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SanDisk SDINBDG4-8G-XA
- Part Number:
SDINBDG4-8G-XA
- Manufacturer:
- Category:
- RoHs:
Non-RoHS Compliant - Datasheet:
- Description:
eMMC 8GB iNAND 7250 Auto. eMMC 5.1 -40C to 85C
- In stock 0
Western Digital SDINBDG4‑8G‑XA3 Comprehensive Product Summary
1. Basic Device Information
- Full Part Number: SDINBDG4‑8G‑XA3
- Product Line: Western Digital iNAND EM122 Automotive e.MMC
- Memory Type: Automotive‑grade managed NAND flash storage
- Capacity: 8GB (1GB = 1,000,000,000 bytes)
- Interface: e.MMC 5.1 HS400
- Qualification: AEC‑Q100 qualified
- Document: Product Brief – Automotive Embedded Storage Solutions (Sep 2023)
- Status: Mass production
2. Core Features
- Automotive‑grade reliability: Enhanced MLC, advanced ECC, wear leveling, bad block management
- Voltage: Core VCC 2.7V–3.6V; host I/O 1.7V–1.95V or 2.7V–3.6V
- Temperature Grade: Automotive Grade 3; operating temperature −40°C to +85°C
- Automotive Features: Health status monitor, enhanced power‑failure protection, auto/manual refresh, fast boot, EUDA, configurable boot/RPMB partitions
- Firmware: Full memory management with ECC, wear leveling, bad block handling
- Compliance: ISO 26262 aligned, PPAP support, RoHS compliant
3. Performance Specifications
| Parameter | Value |
|---|---|
| Sequential Read | 300 MB/s |
| Sequential Write | 30 MB/s |
| Random Read | 10,000 IOPS |
| Random Write | 7,000 IOPS |
| Data Retention | 15 years @ 55°C (fresh condition) |
4. Physical & Packaging Data
- Package: 153‑ball FBGA
- Dimensions: 11.5 mm × 13 mm × 0.8 mm
- Mounting: Surface‑mount (SMT)
- Packaging: Tape‑and‑reel
- Moisture Sensitivity: MSL compliant
5. Recommended Operating Conditions
- Supply Voltage (VCC): 2.7V to 3.6V
- Host I/O Voltage (VCCQ): 1.7V–1.95V or 2.7V–3.6V
- Operating Case Temperature: −40°C to +85°C
- Interface: e.MMC 5.1 HS400, 8-bit parallel
6. Reliability & Quality
- Qualification: AEC‑Q100
- Documentation: Full PPAP support
- Manufacturing: Low DPPM, zero‑defect strategy, enhanced process controls
- Life Cycle: Extended PCN/EOL notifications
- Vertical Integration: In‑house design, manufacturing, assembly, test, and reliability monitoring
7. Target Automotive Applications
- Infotainment & navigation systems
- ADAS
- HD mapping
- V2V/V2I communication
- Digital instrument clusters
- Event data recorders (EDR)
- Telematics & OTA update modules
- Autonomous driving systems
8. Ordering & Identification
- Part Number: SDINBDG4‑8G‑XA3
- Capacity Mark: 8G
- Temperature Code: XA3 = −40°C to 85°C
- Package Code: Standard 11.5×13×0.8 mm FBGA
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