BUK9K35-60RA Complete Supplementary Datasheet Summary

1. Basic Device Identification

• Full Part Number: BUK9K35-60RA
• Manufacturer: Nexperia
• Device Type: Dual N‑channel logic‑level MOSFET
• Technology: Repetitive Avalanche ASFET
• Qualification: AEC‑Q101 (automotive grade, 175 °C)
• Status: Active, Production
• Marking Code: 93560RA
• Package: LFPAK56D (SOT1205), 8‑pin dual gull‑wing

2. Key Specifications (Quick Reference)

• VDS: 60 V
• RDS(on): Max 35 mΩ @ VGS = 5 V, ID = 5 A, 25 °C
• Continuous ID: 22 A @ Tmb = 25 °C; 16 A @ 100 °C
• Ptot: 38 W @ Tmb = 25 °C
• Logic Level: VGS(th) typ 1.7 V (operates at 5 V drive)

3. Absolute Maximum Ratings

• Drain‑Source Voltage (VDS): 60 V
• Gate‑Source Voltage (VGS): ±10 V DC; ±15 V pulsed
• Drain Current (ID): 22 A continuous; 90 A pulsed (tp ≤ 10 µs)
• Power Dissipation (Ptot): 38 W
• Junction Temperature (TJ): −55 °C to 175 °C
• Storage Temperature (Tstg): −55 °C to 175 °C
• Soldering Temp (Tsld(M)): 260 °C peak
• Repetitive Avalanche Energy (EDS(AL)R): 28.6 mJ (ΔTJ ≤ 30 °C)
• Single‑pulse Avalanche Energy (EDS(AL)S): 19.5 mJ

4. Thermal Characteristics

• Rth(j‑mb) (junction to mounting base): 3.96 K/W (max)
• Rth(j‑a) (junction to ambient): 95 K/W (typ)

5. Static Electrical Characteristics

• V(BR)DSS: 60 V min @ ID = 250 µA, 25 °C
• VGS(th): 1.4–2.1 V @ ID = 1 mA, 25 °C
• IDSS: ≤1 µA @ VDS = 60 V, 25 °C; ≤500 µA @ 175 °C
• IGSS: ≤100 nA @ VGS = ±10 V
• RDS(on):

6. Dynamic Electrical Characteristics

• Total Gate Charge (QG(tot)): 7.8 nC typ @ VGS = 5 V
• Gate‑Drain Charge (QGD): 3 nC typ
• Input Capacitance (Ciss): 811 pF typ @ VDS = 25 V
• Turn‑On Delay (td(on)): 7.1 ns typ
• Rise Time (tr): 11.3 ns typ
• Turn‑Off Delay (td(off)): 14.9 ns typ
• Fall Time (tf): 10.6 ns typ
• Diode Forward Voltage (VSD): 0.78 V typ @ IS = 5 A
• Reverse Recovery Time (trr): 17.6 ns typ

7. Pin Configuration (LFPAK56D, Top View)

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8. Core Features

• Dual N‑channel in one compact package
• Logic‑level drive (5 V)
• AEC‑Q101 qualified to 175 °C
• Repetitive avalanche rated (1 Bn events)
• Copper‑clip LFPAK for high thermal performance
• Gull‑wing leads for AOI and assembly robustness
• Low RDS(on) and low QGD for high efficiency

9. Typical Applications

• 12 V / 24 V / 48 V automotive systems
• Repetitive avalanche inductive loads
• Engine & transmission control
• Automotive actuator drives
• Auxiliary load switching

10. Package Dimensions (LFPAK56D, SOT1205)

• Nominal size: 5.3 mm × 4.7 mm × 1.05 mm
• Pitch: 1.27 mm
• Gull‑wing leads for high manufacturability