NXP PMDXB1200UPEZ


- Part Number:
PMDXB1200UPEZ
- Manufacturer:
- Category:
- RoHs:
Non-RoHS Compliant - Datasheet:
- Description:
MOSFET 30V
- In stock 1,798,650
PMDXB1200UPEZ Product Information Summary
1. General Description
The PMDXB1200UPEZ is a dual P-channel enhancement mode Field-Effect Transistor (FET) developed by Nexperia. It adopts Trench MOSFET technology and is housed in a leadless ultra-small DFN1010B-6 (SOT1216) surface-mounted device (SMD) plastic package. With a compact form factor and reliable performance, it is designed for low-voltage, medium-current switching applications, complying with relevant industry standards and specifications.
2. Core Features and Benefits
- Low Threshold Voltage: Enables efficient switching control with low drive voltage requirements.
- Ultra-Compact Package: Measures 1.1 x 1.0 x 0.37 mm (DFN1010B-6/SOT1216), ideal for space-constrained designs.
- Trench MOSFET Technology: Delivers excellent electrical performance, including low on-state resistance and high switching speed.
- Robust ESD Protection: Withstands electrostatic discharge (ESD) greater than 2 kV (HBM), enhancing reliability in harsh environments.
- Dual Transistor Integration: Two independent P-channel MOSFETs in one package, reducing component count and PCB space.
3. Applications
- Relay driver circuits
- High-speed line driver applications
- High-side loadswitch implementations
- General-purpose switching circuits
4. Quick Reference Data (Per Transistor)
| Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| VDS | Drain-source voltage | Tj = 25 °C | - | - | -30 | V |
| VGS | Gate-source voltage | - | -8 | - | 8 | V |
| ID | Drain current | VGS = -4.5 V; Tamb = 25 °C [1] | - | - | -410 | mA |
| RDSon | Drain-source on-state resistance | VGS = -4.5 V; ID = -410 mA; Tj = 25 °C | - | 1.2 | 1.4 | Ω [1] Device mounted on an FR4 PCB (single-sided copper, tin-plated) with a 1 cm² drain mounting pad. |
5. Pinning Information
5.1 Pin Configuration (DFN1010B-6/SOT1216 Package)
| Pin Number | Symbol | Description |
|---|---|---|
| 1 | S1 | Source of Transistor 1 (TR1) |
| 2 | G1 | Gate of Transistor 1 (TR1) |
| 3 | D2 | Drain of Transistor 2 (TR2) |
| 4 | S2 | Source of Transistor 2 (TR2) |
| 5 | G2 | Gate of Transistor 2 (TR2) |
| 6 | D1 | Drain of Transistor 1 (TR1) |
| 7 | D1 | Drain of Transistor 1 (TR1) [Duplicate pin] |
| 8 | D2 | Drain of Transistor 2 (TR2) [Duplicate pin] |
5.2 Package Outline
- Type: DFN1010B-6 (SOT1216)
- Leadless plastic thermal enhanced ultra-thin small outline package
- Dimensions (mm, nominal): 1.1 (length) x 1.0 (width) x 0.37 (height)
- Pin 1 index area for easy orientation during assembly
6. Ordering Information
| Type Number | Package | Package Description | Version |
|---|---|---|---|
| PMDXB1200UPEZ | DFN1010B-6 | Plastic thermal enhanced ultra-thin small outline package; no leads; 6 terminals | SOT1216 |
7. Marking Information
- Marking Code: 11 10 00 (binary marking code)
- Reading Direction: Refer to the pin 1 indication mark on the package
- Mark-free area is provided for assembly and inspection
8. Limiting Values (Per Transistor, IEC 60134 Absolute Maximum Rating System)
| Symbol | Parameter | Conditions | Min | Max | Unit |
|---|---|---|---|---|---|
| VDS | Drain-source voltage | Tj = 25 °C | - | -30 | V |
| VGS | Gate-source voltage | - | -8 | 8 | V |
| ID | Continuous drain current | VGS = -4.5 V; Tamb = 25 °C [1] | - | -410 | mA |
| ID | Continuous drain current | VGS = -4.5 V; Tamb = 100 °C [1] | - | -260 | mA |
| IDM | Peak drain current | Tamb = 25 °C; single pulse; tp ≤ 10 µs | - | -1.7 | A |
| Ptot | Total power dissipation | Tamb = 25 °C [2] | - | 285 | mW |
| Ptot | Total power dissipation | Tsp = 25 °C [1] | - | 410 | mW |
| Ptot | Total power dissipation | - [Special condition] | - | 4030 | mW |
| IS | Source current (source-drain diode) | Tamb = 25 °C [1] | - | -410 | mA |
| Tj | Junction temperature | - | -55 | 150 | °C |
