Infineon Technologies IRF840PBF

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Specifications
Type
Paramete
Type
Paramete
Grade
-
Current - Continuous Drain (Id) @ 25°C
8A (Tc)
Drive Voltage (Max Rds On, Min Rds On)
10V
Input Capacitance (Ciss) (Max) @ Vds
1300 pF @ 25 V
Drain to Source Voltage (Vdss)
500 V
Power Dissipation (Max)
125W (Tc)
Rds On (Max) @ Id, Vgs
850mOhm @ 4.8A, 10V
Qualification
-
Vgs (Max)
±20V
Technology
MOSFET (Metal Oxide)
Package / Case
TO-220-3
Vgs(th) (Max) @ Id
4V @ 250µA
Operating Temperature
-55°C ~ 150°C (TJ)
Gate Charge (Qg) (Max) @ Vgs
63 nC @ 10 V
Mounting Type
Through Hole
Supplier Device Package
TO-220AB
FET Type
N-Channel
FET Feature
-
Overview

TFDU4301‑TT3 – Complete Datasheet Summary


1. Basic Identification


  • Full Part Number: TFDU4301‑TT3
  • Manufacturer: Vishay Semiconductors
  • Device Type: Infrared Transceiver Module for IrDA® SIR
  • Data Rate: Up to 115.2 kbit/s
  • Communication Range: Up to 1 meter
  • Mounting Style: Top‑view surface mount
  • Packaging: Tape‑and‑reel, 2500 pieces per reel
  • Compliance: RoHS compliant, halogen‑free, green
  • Weight: 77 mg
  • Document Revision: Rev. 1.9 (10‑Apr‑2024), Document Number: 81965

2. Key Features


  • Fully compliant with IrDA physical layer specification
  • Ultra‑low power consumption: typ. 70 µA in idle, < 1 µA in shutdown
  • Integrated PIN photodiode, IR emitter, and low‑power control IC
  • Built‑in over‑current protection (TXD > 100 μs)
  • Push‑pull RXD output (no external pull‑up/down required)
  • Wide supply voltage range: 2.4 V to 5.5 V
  • Eye‑safe: Class 1 (IEC 60825‑1), exempt (IEC 62471)
  • ESD protection: 2 kV (JESD22‑A114)
  • Reflow solderable, MSL 4 moisture sensitivity level

3. Mechanical Dimensions


  • Module Size: 3.1 mm (H) × 8.5 mm (L) × 2.5 mm (W)
  • Package: 8‑pin SMD, top‑view
  • Pin Pitch: 0.95 mm
  • Tape Width: 16 mm
  • Reel Dimensions: 330 mm (max diameter), 16 mm tape width
  • Tolerance: ±0.2 mm (unless otherwise noted)

4. Pin Configuration

PinNameFunctionI/O Type
1VCC2IRED anode power supplyPower
2IRED_CIRED cathodeOutput
3TXDSerial transmit data inputInput
4RXDReceived data outputOutput
5SDShutdown control (active high)Input
6VCC1Logic supply voltagePower
7NCNot connected
8GNDGroundPower

5. Absolute Maximum Ratings

ParameterValueUnit
VCC1, VCC2−0.5 to +6V
Input voltage (TXD, SD)−0.5 to +6V
RXD output voltage−0.5 to VCC1+0.5V
IRED DC current85mA
Repetitive pulsed IRED current430mA
Power dissipation250mW
Operating / Storage temperature−25 to +85°C
Junction temperature125°C
Soldering peak temperature260°C

6. Electrical Characteristics

(Tamb = 25°C, VCC1 = VCC2 = 2.4–5.5 V)


ParameterMinTypMaxUnit
Supply voltage2.45.5V
Data rate9.6115.2kbit/s
Idle supply current (ICC1)4070110µA
Shutdown current (ISD)0.011µA
Input low voltage (TXD, SD)0.4V
Input high voltage (TXD)VCC1−0.56V
Input high voltage (SD)VCC1−0.36V
RXD output low voltage0.15×VCC1V
RXD output high voltage0.8×VCC1V

7. Optoelectronic Characteristics


Receiver


ParameterMinTypMaxUnit
Minimum irradiance2050mW/m²
Rise/fall time (RXD)103080ns
Output pulse width1.72.23µs
Receiver startup delay100500µs

Transmitter


ParameterMinTypMaxUnit
IRED forward current200300430mA
IRED forward voltage1.41.81.9V
Radiant intensity50200400mW/sr
Peak wavelength870910nm
Half intensity angle±30°

8. Truth Table

SDTXDOptical InputRXDTransmitterMode
HighXXFloating (weak pull‑up)OffShutdown
LowHighXLowOnTransmitting
LowLowAbove thresholdLowOffReceiving
LowLowOverloadUndefinedOffOverload

9. Recommended Application Circuit


  • VCC1 / VCC2: 2.4–5.5 V
  • C1: 4.7 µF (fast capacitor near supply pins)
  • C2: 0.1 µF ceramic (close to device)
  • R2: 47 Ω (optional supply filter)
  • R1: Optional IRED current limiter

10. Packaging & Ordering


  • Part: TFDU4301‑TT3
  • Mount: Top‑view SMD
  • Quantity: 2500 pcs per reel
  • Tape: 16 mm embossed tape
  • MSL: Level 4 (72‑hour floor life at 30°C/60% RH)
  • Dry packing: Sealed anti‑humidity bag

11. Typical Applications


  • Short‑range IrDA wireless data transfer
  • Battery‑powered consumer electronics
  • Industrial and medical IR communication
  • RF‑sensitive environments
  • Mobile accessories and peripherals

12. Reliability & Safety


  • ESD: 2 kV (HBM)
  • Latch‑up: ±100 mA
  • Thermal resistance: RthJA = 300 K/W
  • Reflow soldering: max 260°C, ≤20 s above liquidus
  • Baking condition: 192 h at 40°C or 96 h at 60°C (if moisture‑exposed)


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