPDDR5/LPDDR5X SDRAM
Part Status: Sampling (Engineering/Pre-production)Micron Technology
RoHS Compliance: Compliant
Origin: Taiwan (final assembly)

2. Core Memory Specifications

Parameter	Value
Memory Density	64 Gbit (8 GB)
Organization	2G × 32-bit (2 Gigabits per bank × 32 data I/O)
Memory Type	Mobile LPDDR5 / LPDDR5X SDRAM
Max Clock Frequency	4.266 GHz
Data Rate (MT/s)	8533 MT/s (per pin)
Max Bandwidth	Up to 17.1 GB/s per channel
CAS Latency (CL)	Programmable

3. Electrical Characteristics

Supply Voltages:
Interface: LVSTL 0.5 V I/O standard

4. Package & Physical Details

Package Type: 315-ball TFBGA (Thin Fine-Pitch Ball Grid Array)
Package Dimensions: 12.40 × 15.00 × 1.10 mm
Mounting: Surface Mount (SMD)
FBGA Code: Z8CTM / Z8DKG / D8CTN / D8DKH (variant-dependent)Micron Technology

5. Environmental Specifications

Operating Temperature Range: -25°C to +85°C
Storage Temperature: Typically -55°C to +125°C (standard for Micron DRAM)
Thermal Resistance: Refer to datasheet for detailed values

6. Key Features

Low-power LPDDR5X architecture for high performance and energy efficiency
Selectable CKR (WCK:CK = 2:1 or 4:1) for flexible timing configurations
Programmable CAS latency (CL) for system optimization
High data throughput (8533 MT/s) for flagship mobile and thin-client devices
Compact TFBGA package for space-constrained designs
Green/RoHS-compliant packaging

7. Target Applications

Flagship smartphones and high-end mobile devices
Thin and light laptops / 2-in-1 PCs
Tablets, wearables, and portable electronics
Industrial mobile computing and IoT edge devices
Automotive infotainment and ADAS systems (non-automotive grade variant)

8. Ordering & Availability Notes

WT:C: Temperature grade (-25°C to +85°C) and package marking codeMicron Technology
Lead Time: Typically 2–3 weeks for sampling; check with Micron or authorized distributors
Packaging: Tray or tape-and-reel (contact supplier for exact packaging)
Distributor Part Numbers: e.g., Farnell 4050912

9. Documentation

Datasheet: Preliminary/Production datasheet for 315-ball x32 LPDDR5X SDRAM (Y42M/Y52P series)Micron Technology
Application Notes: Thermal management, PCB layout, and power supply design guidelines
ECAD Models: Available for PCB design integration (contact distributor)

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