| Tamb | Ambient temperature | - | -55 | 150 | °C |
| Tstg | Storage temperature | - | -65 | 150 | °C [1] Device mounted on an FR4 PCB (single-sided copper, tin-plated) with a 1 cm² drain mounting pad.[2] Device mounted on an FR4 PCB (single-sided copper, tin-plated) with standard footprint. |
9. Thermal Characteristics
| Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Rth(j-a) | Thermal resistance (junction to ambient) | Free air [2] | - | 380 | 440 | K/W |
| Rth(j-a) | Thermal resistance (junction to ambient) | Free air [1] | - | 275 | 305 | K/W |
| Rth(j-sp) | Thermal resistance (junction to solder point) | - | - | 27 | 31 | K/W [1] Device mounted on an FR4 PCB (single-sided copper, tin-plated) with a 1 cm² drain mounting pad.[2] Device mounted on an FR4 PCB (single-sided copper, tin-plated) with standard footprint. |
10. Electrical Characteristics (Per Transistor, Tj = 25 °C Unless Stated Otherwise)
10.1 Static Characteristics
| Parameter | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Drain leakage current (IDSS) | VDS = -30 V; VGS = 0 V | - | - | -1 | µA |
| Gate leakage current (IGSS) | VGS = 8 V; VDS = 0 V | - | - | 5 | µA |
| Gate leakage current (IGSS) | VGS = -8 V; VDS = 0 V | - | - | -5 | µA |
| Gate leakage current (IGSS) | VGS = 4.5 V; VDS = 0 V | - | - | 1 | µA |
| Gate leakage current (IGSS) | VGS = -4.5 V; VDS = 0 V | - | - | -1 | µA |
| Gate leakage current (IGSS) | VGS = 2.5 V; VDS = 0 V | - | - | 100 | nA |
| Gate leakage current (IGSS) | VGS = -2.5 V; VDS = 0 V | - | - | -100 | nA |
| Drain-source on-state resistance (RDSon) | VGS = -4.5 V; ID = -410 mA | - | 1.2 | 1.4 | Ω |
| Drain-source on-state resistance (RDSon) | VGS = -4.5 V; ID = -410 mA; Tj = 150 °C | - | 2 | 2.4 | Ω |
| Drain-source on-state resistance (RDSon) | VGS = -2.5 V; ID = -320 mA | - | 1.7 | 2.3 | Ω |
| Drain-source on-state resistance (RDSon) | VGS = -1.8 V; ID = -80 mA | - | 2.1 | 3.1 | Ω |
| Drain-source on-state resistance (RDSon) | VGS = -1.5 V; ID = -10 mA | - | 3 | 5.1 | Ω |
| Forward transconductance (gfs) | VDS = -10 V; ID = -410 mA | - | 820 | - | mS |
| Gate-source threshold voltage (VGS(th)) | ID = -250 μA; VDS = VGS | - | - | - | V |
10.2 Dynamic Characteristics
| Parameter | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Total gate charge (QG) | VDS = -15 V; ID = -410 mA; VGS = -4.5 V | - | 0.7 | 1.2 | nC |
| Gate-source charge (QGS) | VDS = -15 V; ID = -410 mA; VGS = -4.5 V | - | 0.17 | - | nC |
| Gate-drain charge (QGD) | VDS = -15 V; ID = -410 mA; VGS = -4.5 V | - | 0.16 | - | nC |
| Input capacitance (Ciss) | VDS = -15 V; f = 1 MHz; VGS = 0 V | - | 43.2 | - | pF |
| Output capacitance (Coss) | VDS = -15 V; f = 1 MHz; VGS = 0 V | - | 5.9 | - | pF |
| Reverse transfer capacitance (Crss) | VDS = -15 V; f = 1 MHz; VGS = 0 V | - | 4.2 | - | pF |
| Turn-on delay time (td(on)) | VDS = -15 V; ID = -410 mA; VGS = -4.5 V; RG(ext) = 6 Ω | - | 3 | - | ns |
| Rise time (tr) | VDS = -15 V; ID = -410 mA; VGS = -4.5 V; RG(ext) = 6 Ω | - | 4 | - | ns |
| Turn-off delay time (td(off)) | VDS = -15 V; ID = -410 mA; VGS = -4.5 V; RG(ext) = 6 Ω | - | 14 | - | ns |
| Fall time (tf) | VDS = -15 V; ID = -410 mA; VGS = -4.5 V; RG(ext) = 6 Ω | - | 5 | - | ns |
10.3 Source-Drain Diode Characteristics
| Parameter | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Source-drain voltage (VSD) | IS = -410 mA; VGS = 0 V | - | -0.95 | -1.2 | V |
11. Soldering and Footprint
- Package Footprint: Designed for reflow soldering; refer to the recommended solder land dimensions (1.1 x 1.0 mm base with specific pad layouts for terminals).
- Soldering Guidelines: Follow standard SMD reflow soldering processes, ensuring proper thermal profiling to avoid package damage.
- PCB Mounting: Use the specified FR4 PCB with single-sided copper and tin-plating for optimal thermal and electrical performance.
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