Infineon Technologies IRF840PBF


- Part Number:
IRF840PBF
- Manufacturer:
- Category:
- RoHs:
Non-RoHS Compliant - Datasheet:
- Description:
MOSFET N-CH 500V 8A TO220AB
- In stock 0
TFDU4301‑TT3 – Complete Datasheet Summary
1. Basic Identification
- Full Part Number: TFDU4301‑TT3
- Manufacturer: Vishay Semiconductors
- Device Type: Infrared Transceiver Module for IrDA® SIR
- Data Rate: Up to 115.2 kbit/s
- Communication Range: Up to 1 meter
- Mounting Style: Top‑view surface mount
- Packaging: Tape‑and‑reel, 2500 pieces per reel
- Compliance: RoHS compliant, halogen‑free, green
- Weight: 77 mg
- Document Revision: Rev. 1.9 (10‑Apr‑2024), Document Number: 81965
2. Key Features
- Fully compliant with IrDA physical layer specification
- Ultra‑low power consumption: typ. 70 µA in idle, < 1 µA in shutdown
- Integrated PIN photodiode, IR emitter, and low‑power control IC
- Built‑in over‑current protection (TXD > 100 μs)
- Push‑pull RXD output (no external pull‑up/down required)
- Wide supply voltage range: 2.4 V to 5.5 V
- Eye‑safe: Class 1 (IEC 60825‑1), exempt (IEC 62471)
- ESD protection: 2 kV (JESD22‑A114)
- Reflow solderable, MSL 4 moisture sensitivity level
3. Mechanical Dimensions
- Module Size: 3.1 mm (H) × 8.5 mm (L) × 2.5 mm (W)
- Package: 8‑pin SMD, top‑view
- Pin Pitch: 0.95 mm
- Tape Width: 16 mm
- Reel Dimensions: 330 mm (max diameter), 16 mm tape width
- Tolerance: ±0.2 mm (unless otherwise noted)
4. Pin Configuration
| Pin | Name | Function | I/O Type |
|---|---|---|---|
| 1 | VCC2 | IRED anode power supply | Power |
| 2 | IRED_C | IRED cathode | Output |
| 3 | TXD | Serial transmit data input | Input |
| 4 | RXD | Received data output | Output |
| 5 | SD | Shutdown control (active high) | Input |
| 6 | VCC1 | Logic supply voltage | Power |
| 7 | NC | Not connected | — |
| 8 | GND | Ground | Power |
5. Absolute Maximum Ratings
| Parameter | Value | Unit |
|---|---|---|
| VCC1, VCC2 | −0.5 to +6 | V |
| Input voltage (TXD, SD) | −0.5 to +6 | V |
| RXD output voltage | −0.5 to VCC1+0.5 | V |
| IRED DC current | 85 | mA |
| Repetitive pulsed IRED current | 430 | mA |
| Power dissipation | 250 | mW |
| Operating / Storage temperature | −25 to +85 | °C |
| Junction temperature | 125 | °C |
| Soldering peak temperature | 260 | °C |
6. Electrical Characteristics
(Tamb = 25°C, VCC1 = VCC2 = 2.4–5.5 V)
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Supply voltage | 2.4 | — | 5.5 | V |
| Data rate | 9.6 | — | 115.2 | kbit/s |
| Idle supply current (ICC1) | 40 | 70 | 110 | µA |
| Shutdown current (ISD) | 0.01 | — | 1 | µA |
| Input low voltage (TXD, SD) | — | — | 0.4 | V |
| Input high voltage (TXD) | VCC1−0.5 | — | 6 | V |
| Input high voltage (SD) | VCC1−0.3 | — | 6 | V |
| RXD output low voltage | — | — | 0.15×VCC1 | V |
| RXD output high voltage | 0.8×VCC1 | — | — | V |
7. Optoelectronic Characteristics
Receiver
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Minimum irradiance | — | 20 | 50 | mW/m² |
| Rise/fall time (RXD) | 10 | 30 | 80 | ns |
| Output pulse width | 1.7 | 2.2 | 3 | µs |
| Receiver startup delay | — | 100 | 500 | µs |
Transmitter
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| IRED forward current | 200 | 300 | 430 | mA |
| IRED forward voltage | 1.4 | 1.8 | 1.9 | V |
| Radiant intensity | 50 | 200 | 400 | mW/sr |
| Peak wavelength | 870 | — | 910 | nm |
| Half intensity angle | — | ±30 | — | ° |
8. Truth Table
| SD | TXD | Optical Input | RXD | Transmitter | Mode |
|---|---|---|---|---|---|
| High | X | X | Floating (weak pull‑up) | Off | Shutdown |
| Low | High | X | Low | On | Transmitting |
| Low | Low | Above threshold | Low | Off | Receiving |
| Low | Low | Overload | Undefined | Off | Overload |
9. Recommended Application Circuit
- VCC1 / VCC2: 2.4–5.5 V
- C1: 4.7 µF (fast capacitor near supply pins)
- C2: 0.1 µF ceramic (close to device)
- R2: 47 Ω (optional supply filter)
- R1: Optional IRED current limiter
10. Packaging & Ordering
- Part: TFDU4301‑TT3
- Mount: Top‑view SMD
- Quantity: 2500 pcs per reel
- Tape: 16 mm embossed tape
- MSL: Level 4 (72‑hour floor life at 30°C/60% RH)
- Dry packing: Sealed anti‑humidity bag
11. Typical Applications
- Short‑range IrDA wireless data transfer
- Battery‑powered consumer electronics
- Industrial and medical IR communication
- RF‑sensitive environments
- Mobile accessories and peripherals
12. Reliability & Safety
- ESD: 2 kV (HBM)
- Latch‑up: ±100 mA
- Thermal resistance: RthJA = 300 K/W
- Reflow soldering: max 260°C, ≤20 s above liquidus
- Baking condition: 192 h at 40°C or 96 h at 60°C (if moisture‑exposed)
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Infineon Technologies

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