AMC1100DWV Package Materials Information

Overview

The AMC1100DWV is a precision isolation amplifier offered in a SOIC (DWV) package with 8 pins. This document provides comprehensive details about its packaging materials, dimensions, and related specifications to assist in design and manufacturing processes.

Package Details

• Package Type: SOIC (DWV)
• Pins: 8
• Status: Active Production
• Material Type: Production
• RoHS Compliance: Yes
• Lead Finish/Ball Material: NIPDAU
• Moisture Sensitivity Level (MSL): Level-2-260C-1
• Operating Temperature Range: -40°C to +105°C
• Part Marking: AMC1100

Tape and Reel Information

• Reel Diameter: 330.0 mm
• Reel Width (W1): 16.0 mm
• Carrier Tape Dimensions:A0: 16.4 mmB0: 12.15 mmK0: 6.2 mmP1: 3.05 mmW: 16.0 mm
• SPQ (Standard Packing Quantity): 1000
• Pin1 Quadrant: Q1

Tube Information

• Tube Length (L): 505.46 mm
• Tube Width (W): 13.94 mm
• Tube Height (T): 4826 µm
• Alignment Groove Width (B): 6.6 mm

Package Outline

• Height: 2.8 mm max
• Length: 7.6 mm
• Width: 5.95 mm
• Lead Length: 1.27 mm
• Lead Width: 0.51 mm
• Lead Thickness: 0.31 mm

Board Layout and Stencil Design

• Land Pattern:Clearance/Creepage: 9.1 mm nominalHV/Isolation Option: 7.1 mm clearance/creepage
• Stencil Design:Based on 0.125 mm thick stencilNominal dimensions provided for accurate solder paste application

Important Notice

Texas Instruments provides this information "AS IS" and with all faults, and disclaims all warranties, express and implied, including without limitation any implied warranties of merchantability, fitness for a particular purpose, or non-infringement of third-party intellectual property rights. The information is intended for skilled developers designing with TI products. You are solely responsible for selecting the appropriate TI products for your application, designing, validating, and testing your application, and ensuring your application meets applicable standards and any other safety, security, regulatory, or other requirements.