MX25L3233FM2I-08G: 3V, 32Mb Serial Flash Memory

General Description

The MX25L3233FM2I-08G is a 3V, 32Mb Serial NOR Flash memory device from Macronix International Co., Ltd. It is designed for high-performance and low-power applications, supporting various serial I/O modes and advanced features.

Key Features

• Memory Density: 32Mb (4,194,304 bytes)
• Operating Voltage: 2.65V to 3.6V
• Clock Frequency: Up to 133 MHz
• Temperature Range: Industrial grade (-40°C to 85°C)
• Package Type: 8-pin SOP (200mil)
• Program/Erase Cycles: Up to 100,000 cycles
• Data Retention: 20 years at 55°C
• Protection Features: Block lock protection, 4K-bit secured OTP, and hardware/software protection modes
• Performance Enhance Mode: XIP (execute-in-place) mode available

Memory Organization

• Structure: 32,768 sectors of 1,024 bytes each
• Blocks:128 blocks of 32,768 bytes (32KB) each64 blocks of 65,536 bytes (64KB) each
• Addressing: 3-byte addresses for up to 16,777,216 bytes (16MB)

Command Set

The MX25L3233FM2I-08G supports a wide range of commands, including:

• Read Operations: Normal read, fast read, dual read, quad read
• Program Operations: Page program, quad page program
• Erase Operations: Sector erase, block erase (32KB, 64KB), chip erase
• Status and Configuration: Read status register, write status register, read configuration register
• Advanced Features: Program suspend/resume, erase suspend/resume, deep power-down mode, burst read

Pin Configuration

8-pin SOP (200mil)

• CS#: Chip Select
• SI/SIO0: Serial Data Input (for 1x I/O)/Serial Data Input & Output (for 2x I/O mode and 4x I/O mode)
• SO/SIO1: Serial Data Output (for 1x I/O)/Serial Data Input & Output (for 2x I/O mode and 4x I/O mode)
• SCLK: Clock Input
• WP#/SIO2: Write Protection Active Low or Serial Data Input & Output (for 4x I/O mode)
• HOLD#/SIO3: To pause the device without deselecting the device or Serial Data Input/Output for 4x I/O mode
• VCC: +3.0V Power Supply
• GND: Ground

Electrical Specifications

• Standby Current (ISB1): 10 uA typical, 50 uA maximum
• Deep Power-Down Current (ISB2): 3 uA typical, 20 uA maximum
• Read Current (ICC1): 2.5 mA typical, 5 mA maximum (50MHz), 10 mA typical, 17 mA maximum (133MHz)
• Program Current (ICC2): 10 mA typical, 15 mA maximum
• Erase Current (ICC4): 10 mA typical, 15 mA maximum
• Input Voltage (VIL, VIH): -0.5V to VCC+0.4V
• Output Voltage (VOL, VOH): VOL ≤ 0.4V, VOH ≥ VCC-0.2V

Timing Specifications

• Clock Frequency (fSCLK): Up to 133 MHz
• Clock High Time (tCH): 9 ns (≤ 50MHz), 45% x (1/fSCLK) ( > 50MHz)
• Clock Low Time (tCL): 9 ns (≤ 50MHz), 45% x (1/fSCLK) ( > 50MHz)
• Clock Rise/Fall Time (tCLCH, tCLCL): 0.1 V/ns
• CS# Active Setup Time (tSLCH): 4 ns
• CS# Not Active Hold Time (tCHSL): 4 ns
• Data In Setup Time (tDVCH): 2 ns
• Data In Hold Time (tCHDX): 3 ns

Operating Conditions

• Ambient Operating Temperature: Industrial grade (-40°C to 85°C)
• Storage Temperature: -65°C to 150°C
• Power-Up/Down: Ensure VCC reaches the minimum level before selecting the device

Ordering Information

• Part Number: MX25L3233FM2I-08G
• Package: 8-pin SOP (200mil)
• Clock Frequency: 133 MHz
• Temperature Range: -40°C to 85°C

Package Dimensions

8-pin SOP (200mil)

• A: 0.10 mm to 1.75 mm
• A1: 0.15 mm typical
• A2: 1.35 mm typical
• b: 0.36 mm typical
• C: 4.77 mm to 5.03 mm
• D: 5.80 mm to 6.20 mm
• E: 3.80 mm to 4.00 mm
• E1: 1.27 mm typical
• e: 0.46 mm to 0.86 mm
• L: 0.85 mm typical
• L1: 1.05 mm typical
• S: 0.54 mm typical
• Θ: 5° to 8°