Infineon Technologies IRF540NPBF

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Specifications
Type
Paramete
Type
Paramete
Input Capacitance (Ciss) (Max) @ Vds
1960 pF @ 25 V
Vgs (Max)
±20V
Grade
-
Qualification
-
Gate Charge (Qg) (Max) @ Vgs
71 nC @ 10 V
Technology
MOSFET (Metal Oxide)
FET Feature
-
Power Dissipation (Max)
130W (Tc)
Vgs(th) (Max) @ Id
4V @ 250µA
Package / Case
TO-220-3
Supplier Device Package
TO-220AB
Mounting Type
Through Hole
Current - Continuous Drain (Id) @ 25°C
33A (Tc)
Operating Temperature
-55°C ~ 175°C (TJ)
Drain to Source Voltage (Vdss)
100 V
Drive Voltage (Max Rds On, Min Rds On)
10V
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
44mOhm @ 16A, 10V
Overview

IRF540NPBF Complete Datasheet Summary


1. Basic Identification


ParameterValue
ManufacturerInfineon / International Rectifier
Part NumberIRF540NPBF
TypeN‑Channel HEXFET® Power MOSFET
PackageTO‑220AB (Through‑Hole)
Lead StatusLead‑Free (PbF)
RoHSCompliant
Product StatusActive
QualificationIndustrial

2. Absolute Maximum Ratings (Tc = 25°C)

ParameterValueUnit
VDS100V
VGS±20V
ID (Continuous)33A
ID (at 100°C)23A
IDM (Pulsed Drain Current)110A
PD (Power Dissipation)130W
Linear Derating Factor0.87W/°C
IAR (Avalanche Current)16A
EAR (Repetitive Avalanche Energy)13mJ
dv/dt7.0V/ns
TJ Operating Range-55 to +175°C
TSTG Storage Range-55 to +175°C
Soldering Temperature300 (1.6mm from case)°C

3. Thermal Characteristics

ParameterValueUnit
RθJC (Junction‑to‑Case)1.15°C/W
RθCS (Case‑to‑Sink)0.50°C/W
RθJA (Junction‑to‑Ambient)62°C/W

4. Electrical Characteristics (TJ = 25°C)

ParameterMinTypMaxUnitCondition
V(BR)DSS100VVGS = 0 V, ID = 250 µA
VGS(th)2.04.0VVDS = VGS, ID = 250 µA
RDS(on)44VGS = 10 V, ID = 16 A
gfs21SVDS = 50 V, ID = 16 A
IDSS25µAVDS = 100 V, VGS = 0 V
IDSS (150°C)250µAVDS = 80 V, VGS = 0 V
IGSS±100nAVGS = ±20 V

5. Dynamic Characteristics

ParameterValueUnitCondition
Qg (Total Gate Charge)71nCVDS = 80 V, ID = 16 A
Qgs (Gate‑Source Charge)14nCVGS = 10 V
Qgd (Miller Charge)21nCVGS = 10 V
td(on)11nsVDD = 50 V
tr35nsVDD = 50 V
td(off)39nsVDD = 50 V
tf35nsVDD = 50 V
Ciss (Input Capacitance)1960pFVDS = 25 V, VGS = 0 V
Coss (Output Capacitance)250pFVDS = 25 V, VGS = 0 V
Crss (Reverse Transfer Capacitance)40pFVDS = 25 V, VGS = 0 V

6. Body Diode Characteristics


ParameterValueUnitCondition
IS (Continuous Diode Current)33A
ISM (Pulsed Diode Current)110A
VSD (Diode Forward Voltage)1.2VIS = 16 A
trr (Reverse Recovery Time)115nsIF = 16 A
Qrr (Reverse Recovery Charge)505nCdi/dt = 100 A/µs

7. Avalanche Characteristics


ParameterValueUnitCondition
EAS (Single‑Pulse Avalanche Energy)185mJIAS = 16 A, L = 1.5 mH
EAR (Repetitive Avalanche Energy)13mJ

8. Key Features


  • N‑channel enhancement mode power MOSFET
  • VDSS = 100 V, ultra‑low RDS(on) = 44 mΩ max
  • High current capability: 33 A continuous
  • Fast switching speed
  • Dynamic dv/dt rating
  • Fully avalanche rated
  • 175°C maximum junction temperature
  • Lead‑free, RoHS compliant package
  • Industry‑standard TO‑220AB package

9. Typical Applications


  • Switching power supplies
  • DC‑DC converters
  • Motor drive & control
  • Power inverters
  • Solar inverters
  • UPS systems
  • Industrial power control
  • Automotive power systems


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